ARRANGEMENT OF TWO CONNECTED BODIES
    1.
    发明申请
    ARRANGEMENT OF TWO CONNECTED BODIES 审中-公开
    两个连接体的安排

    公开(公告)号:US20080100815A1

    公开(公告)日:2008-05-01

    申请号:US11842313

    申请日:2007-08-21

    IPC分类号: G03B27/54 B23P11/00

    CPC分类号: G03F7/70825 Y10T29/49826

    摘要: Arrangements of a first body and a second body connected to the first body, as well as related systems and methods, are disclosed. The arrangements, systems and methods can be used, for example, with optical devices, such as in the field of microlithography systems used to manufacture of microelectronic devices.

    摘要翻译: 公开了连接到第一体的第一体和第二体的安排,以及相关系统和方法。 布置,系统和方法可以用于例如光学器件,例如在用于制造微电子器件的微光刻系统领域。

    Support structure for temporarily supporting a substrate
    3.
    发明申请
    Support structure for temporarily supporting a substrate 审中-公开
    用于临时支撑基材的支撑结构

    公开(公告)号:US20070285647A1

    公开(公告)日:2007-12-13

    申请号:US11728799

    申请日:2007-03-27

    IPC分类号: G03B27/58 G03F1/00

    摘要: There is provided a support structure for temporarily supporting a substrate in a support di-reaction during one of treatment and handling of the substrate comprising a base structure and at least one layer connected to the base structure. The at least one layer defines at least one protrusion of the support structure, the at least one protrusion being adapted to contact the substrate when the substrate is supported by the support structure. The at least one layer comprises a wear resistant material.

    摘要翻译: 提供了一种支撑结构,用于在包括基础结构和连接到基部结构的至少一个层的基底的处理和处理之一期间临时支撑载体二反应中的基底。 所述至少一个层限定所述支撑结构的至少一个突出部,所述至少一个突出部适于在所述基板由所述支撑结构支撑时接触所述基板。 至少一层包括耐磨材料。

    HOLDING ARRANGEMENT FOR AN OPTICAL ELEMENT
    4.
    发明申请
    HOLDING ARRANGEMENT FOR AN OPTICAL ELEMENT 失效
    光学元件的安装

    公开(公告)号:US20120140341A1

    公开(公告)日:2012-06-07

    申请号:US13359368

    申请日:2012-01-26

    IPC分类号: G02B7/02

    摘要: A holding arrangement for an optical element includes a basic structure surrounding an optical element and a mounting device by which the optical element can be supported on the basic structure with two degrees of freedom for a rotational movement about an optical axis and a translational movement along a first axis which extends perpendicularly to the optical axis and intersects the optical axis in a center. The mounting device includes four joint locations arranged point-symmetrically with respect to the center and at least one parallel rocker which is displaceable parallel to the first axis. A manipulator unit includes a holding arrangement.

    摘要翻译: 用于光学元件的保持装置包括围绕光学元件的基本结构和安装装置,通过该安装装置,光学元件可以以两个自由度支撑在基本结构上,用于围绕光轴的旋转运动和沿着光轴的平移运动 第一轴线垂直于光轴延伸并与中心的光轴相交。 安装装置包括相对于中心点对称布置的四个关节位置和平行于第一轴线移动的至少一个平行摇杆。 操纵器单元包括保持装置。

    OPTICAL SYSTEM HAVING AN OPTICAL ARRANGEMENT
    7.
    发明申请
    OPTICAL SYSTEM HAVING AN OPTICAL ARRANGEMENT 有权
    具有光学布置的光学系统

    公开(公告)号:US20110025992A1

    公开(公告)日:2011-02-03

    申请号:US12838149

    申请日:2010-07-16

    IPC分类号: G03B27/54 G03B27/52

    摘要: An optical system, such as an illumination system, includes an optical arrangement having at least one optical element and at least one heat dissipation element configured to at least partially dissipate thermal energy generated in the optical element(s) to the outside environment of the optical system. The heat dissipation element(s) is(are) arranged without direct contact with the optical element(s).

    摘要翻译: 诸如照明系统的光学系统包括具有至少一个光学元件和至少一个散热元件的光学装置,该至少一个散热元件被配置为至少部分地将在光学元件中产生的热能消耗到光学元件的外部环境 系统。 散热元件被布置成不与光学元件直接接触。

    Process for connecting an optical element of a microlithographic projection exposure apparatus to a mount, and assembly
    9.
    发明授权
    Process for connecting an optical element of a microlithographic projection exposure apparatus to a mount, and assembly 有权
    用于将微光刻投影曝光装置的光学元件连接到安装件和组件的方法

    公开(公告)号:US07551375B2

    公开(公告)日:2009-06-23

    申请号:US11386236

    申请日:2006-03-21

    IPC分类号: G02B7/02

    摘要: The invention relates to processes for connecting an optical element of a microlithographic projection exposure apparatus to a mount, and also relates to an assembly. A process includes the following steps: forming a substance mixture at a processing temperature from at least a first component, which is solid at the processing temperature, and a second component, which is liquid at the processing temperature, the first component being dispersed in the second component, introducing the substance mixture in the unset state between the optical element and the mount, and setting the substance mixture so as to form a diffusion alloy from the first and second components.

    摘要翻译: 本发明涉及用于将微光刻投影曝光装置的光学元件连接到安装件的方法,并且还涉及一种组件。 一种方法包括以下步骤:在加工温度下从处于加工温度下为固体的至少第一组分和在处理温度下为液体的第二组分形成物质混合物,第一组分分散在 将所述物质混合物引入所述光学元件和所述安装件之间的未设定状态,并且将所述物质混合物设定为从所述第一和第二成分形成扩散合金。

    OPTICAL IMAGING DEVICE WITH THERMAL ATTENUATION
    10.
    发明申请
    OPTICAL IMAGING DEVICE WITH THERMAL ATTENUATION 有权
    具有热衰减的光学成像装置

    公开(公告)号:US20090135385A1

    公开(公告)日:2009-05-28

    申请号:US12267074

    申请日:2008-11-07

    IPC分类号: G03B27/52

    CPC分类号: G03F7/70341 G03F7/70891

    摘要: An optical imaging device, in particular for use in microlithography, includes a mask device for receiving a mask having a projection pattern, a projection device with an optical element group, a substrate device for receiving a substrate and an immersion zone. The optical element group is adapted to project the projection pattern onto the substrate and includes a plurality of optical elements with an immersion element to which the substrate is at least temporarily located adjacent to during operation. During operation, the immersion zone is located between the immersion element and the substrate and is at least temporarily filled with an immersion medium. A thermal attenuation device is provided, the thermal attenuation device being adapted to reduce fluctuations within the temperature distribution of the immersion element induced by the immersion medium.

    摘要翻译: 特别是用于微光刻的光学成像装置包括用于接收具有投影图案的掩模的掩模装置,具有光学元件组的投影装置,用于接收基板的基板装置和浸没区。 光学元件组适于将投影图案投影到基板上并且包括具有浸没元件的多个光学元件,基板在工作期间至少临时定位到该浸没元件。 在操作期间,浸没区域位于浸没元件和基底之间,并且至少暂时填充浸渍介质。 提供一种热衰减装置,该热衰减装置适于减少浸入式介质引起的浸没元件的温度分布内的波动。