公开(公告)号：US20120001308A1

公开(公告)日：2012-01-05

申请号：US13173248

申请日：2011-06-30

申请人： Keita Fukutani ,  Kuniaki Mamitsu ,  Yasushi Ookura ,  Masayoshi Nishihata ,  Hiroyuki Wado ,  Syun Sugiura

发明人： Keita Fukutani ,  Kuniaki Mamitsu ,  Yasushi Ookura ,  Masayoshi Nishihata ,  Hiroyuki Wado ,  Syun Sugiura

IPC分类号： H01L23/495 ,  H01L21/60

CPC分类号： H01L24/32 ,  H01L23/49524 ,  H01L23/49541 ,  H01L23/49562 ,  H01L23/49568 ,  H01L23/49575 ,  H01L24/29 ,  H01L24/33 ,  H01L24/37 ,  H01L24/40 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/291 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/371 ,  H01L2224/40245 ,  H01L2224/40247 ,  H01L2224/48247 ,  H01L2224/49175 ,  H01L2224/73221 ,  H01L2224/73263 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2924/00014 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2924/00

摘要： In a semiconductor module, a first heat sink is disposed on a rear surface of a first semiconductor chip constituting an upper arm, and a second heat sink is disposed on a front surface of the first semiconductor chip through a first terminal. A third heat sink is disposed on a rear surface of a second semiconductor chip constituting a lower arm, and a fourth heat sink is disposed on a front surface of the second semiconductor chip through a second terminal. A connecting part for connecting between the upper arm and the lower arm is integral with the first terminal, and is connected to the third heat sink while being inclined relative to the first terminal.

摘要翻译： 在半导体模块中，第一散热器设置在构成上臂的第一半导体芯片的后表面上，第二散热器通过第一端子设置在第一半导体芯片的前表面上。 第三散热器设置在构成下臂的第二半导体芯片的后表面上，第四散热器通过第二端子设置在第二半导体芯片的前表面上。 用于连接上臂和下臂的连接部分与第一端子成一体，并且相对于第一端子倾斜地连接到第三散热器。

公开(公告)号：US08497572B2

公开(公告)日：2013-07-30

申请号：US13173248

申请日：2011-06-30

申请人： Keita Fukutani ,  Kuniaki Mamitsu ,  Yasushi Ookura ,  Masayoshi Nishihata ,  Hiroyuki Wado ,  Syun Sugiura

发明人： Keita Fukutani ,  Kuniaki Mamitsu ,  Yasushi Ookura ,  Masayoshi Nishihata ,  Hiroyuki Wado ,  Syun Sugiura

IPC分类号： H01L23/34

CPC分类号： H01L24/32 ,  H01L23/49524 ,  H01L23/49541 ,  H01L23/49562 ,  H01L23/49568 ,  H01L23/49575 ,  H01L24/29 ,  H01L24/33 ,  H01L24/37 ,  H01L24/40 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/291 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/371 ,  H01L2224/40245 ,  H01L2224/40247 ,  H01L2224/48247 ,  H01L2224/49175 ,  H01L2224/73221 ,  H01L2224/73263 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2924/00014 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2924/00

摘要： In a semiconductor module, a first heat sink is disposed on a rear surface of a first semiconductor chip constituting an upper arm, and a second heat sink is disposed on a front surface of the first semiconductor chip through a first terminal. A third heat sink is disposed on a rear surface of a second semiconductor chip constituting a lower arm, and a fourth heat sink is disposed on a front surface of the second semiconductor chip through a second terminal. A connecting part for connecting between the upper arm and the lower arm is integral with the first terminal, and is connected to the third heat sink while being inclined relative to the first terminal.

摘要翻译： 在半导体模块中，第一散热器设置在构成上臂的第一半导体芯片的后表面上，第二散热器通过第一端子设置在第一半导体芯片的前表面上。 第三散热器设置在构成下臂的第二半导体芯片的后表面上，第四散热器通过第二端子设置在第二半导体芯片的前表面上。 用于连接上臂和下臂的连接部分与第一端子成一体，并且相对于第一端子倾斜地连接到第三散热器。

公开(公告)号：US08558375B2

公开(公告)日：2013-10-15

申请号：US13170475

申请日：2011-06-28

申请人： Kuniaki Mamitsu ,  Takahisa Kaneko ,  Masaya Tonomoto ,  Masayoshi Nishihata ,  Hiroyuki Wado ,  Chikage Noritake ,  Eiji Nomura ,  Toshiki Itoh

发明人： Kuniaki Mamitsu ,  Takahisa Kaneko ,  Masaya Tonomoto ,  Masayoshi Nishihata ,  Hiroyuki Wado ,  Chikage Noritake ,  Eiji Nomura ,  Toshiki Itoh

IPC分类号： H01L23/34

CPC分类号： H01L23/473 ,  H01L23/3672 ,  H01L23/3736 ,  H01L23/427 ,  H01L23/4334 ,  H01L23/46 ,  H01L24/06 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/06181 ,  H01L2224/29111 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/29339 ,  H01L2224/29347 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/48227 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/06 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1517 ,  H01L2924/1579 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device includes a package and a cooler. The semiconductor package includes a semiconductor element, a metal member, and a molding member for encapsulating the semiconductor element and the metal member. The metal member has a metal portion thermally connected to the semiconductor element, an insulating layer on the metal portion, and a conducting layer on the insulating layer. The conducting layer is at least partially exposed outside the molding member and serves as a radiation surface for radiating heat of the semiconductor element. The cooler has a coolant passage through which a coolant circulates to cool the conducting layer. The conducting layer and the cooler are electrically connected together.

摘要翻译： 半导体器件包括封装和冷却器。 半导体封装包括半导体元件，金属构件和用于封装半导体元件和金属构件的模制构件。 金属构件具有热连接到半导体元件的金属部分，金属部分上的绝缘层和绝缘层上的导电层。 导电层至少部分地暴露在模制构件的外部，并且用作用于辐射半导体元件的热的辐射表面。 冷却器具有冷却剂通道，冷却剂通过该通道冷却导电层。 导电层和冷却器电连接在一起。

公开(公告)号：US20110317366A1

公开(公告)日：2011-12-29

申请号：US13170554

申请日：2011-06-28

申请人： Keita FUKUTANI ,  Kuniaki Mamitsu

发明人： Keita FUKUTANI ,  Kuniaki Mamitsu

IPC分类号： H05K7/20 ,  H05K13/00

CPC分类号： H05K1/028 ,  H01L23/4012 ,  H01L23/473 ,  H01L23/5387 ,  H01L23/5389 ,  H01L25/072 ,  H01L2924/0002 ,  H05K1/186 ,  H05K3/0061 ,  H05K3/4632 ,  H05K7/20927 ,  H05K2201/0129 ,  H05K2201/0397 ,  H05K2201/056 ,  H05K2201/10166 ,  Y10T29/49002 ,  H01L2924/00

摘要： In a fixing structure of a circuit board to a cooler, the circuit board includes a wiring part, electronic parts electrically connected to the wiring part and an insulating base material embedding the wiring part and the electronic parts therein. The insulating base material includes embedding portions in which the electronic parts are embedded and a bent portion having flexibility between the embedding portions. The cooler has fixing parts arranged in a first direction. The circuit board is fixed to the cooler while bending the bent portion. The bent portion is opposed to an end portion of one of the fixing parts, and each of the embedding portions is held between adjacent two fixing parts such that opposite surfaces of the embedding portion are closely in contact with surfaces of the adjacent two fixing parts.

摘要翻译： 在电路板到冷却器的固定结构中，电路板包括布线部分，电连接到布线部分的电子部件和将布线部分和电子部件嵌入其中的绝缘基材。 绝缘基材包括其中嵌入电子部件的嵌入部分和在嵌入部分之间具有柔性的弯曲部分。 冷却器具有沿第一方向排列的固定部。 电路板在弯曲弯曲部分时固定在冷却器上。 弯曲部分与一个固定部分的端部相对，并且每个嵌入部分保持在相邻的两个固定部分之间，使得嵌入部分的相对表面与相邻的两个固定部分的表面紧密接触。

公开(公告)号：US08547697B2

公开(公告)日：2013-10-01

申请号：US13170554

申请日：2011-06-28

申请人： Keita Fukutani ,  Kuniaki Mamitsu

发明人： Keita Fukutani ,  Kuniaki Mamitsu

IPC分类号： H05K7/20

CPC分类号： H05K1/028 ,  H01L23/4012 ,  H01L23/473 ,  H01L23/5387 ,  H01L23/5389 ,  H01L25/072 ,  H01L2924/0002 ,  H05K1/186 ,  H05K3/0061 ,  H05K3/4632 ,  H05K7/20927 ,  H05K2201/0129 ,  H05K2201/0397 ,  H05K2201/056 ,  H05K2201/10166 ,  Y10T29/49002 ,  H01L2924/00

摘要： In a fixing structure of a circuit board to a cooler, the circuit board includes a wiring part, electronic parts electrically connected to the wiring part and an insulating base material embedding the wiring part and the electronic parts therein. The insulating base material includes embedding portions in which the electronic parts are embedded and a bent portion having flexibility between the embedding portions. The cooler has fixing parts arranged in a first direction. The circuit board is fixed to the cooler while bending the bent portion. The bent portion is opposed to an end portion of one of the fixing parts, and each of the embedding portions is held between adjacent two fixing parts such that opposite surfaces of the embedding portion are closely in contact with surfaces of the adjacent two fixing parts.

摘要翻译： 在电路板到冷却器的固定结构中，电路板包括布线部分，电连接到布线部分的电子部件和将布线部分和电子部件嵌入其中的绝缘基底材料。 绝缘基材包括其中嵌入电子部件的嵌入部分和在嵌入部分之间具有柔性的弯曲部分。 冷却器具有沿第一方向排列的固定部。 电路板在弯曲弯曲部分时固定在冷却器上。 弯曲部分与一个固定部分的端部相对，并且每个嵌入部分保持在相邻的两个固定部分之间，使得嵌入部分的相对表面与相邻的两个固定部分的表面紧密接触。

公开(公告)号：US08441122B2

公开(公告)日：2013-05-14

申请号：US12805733

申请日：2010-08-17

申请人： Daisuke Fukuoka ,  Takanori Teshima ,  Kuniaki Mamitsu ,  Ken Sakamoto ,  Tetsuo Fujii ,  Akira Tai ,  Kazuo Akamatsu ,  Masayoshi Nishihata

发明人： Daisuke Fukuoka ,  Takanori Teshima ,  Kuniaki Mamitsu ,  Ken Sakamoto ,  Tetsuo Fujii ,  Akira Tai ,  Kazuo Akamatsu ,  Masayoshi Nishihata

IPC分类号： H01L23/34

CPC分类号： H01L23/3192 ,  H01L23/4334 ,  H01L23/492 ,  H01L24/01 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05599 ,  H01L2224/05644 ,  H01L2224/16 ,  H01L2224/48491 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01052 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/13055 ,  H01L2924/3512 ,  H01L2924/00

摘要： A semiconductor device includes a first protection film for covering a first metal wiring. A second protection film is disposed on the first protection film, which is covered with a solder layer. Even if a crack is generated in the second protection film before the solder layer is formed on the second protection film, the crack is restricted from proceeding into the first protection film.

摘要翻译： 半导体器件包括用于覆盖第一金属布线的第一保护膜。 第一保护膜设置在第一保护膜上，该第一保护膜被焊料层覆盖。 即使在第二保护膜上形成焊料层之前，在第二保护膜中产生裂纹，限制裂纹进入第一保护膜。

公开(公告)号：US07145254B2

公开(公告)日：2006-12-05

申请号：US10201556

申请日：2002-07-24

申请人： Naohiko Hirano ,  Takanori Teshima ,  Yoshimi Nakase ,  Kenji Yagi ,  Yasushi Ookura ,  Kuniaki Mamitsu ,  Kazuhito Nomura ,  Yutaka Fukuda

发明人： Naohiko Hirano ,  Takanori Teshima ,  Yoshimi Nakase ,  Kenji Yagi ,  Yasushi Ookura ,  Kuniaki Mamitsu ,  Kazuhito Nomura ,  Yutaka Fukuda

IPC分类号： H01L23/10 ,  H01L23/28

CPC分类号： H01L24/33 ,  H01L21/565 ,  H01L23/367 ,  H01L23/3736 ,  H01L23/4334 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/05624 ,  H01L2224/29111 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/33 ,  H01L2224/33181 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83203 ,  H01L2224/83815 ,  H01L2224/85399 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/0132 ,  H01L2924/10158 ,  H01L2924/10253 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/15724 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/30107 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device includes a semiconductor chip that generates heat in operation, a pair of heat sinks for cooling the chip, and a mold resin, in which the chip and the heat sinks are embedded. The thickness t1 of the chip and the thickness t2 of one of heat sinks that is joined to the chip using a solder satisfy the equation of t2/t1≧5. Furthermore, the thermal expansion coefficient α1 of the heat sinks and the thermal expansion coefficient α2 of the mold resin satisfy the equation of 0.5≦α2/α1≦1.5. In addition, the surface of the chip that faces the solder has a roughness Ra that satisfies the equation of Ra≦500 nm. Moreover, the solder is a Sn-based solder to suppress relaxation of a compressive stress in the chip, which is caused by the creeping of the solder.

摘要翻译： 半导体器件包括在工作中产生热的半导体芯片，用于冷却芯片的一对散热器和嵌入芯片和散热片的模制树脂。 使用焊料与芯片接合的芯片的厚度t 1和散热器之一的厚度t 2满足t 2 / t 1> = 5的等式。 此外，散热器的热膨胀系数α1和模制树脂的热膨胀系数α2满足0.5≤α2/α1<= 1.5的等式。 此外，面向焊料的芯片的表面具有满足Ra <= 500nm的等式的粗糙度Ra。 此外，焊料是Sn基焊料，以抑制由焊料蠕变引起的芯片中的压缩应力松弛。

公开(公告)号：US20110042741A1

公开(公告)日：2011-02-24

申请号：US12805733

申请日：2010-08-17

申请人： Daisuke Fukuoka ,  Takanori Teshima ,  Kuniaki Mamitsu ,  Ken Sakamoto ,  Manabu Tomisaka ,  Tetsuo Fujii ,  Akira Tai ,  Kazuo Akamatsu ,  Masayoshi Nishihata

发明人： Daisuke Fukuoka ,  Takanori Teshima ,  Kuniaki Mamitsu ,  Ken Sakamoto ,  Manabu Tomisaka ,  Tetsuo Fujii ,  Akira Tai ,  Kazuo Akamatsu ,  Masayoshi Nishihata

IPC分类号： H01L29/772 ,  H01L23/498

CPC分类号： H01L23/3192 ,  H01L23/4334 ,  H01L23/492 ,  H01L24/01 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05599 ,  H01L2224/05644 ,  H01L2224/16 ,  H01L2224/48491 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01052 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/13055 ,  H01L2924/3512 ,  H01L2924/00

摘要： A semiconductor device includes a first protection film for covering a first metal wiring. A second protection film is disposed on the first protection film, which is covered with a solder layer. Even if a crack is generated in the second protection film before the solder layer is formed on the second protection film, the crack is restricted from proceeding into the first protection film.

摘要翻译： 半导体器件包括用于覆盖第一金属布线的第一保护膜。 第一保护膜设置在第一保护膜上，该第一保护膜被焊料层覆盖。 即使在第二保护膜上形成焊料层之前，在第二保护膜中产生裂纹，限制裂纹进入第一保护膜。

公开(公告)号：US10079226B2

公开(公告)日：2018-09-18

申请号：US13357690

申请日：2012-01-25

申请人： Kuniaki Mamitsu ,  Takanori Teshima

发明人： Kuniaki Mamitsu ,  Takanori Teshima

IPC分类号： H01L23/36 ,  H01L25/11 ,  H01L23/473 ,  H05K7/20 ,  H01L23/40

CPC分类号： H01L25/117 ,  H01L23/40 ,  H01L23/4012 ,  H01L23/473 ,  H01L25/115 ,  H01L2224/40137 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/09701 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/181 ,  H01L2924/30107 ,  H05K7/20927 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor device comprises at least a semiconductor module including a semiconductor chip, a heat sink thermally connected to the semiconductor chip and a seal member for covering and sealing the semiconductor chip and the heat sink in such a manner as to expose the heat radiation surface of the heat sink. The radiation surface is cooled by a refrigerant. An opening is formed in a part of the seal member as a refrigerant path through which the refrigerant flows.

公开(公告)号：US07235876B2

公开(公告)日：2007-06-26

申请号：US11516501

申请日：2006-09-07

申请人： Tomomi Okumura ,  Yoshitsugu Sakamoto ,  Naohiko Hirano ,  Kuniaki Mamitsu

发明人： Tomomi Okumura ,  Yoshitsugu Sakamoto ,  Naohiko Hirano ,  Kuniaki Mamitsu

IPC分类号： H01L23/10 ,  H01L23/34

CPC分类号： H01L23/051 ,  H01L23/492 ,  H01L23/49503 ,  H01L23/49513 ,  H01L23/49541 ,  H01L23/49562 ,  H01L23/49575 ,  H01L24/32 ,  H01L24/33 ,  H01L24/48 ,  H01L24/49 ,  H01L24/83 ,  H01L2224/26175 ,  H01L2224/27013 ,  H01L2224/291 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32014 ,  H01L2224/32057 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83051 ,  H01L2224/83385 ,  H01L2224/83455 ,  H01L2224/83801 ,  H01L2224/92147 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/0132 ,  H01L2224/83 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device includes: first and second metallic plates, each of which includes a heat radiation surface and an inner surface; a semiconductor element between the metallic plates; a block between the second metallic plate and the semiconductor element; a solder member between the second metallic plate and the block; and a resin mold. The heat radiation surface is exposed from the resin mold. The second metallic plate includes a groove for preventing the solder member from expanding outside of the block. The groove is disposed on the inner surface and disposed on an outer periphery of the block. The second metallic plate further includes an inner surface member on an inner surface of the groove. The inner surface member has a solder wettability, which is larger than a solder wettability of the block.