公开(公告)号：US09852965B2

公开(公告)日：2017-12-26

申请号：US15204632

申请日：2016-07-07

申请人： Ho-Jin Lee ,  Byung Lyul Park ,  Kwangjin Moon ,  Jisoon Park ,  Jin Ho An

发明人： Ho-Jin Lee ,  Byung Lyul Park ,  Kwangjin Moon ,  Jisoon Park ,  Jin Ho An

IPC分类号： H01L23/48 ,  H01L21/768

CPC分类号： H01L23/481 ,  H01L21/76898 ,  H01L2224/11 ,  H01L2224/16145 ,  H01L2924/181 ,  H01L2924/00012

摘要： Provided herein are semiconductor devices with through electrodes and methods of fabricating the same. The methods may include providing a semiconductor substrate having top and bottom surfaces facing each other, forming on the top surface of the semiconductor substrate a main via having a hollow cylindrical structure and a metal line connected to the main via, forming an interlayered insulating layer on the top surface of the semiconductor substrate to cover the main via and the metal line, removing a portion of the semiconductor substrate to form a via hole exposing a portion of a bottom surface of the main via, and forming in the via hole a through electrode that is electrically connected to the main via. The bottom surface of the main via is overlapped by a circumference of the via hole, when viewed in a plan view.

公开(公告)号：US20170047270A1

公开(公告)日：2017-02-16

申请号：US15204632

申请日：2016-07-07

申请人： Ho-Jin Lee ,  Byung Lyul Park ,  Kwangjin Moon ,  Jisoon Park ,  Jin Ho An

发明人： Ho-Jin Lee ,  Byung Lyul Park ,  Kwangjin Moon ,  Jisoon Park ,  Jin Ho An

IPC分类号： H01L23/48 ,  H01L21/768

CPC分类号： H01L23/481 ,  H01L21/76898 ,  H01L2224/11 ,  H01L2224/16145 ,  H01L2924/181 ,  H01L2924/00012

摘要： Provided herein are semiconductor devices with through electrodes and methods of fabricating the same. The methods may include providing a semiconductor substrate having top and bottom surfaces facing each other, forming on the top surface of the semiconductor substrate a main via having a hollow cylindrical structure and a metal line connected to the main via, forming an interlayered insulating layer on the top surface of the semiconductor substrate to cover the main via and the metal line, removing a portion of the semiconductor substrate to form a via hole exposing a portion of a bottom surface of the main via, and forming in the via hole a through electrode that is electrically connected to the main via. The bottom surface of the main via is overlapped by a circumference of the via hole, when viewed in a plan view.

摘要翻译： 本文提供了具有通孔电极的半导体器件及其制造方法。 所述方法可以包括提供具有彼此面对的顶表面和底表面的半导体衬底，在半导体衬底的顶表面上形成具有中空圆柱形结构的主通孔和连接到主通路的金属线，在其上形成层间绝缘层 半导体衬底的顶表面覆盖主通孔和金属线，去除半导体衬底的一部分以形成露出主通孔的底表面的一部分的通孔，并且在通孔中形成通孔 电连接到主通路。 当在平面图中观察时，主通孔的底表面与通孔的圆周重叠。

公开(公告)号：US09847276B2

公开(公告)日：2017-12-19

申请号：US14463645

申请日：2014-08-19

申请人： Pil-Kyu Kang ,  Byung Lyul Park ,  SungHee Kang ,  Taeseong Kim ,  Taeyeong Kim ,  Kwangjin Moon ,  Jae-Hwa Park ,  Sukchul Bang ,  Seongmin Son ,  Jin Ho An ,  Ho-Jin Lee ,  Jeonggi Jin

发明人： Pil-Kyu Kang ,  Byung Lyul Park ,  SungHee Kang ,  Taeseong Kim ,  Taeyeong Kim ,  Kwangjin Moon ,  Jae-Hwa Park ,  Sukchul Bang ,  Seongmin Son ,  Jin Ho An ,  Ho-Jin Lee ,  Jeonggi Jin

IPC分类号： H01L29/40 ,  H01L23/48 ,  H01L21/768

CPC分类号： H01L23/481 ,  H01L21/7682 ,  H01L21/76831 ,  H01L21/76898 ,  H01L2924/0002 ,  H01L2924/00

摘要： A semiconductor device includes a semiconductor substrate having a top surface and a bottom surface facing each other, an interlayer dielectric layer provided on the top surface of the semiconductor substrate and including an integrated circuit, an inter-metal dielectric layer provided on the interlayer dielectric layer and including at least one metal interconnection electrically connected to the integrated circuit, an upper dielectric layer disposed on the inter-metal dielectric layer, a through-electrode penetrating the inter-metal dielectric layer, the interlayer dielectric layer, and the semiconductor substrate, a via-dielectric layer surrounding the through-electrode and electrically insulating the through-electrode from the semiconductor substrate. The via-dielectric layer includes one or more air-gaps between the upper dielectric layer and the interlayer dielectric layer.

公开(公告)号：US20130127019A1

公开(公告)日：2013-05-23

申请号：US13610296

申请日：2012-09-11

申请人： Dosun LEE ,  Byung Lyul Park ,  Gilheyun Choi ,  Kwangjin Moon ,  Kunsang Park ,  Sukchul Bang ,  Seongmin Son

发明人： Dosun LEE ,  Byung Lyul Park ,  Gilheyun Choi ,  Kwangjin Moon ,  Kunsang Park ,  Sukchul Bang ,  Seongmin Son

IPC分类号： H01L23/52

CPC分类号： H01L25/0657 ,  H01L21/7682 ,  H01L21/76898 ,  H01L23/3128 ,  H01L23/481 ,  H01L23/49827 ,  H01L2224/16225 ,  H01L2225/06513 ,  H01L2225/06544 ,  H01L2924/15311

摘要： A semiconductor device may include a semiconductor substrate, a through via electrode, and a buffer. The through via electrode may extend through a thickness of the semiconductor substrate with the through via electrode surrounding an inner portion of the semiconductor substrate so that the inner portion of the semiconductor substrate may thus be isolated from the outer portion of the semiconductor substrate. The buffer may be in the inner portion of the semiconductor substrate with the through via electrode surrounding and spaced apart from the buffer. Related methods are also discussed.

摘要翻译： 半导体器件可以包括半导体衬底，通孔电极和缓冲器。 通孔电极可以通过半导体衬底的厚度延伸穿过半导体衬底的内部的通孔电极，使得半导体衬底的内部部分可以与半导体衬底的外部部分隔离。 缓冲器可以在半导体衬底的内部，其中通孔电极围绕并与缓冲器间隔开。 还讨论了相关方法。

公开(公告)号：US20120119376A1

公开(公告)日：2012-05-17

申请号：US13289624

申请日：2011-11-04

申请人： Dong-Chan Lim ,  Gilheyun Choi ,  Kwangjin Moon ,  Deok-Young Jung ,  Byung-Lyul Park ,  Dosun Lee

发明人： Dong-Chan Lim ,  Gilheyun Choi ,  Kwangjin Moon ,  Deok-Young Jung ,  Byung-Lyul Park ,  Dosun Lee

IPC分类号： H01L23/48

CPC分类号： H01L21/76802 ,  H01L21/76898 ,  H01L23/481 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/05025 ,  H01L2224/1147 ,  H01L2224/13025 ,  H01L2224/13082 ,  H01L2224/13099 ,  H01L2224/13124 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2924/0001 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2924/00

摘要： Provided are a semiconductor chip and a method of manufacturing the same. The semiconductor chip includes a substrate having a first side and a second side facing each other, and a through electrode being disposed in a hole penetrating the substrate, wherein an opening surrounded by the through electrode is disposed in the hole, wherein the opening comprises a first end adjacent to the first side of the substrate and a second end adjacent to the second side of the substrate

摘要翻译： 提供一种半导体芯片及其制造方法。 半导体芯片包括具有彼此相对的第一侧和第二侧的基板，以及设置在穿透基板的孔中的贯通电极，其中，由贯通电极包围的开口设置在孔中，其中，开口包括 与基板的第一侧相邻的第一端和与基板的第二侧相邻的第二端

公开(公告)号：US09153522B2

公开(公告)日：2015-10-06

申请号：US14028523

申请日：2013-09-16

申请人： Kwangjin Moon ,  SungHee Kang ,  Taeseong Kim ,  Byung Lyul Park ,  Yeun-Sang Park ,  Sukchul Bang

发明人： Kwangjin Moon ,  SungHee Kang ,  Taeseong Kim ,  Byung Lyul Park ,  Yeun-Sang Park ,  Sukchul Bang

IPC分类号： H01L23/48 ,  H01L23/532 ,  H01L25/065 ,  H01L21/768 ,  H01L23/31 ,  H01L23/00 ,  H01L23/498

CPC分类号： H01L23/481 ,  H01L21/30625 ,  H01L21/76873 ,  H01L21/76877 ,  H01L21/76898 ,  H01L23/3128 ,  H01L23/49827 ,  H01L23/53238 ,  H01L24/05 ,  H01L24/06 ,  H01L24/13 ,  H01L24/16 ,  H01L25/0657 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/05 ,  H01L2224/05548 ,  H01L2224/05567 ,  H01L2224/05568 ,  H01L2224/0557 ,  H01L2224/06181 ,  H01L2224/13023 ,  H01L2224/13024 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06544 ,  H01L2225/06565 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/014 ,  H01L2224/05552

摘要： Provided are semiconductor devices and methods of fabricating the same. The device may include a substrate including a first surface and a second surface opposing each other, a through-silicon-via (TSV) electrode provided in a via hole that may be formed to penetrate the substrate, and an integrated circuit provided adjacent to the through electrode on the first surface. The through electrode includes a metal layer filling a portion of the via hole and an alloy layer filling a remaining portion of the via hole. The alloy layer contains at least two metallic elements, one of which may be the same as that contained in the metal layer, and the other of which may be different from that contained in the metal layer.

摘要翻译： 提供半导体器件及其制造方法。 该器件可以包括包括彼此相对的第一表面和第二表面的衬底，设置在可以形成为穿透衬底的通孔中的穿硅通孔（TSV）电极，以及设置在邻近 通过第一表面上的电极。 贯通电极包括填充通孔的一部分的金属层和填充通孔的剩余部分的合金层。 合金层含有至少两种金属元素，其中之一可以与金属层中的金属元素相同，另一种可能与金属层中所含金属元素不同。

公开(公告)号：US09679829B2

公开(公告)日：2017-06-13

申请号：US14809159

申请日：2015-07-24

申请人： Kwangjin Moon ,  SungHee Kang ,  Taeseong Kim ,  Byung Lyul Park ,  Yeun-Sang Park ,  Sukchul Bang

发明人： Kwangjin Moon ,  SungHee Kang ,  Taeseong Kim ,  Byung Lyul Park ,  Yeun-Sang Park ,  Sukchul Bang

IPC分类号： H01L21/768 ,  H01L23/48 ,  H01L23/532 ,  H01L21/306 ,  H01L25/065 ,  H01L23/31 ,  H01L23/00 ,  H01L23/498

CPC分类号： H01L23/481 ,  H01L21/30625 ,  H01L21/76873 ,  H01L21/76877 ,  H01L21/76898 ,  H01L23/3128 ,  H01L23/49827 ,  H01L23/53238 ,  H01L24/05 ,  H01L24/06 ,  H01L24/13 ,  H01L24/16 ,  H01L25/0657 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/05 ,  H01L2224/05548 ,  H01L2224/05567 ,  H01L2224/05568 ,  H01L2224/0557 ,  H01L2224/06181 ,  H01L2224/13023 ,  H01L2224/13024 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06544 ,  H01L2225/06565 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/014 ,  H01L2224/05552

摘要： Provided are semiconductor devices and methods of fabricating the same. The device may include a substrate including a first surface and a second surface opposing each other, a through-silicon-via (TSV) electrode provided in a via hole that may be formed to penetrate the substrate, and an integrated circuit provided adjacent to the through electrode on the first surface. The through electrode includes a metal layer filling a portion of the via hole and an alloy layer filling a remaining portion of the via hole. The alloy layer contains at least two metallic elements, one of which may be the same as that contained in the metal layer, and the other of which may be different from that contained in the metal layer.

公开(公告)号：US09673133B2

公开(公告)日：2017-06-06

申请号：US14939394

申请日：2015-11-12

申请人： Jae-Hwa Park ,  Kwangjin Moon ,  Byung Lyul Park ,  Sukchul Bang

发明人： Jae-Hwa Park ,  Kwangjin Moon ,  Byung Lyul Park ,  Sukchul Bang

IPC分类号： H01L23/48 ,  H01L23/50 ,  H01L23/528

CPC分类号： H01L23/481 ,  H01L23/50 ,  H01L23/528 ,  H01L2224/13 ,  H01L2924/0002 ,  H01L2924/00

摘要： Semiconductor devices having through-electrodes are provided. The semiconductor devices may include a substrate, a through-electrode penetrating vertically through the substrate, a circuit layer on the substrate and metal lines in the circuit layer. The metal lines may include two first metals on opposing edges of a top surface of the through-electrode and second metals above the top surface of the through-electrode. At least some of the second metals may not vertically overlap the two first metals.

公开(公告)号：US20130052794A1

公开(公告)日：2013-02-28

申请号：US13597352

申请日：2012-08-29

申请人： Sukchul Bang ,  Kwangjin Moon ,  Byung Lyul Park ,  Dosun Lee ,  Deok-Young Jung ,  Gilheyun Choi

发明人： Sukchul Bang ,  Kwangjin Moon ,  Byung Lyul Park ,  Dosun Lee ,  Deok-Young Jung ,  Gilheyun Choi

IPC分类号： H01L21/762

CPC分类号： H01L23/5226 ,  H01L21/7682 ,  H01L21/76898 ,  H01L23/481 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L25/0657 ,  H01L2221/68372 ,  H01L2224/0401 ,  H01L2224/05008 ,  H01L2224/05022 ,  H01L2224/06181 ,  H01L2224/11002 ,  H01L2224/13024 ,  H01L2224/13025 ,  H01L2224/131 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06544 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15788 ,  H01L2924/351 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/00

摘要： Provided are semiconductor devices having through electrodes and methods of fabricating the same. The method includes providing a substrate including top and bottom surfaces facing each other, forming a hole and a gap extending from the top surface of the substrate toward the bottom surface of the substrate, the gap surrounding the hole and being shallower than the hole, filling the hole with an insulating material, forming a metal interconnection line on the top surface of the substrate on the insulating material, recessing the bottom surface of the substrate to expose the insulating material, removing the insulating material to expose the metal interconnection line via the hole, filling the hole with a conductive material to form a through electrode connected to the metal interconnection line, recessing the bottom surface of the substrate again to expose the gap, and forming a lower insulating layer on the bottom surface of the substrate.

摘要翻译： 提供了具有通过电极的半导体器件及其制造方法。 所述方法包括提供包括彼此面对的顶表面和底表面的基板，形成从基板的顶表面延伸到基板的底表面的孔和间隙，围绕孔的间隙并且比孔更浅，填充 所述孔具有绝缘材料，在所述绝缘材料的所述基板的顶表面上形成金属互连线，凹陷所述基板的底表面以暴露所述绝缘材料，去除所述绝缘材料以经由所述孔暴露所述金属互连线 用导电材料填充孔以形成连接到金属互连线的通孔，再次使基板的底表面露出以露出间隙，并在基底的底表面上形成下绝缘层。

公开(公告)号：US09153559B2

公开(公告)日：2015-10-06

申请号：US13610296

申请日：2012-09-11

申请人： Dosun Lee ,  Byung Lyul Park ,  Gilheyun Choi ,  Kwangjin Moon ,  Kunsang Park ,  Sukchul Bang ,  Seongmin Son

发明人： Dosun Lee ,  Byung Lyul Park ,  Gilheyun Choi ,  Kwangjin Moon ,  Kunsang Park ,  Sukchul Bang ,  Seongmin Son

IPC分类号： H01L29/40 ,  H01L25/065 ,  H01L23/31 ,  H01L23/48 ,  H01L21/768 ,  H01L23/498

CPC分类号： H01L25/0657 ,  H01L21/7682 ,  H01L21/76898 ,  H01L23/3128 ,  H01L23/481 ,  H01L23/49827 ,  H01L2224/16225 ,  H01L2225/06513 ,  H01L2225/06544 ,  H01L2924/15311

摘要： A semiconductor device may include a semiconductor substrate, a through via electrode, and a buffer. The through via electrode may extend through a thickness of the semiconductor substrate with the through via electrode surrounding an inner portion of the semiconductor substrate so that the inner portion of the semiconductor substrate may thus be isolated from the outer portion of the semiconductor substrate. The buffer may be in the inner portion of the semiconductor substrate with the through via electrode surrounding and spaced apart from the buffer. Related methods are also discussed.

摘要翻译： 半导体器件可以包括半导体衬底，通孔电极和缓冲器。 通孔电极可以通过半导体衬底的厚度延伸穿过半导体衬底的内部的通孔电极，使得半导体衬底的内部部分可以与半导体衬底的外部部分隔离。 缓冲器可以在半导体衬底的内部，其中通孔电极围绕并与缓冲器间隔开。 还讨论了相关方法。