利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

11 条记录 (耗时 0.025 秒)

    Epoxy Bump for Overhang Die
    8.
    发明申请
    Epoxy Bump for Overhang Die 有权
    用于悬臂模具的环氧树脂

    公开(公告)号：US20060267609A1

    公开(公告)日：2006-11-30

    申请号：US11420853

    申请日：2006-05-30

    申请人： Hun-Teak Lee ,  Jong-Kook Kim ,  Chul-Sik Kim ,  Ki-Youn Jang

    发明人： Hun-Teak Lee ,  Jong-Kook Kim ,  Chul-Sik Kim ,  Ki-Youn Jang

    IPC分类号： G01R31/02

    CPC分类号： H01L25/0657 ,  H01L24/32 ,  H01L24/73 ,  H01L24/78 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2225/06575 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

    摘要： In a semiconductor assembly having stacked elements, discrete bumps made of a polymer such as an electrically nonconductive epoxy are interposed between the upper surface of a substrate and the lower surface of the overhanging part of an elevated element (die or package). The bumps are dimensioned to provide a clearance between the upper surface of the “bottom” substrate and the under surface of the second die or “top” package. The invention is carried out by first determining what height is required for the support; then depositing one or more of the polymer bumps at one or more suitable sites on the substrate; and placing the overhanging die or package onto the feature or features upon which it is stacked. The required height is the same as the accumulated thickness of the feature or features upon which the die or package is stacked (including the sum of thicknesses of, for example, any die, packages, spacers, adhesives layers, etc.). Suitable sites are determined according to the extent and position of the features or features upon which the die or package is stacked, the extent of the overhang, and the type and force of any stresses that may be imposed on the die or package during processing.

    摘要翻译： 在具有堆叠元件的半导体组件中，由诸如非导电环氧树脂的聚合物制成的分立凸块插入在基板的上表面和升高的元件（模具或封装）的突出部分的下表面之间。 凸块的尺寸设计成在“底”基板的上表面和第二模具或“顶部”封装的下表面之间提供间隙。 本发明通过首先确定支撑件所需的高度来实现; 然后在衬底上的一个或多个合适位置沉积一个或多个聚合物凸块; 并将悬垂的模具或包装放置在其堆叠的特征或特征上。 所需的高度与模具或包装堆叠的特征或特征的累积厚度相同（包括例如任何模具，包装，间隔物，粘合剂层等的厚度之和）。 根据模具或包装堆叠的特征或特征的范围和位置，伸出的程度以及在加工期间可能施加在模具或包装上的任何应力的类型和力，确定合适的位置。