公开(公告)号：US20110266700A1

公开(公告)日：2011-11-03

申请号：US13178331

申请日：2011-07-07

申请人： Hun-Teak Lee ,  Jong-Kook Kim ,  Chul-Sik Kim ,  Ki-Youn Jang ,  Rajendra D. Pendse

发明人： Hun-Teak Lee ,  Jong-Kook Kim ,  Chul-Sik Kim ,  Ki-Youn Jang ,  Rajendra D. Pendse

IPC分类号： H01L23/498 ,  H01L21/50

CPC分类号： H01L24/85 ,  H01L23/13 ,  H01L23/4952 ,  H01L23/49833 ,  H01L24/05 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05556 ,  H01L2224/05599 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48011 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/48455 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48475 ,  H01L2224/48479 ,  H01L2224/4848 ,  H01L2224/48599 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/48699 ,  H01L2224/48744 ,  H01L2224/48747 ,  H01L2224/49109 ,  H01L2224/49175 ,  H01L2224/49433 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/85051 ,  H01L2224/85205 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/85986 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0106 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2224/85181 ,  H01L2224/85186 ,  H01L2924/2065 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/4554

摘要： A method of manufacture of a semiconductor package includes: providing a substrate; mounting a semiconductor die on the substrate, the semiconductor die having a die pad; mounting a lead finger on the substrate; attaching a support pedestal on sides of the lead finger; and attaching a wire interconnection between the die pad and the support pedestal, the wire interconnection having a ball bond on the die pad and a stitch bond on the support pedestal.

摘要翻译： 半导体封装的制造方法包括：提供衬底; 将半导体管芯安装在基板上，半导体管芯具有管芯焊盘; 将引线安装在基板上; 在所述引导指的侧面附接支撑基座; 并且在芯片焊盘和支撑基座之间附接电线互连，电线互连在芯片焊盘上具有球接合，并且在支撑基座上具有针脚接合。

公开(公告)号：US07986047B2

公开(公告)日：2011-07-26

申请号：US12783039

申请日：2010-05-19

申请人： Hun-Teak Lee ,  Jong-Kook Kim ,  Chul-Sik Kim ,  Ki-Youn Jang ,  Rajendra D. Pendse

发明人： Hun-Teak Lee ,  Jong-Kook Kim ,  Chul-Sik Kim ,  Ki-Youn Jang ,  Rajendra D. Pendse

IPC分类号： H01L23/48 ,  H01L23/52

CPC分类号： H01L24/85 ,  H01L23/13 ,  H01L23/4952 ,  H01L23/49833 ,  H01L24/05 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05556 ,  H01L2224/05599 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48011 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/48455 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48475 ,  H01L2224/48479 ,  H01L2224/4848 ,  H01L2224/48599 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/48699 ,  H01L2224/48744 ,  H01L2224/48747 ,  H01L2224/49109 ,  H01L2224/49175 ,  H01L2224/49433 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/85051 ,  H01L2224/85205 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/85986 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0106 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2224/85181 ,  H01L2224/85186 ,  H01L2924/2065 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/4554

摘要： A wire bond interconnection between a die pad and a bond finger includes a support pedestal at a bond site of the lead finger, a ball bond on the die pad, and a stitch bond on the support pedestal, in which a width of the lead finger at the bond site is less than a diameter of the support pedestal. Also, a semiconductor package including a die mounted onto and electrically connected by a plurality of wire bonds to a substrate, in which each of the wire bonds includes a wire ball bonded to a pad on the die and stitch bonded to a support pedestal on a bond site on a lead finger, and in which the width of the lead finger at the bond site is less than the diameter of the support pedestal.

摘要翻译： 芯片焊盘和键合指状物之间的引线键合互连包括在引线指的键合位置处的支撑基座，芯片焊盘上的球接合以及支撑基座上的线圈接合，其中引线指 在焊接点处小于支撑基座的直径。 此外，包括安装在多个引线键合并且电连接到基板的裸片的半导体封装，其中每个引线键合包括接合到模具上的焊盘的线球，并且在与基板上的支撑基座上接合 引线指的键位置，并且其中引线指在键合位置处的宽度小于支撑基座的直径。

公开(公告)号：US20100225008A1

公开(公告)日：2010-09-09

申请号：US12783039

申请日：2010-05-19

申请人： Hun-Teak Lee ,  Jong-Kook Kim ,  Chul-Sik Kim ,  Ki-Youn Jang ,  Rajendra D. Pendse

发明人： Hun-Teak Lee ,  Jong-Kook Kim ,  Chul-Sik Kim ,  Ki-Youn Jang ,  Rajendra D. Pendse

IPC分类号： H01L23/498

CPC分类号： H01L24/85 ,  H01L23/13 ,  H01L23/4952 ,  H01L23/49833 ,  H01L24/05 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05556 ,  H01L2224/05599 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48011 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/48455 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48475 ,  H01L2224/48479 ,  H01L2224/4848 ,  H01L2224/48599 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/48699 ,  H01L2224/48744 ,  H01L2224/48747 ,  H01L2224/49109 ,  H01L2224/49175 ,  H01L2224/49433 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/85051 ,  H01L2224/85205 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/85986 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0106 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2224/85181 ,  H01L2224/85186 ,  H01L2924/2065 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/4554

摘要： A wire bond interconnection between a die pad and a bond finger includes a support pedestal at a bond site of the lead finger, a ball bond on the die pad, and a stitch bond on the support pedestal, in which a width of the lead finger at the bond site is less than a diameter of the support pedestal. Also, a semiconductor package including a die mounted onto and electrically connected by a plurality of wire bonds to a substrate, in which each of the wire bonds includes a wire ball bonded to a pad on the die and stitch bonded to a support pedestal on a bond site on a lead finger, and in which the width of the lead finger at the bond site is less than the diameter of the support pedestal.

摘要翻译： 芯片焊盘和键合指状物之间的引线键合互连包括在引线指的键合位置处的支撑基座，芯片焊盘上的球接合以及支撑基座上的线圈接合，其中引线指 在焊接点处小于支撑基座的直径。 此外，包括安装在多个引线键合并且电连接到基板的裸片的半导体封装，其中每个引线键合包括接合到模具上的焊盘的线球，并且在与基板上的支撑基座上接合 引线指的键位置，并且其中引线指在键合位置处的宽度小于支撑基座的直径。

公开(公告)号：US07745322B2

公开(公告)日：2010-06-29

申请号：US12032159

申请日：2008-02-15

申请人： Hun-Teak Lee ,  Jong-Kook Kim ,  Chul-Sik Kim ,  Ki-Youn Jang ,  Rajendra D. Pendse

发明人： Hun-Teak Lee ,  Jong-Kook Kim ,  Chul-Sik Kim ,  Ki-Youn Jang ,  Rajendra D. Pendse

IPC分类号： H01L21/44

CPC分类号： H01L24/85 ,  H01L23/13 ,  H01L23/4952 ,  H01L23/49833 ,  H01L24/05 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05556 ,  H01L2224/05599 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48011 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/48455 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48475 ,  H01L2224/48479 ,  H01L2224/4848 ,  H01L2224/48599 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/48699 ,  H01L2224/48744 ,  H01L2224/48747 ,  H01L2224/49109 ,  H01L2224/49175 ,  H01L2224/49433 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/85051 ,  H01L2224/85205 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/85986 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0106 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2224/85181 ,  H01L2224/85186 ,  H01L2924/2065 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/4554

摘要： A wire bond interconnection between a die pad and a bond finger includes a support pedestal at a bond site of the lead finger, a ball bond on the die pad, and a stitch bond on the support pedestal, in which a width of the lead finger at the bond site is less than a diameter of the support pedestal. Also, a semiconductor package including a die mounted onto and electrically connected by a plurality of wire bonds to a substrate, in which each of the wire bonds includes a wire ball bonded to a pad on the die and stitch bonded to a support pedestal on a bond site on a lead finger, and in which the width of the lead finger at the bond site is less than the diameter of the support pedestal.

摘要翻译： 芯片焊盘和键合指状物之间的引线键合互连包括在引线指的键合位置处的支撑基座，芯片焊盘上的球接合以及支撑基座上的线圈接合，其中引线指 在焊接点处小于支撑基座的直径。 此外，包括安装在多个引线键合并且电连接到基板的裸片的半导体封装，其中每个引线键合包括接合到模具上的焊盘的线球，并且在与基板上的支撑基座上接合 引线指的键位置，并且其中引线指在键合位置处的宽度小于支撑基座的直径。

公开(公告)号：US20080135997A1

公开(公告)日：2008-06-12

申请号：US12032159

申请日：2008-02-15

申请人： Hun-Teak Lee ,  Jong-Kook Kim ,  Chul-Sik Kim ,  Ki-Youn Jang ,  Rajendra D. Pendse

发明人： Hun-Teak Lee ,  Jong-Kook Kim ,  Chul-Sik Kim ,  Ki-Youn Jang ,  Rajendra D. Pendse

IPC分类号： H01L23/495 ,  H01L21/00

CPC分类号： H01L24/85 ,  H01L23/13 ,  H01L23/4952 ,  H01L23/49833 ,  H01L24/05 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05556 ,  H01L2224/05599 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48011 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/48455 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48475 ,  H01L2224/48479 ,  H01L2224/4848 ,  H01L2224/48599 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/48699 ,  H01L2224/48744 ,  H01L2224/48747 ,  H01L2224/49109 ,  H01L2224/49175 ,  H01L2224/49433 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/85051 ,  H01L2224/85205 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/85986 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0106 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2224/85181 ,  H01L2224/85186 ,  H01L2924/2065 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/4554

摘要： A wire bond interconnection between a die pad and a bond finger includes a support pedestal at a bond site of the lead finger, a ball bond on the die pad, and a stitch bond on the support pedestal, in which a width of the lead finger at the bond site is less than a diameter of the support pedestal. Also, a semiconductor package including a die mounted onto and electrically connected by a plurality of wire bonds to a substrate, in which each of the wire bonds includes a wire ball bonded to a pad on the die and stitch bonded to a support pedestal on a bond site on a lead finger, and in which the width of the lead finger at the bond site is less than the diameter of the support pedestal. Also, such a package in which the package substrate includes a two-tier substrate, each tier including a plurality of lead fingers having a lead finger bond pitch about twice the die pad pitch, the lead fingers of the first tier and the second tier having a staggered arrangement. In some embodiments the support pedestal is formed using a wire bonding tool as in formation of a stud bump, and in such embodiments the support pedestal is metallurgically bonded to the lead finger. Also, a method for forming a wire bond interconnection between a semiconductor die and a substrate, by providing a die affixed on a die mount portion of a first side of a substrate and oriented with the active side oriented away from the substrate, the substrate having patterned traces including lead fingers in the first surface of the substrate; forming a support pedestal on a bond site of a lead finger; forming a first bond on a die pad; and forming a second bond on the support pedestal.

摘要翻译： 芯片焊盘和键合指状物之间的引线键合互连包括在引线指的键合位置处的支撑基座，芯片焊盘上的球接合以及支撑基座上的线圈接合，其中引线指 在焊接点处小于支撑基座的直径。 此外，包括安装在多个引线键合并且电连接到基板的裸片的半导体封装，其中每个引线键合包括接合到模具上的焊盘的线球，并且在与基板上的支撑基座上接合 引线指的键位置，并且其中引线指在键合位置处的宽度小于支撑基座的直径。 另外，封装基板包括双层基板的这种封装，每层包括多个引线指，其具有大约两倍于管芯焊盘间距的引线接合间距，第一层和第二层的引线指具有 交错排列 在一些实施例中，在形成柱形凸块时使用引线接合工具形成支撑基座，并且在这种实施例中，支撑基座冶金地结合到引线指。 另外，在半导体管芯和基板之间形成引线接合互连的方法，其特征在于，通过在基板的第一面的芯片安装部上设置模具，并且将所述有源面取向为远离所述基板，所述基板具有 图案化痕迹，包括在所述衬底的第一表面中的引线指; 在引线指的接合部位上形成支撑基座; 在芯片焊盘上形成第一键; 以及在所述支撑座上形成第二接合。

公开(公告)号：US08129263B2

公开(公告)日：2012-03-06

申请号：US13178331

申请日：2011-07-07

申请人： Hun-Teak Lee ,  Jong-Kook Kim ,  Chul-Sik Kim ,  Ki-Youn Jang ,  Rajendra D. Pendse

发明人： Hun-Teak Lee ,  Jong-Kook Kim ,  Chul-Sik Kim ,  Ki-Youn Jang ,  Rajendra D. Pendse

IPC分类号： H01L21/44 ,  H01L23/48

CPC分类号： H01L24/85 ,  H01L23/13 ,  H01L23/4952 ,  H01L23/49833 ,  H01L24/05 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05556 ,  H01L2224/05599 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48011 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/48455 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48475 ,  H01L2224/48479 ,  H01L2224/4848 ,  H01L2224/48599 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/48699 ,  H01L2224/48744 ,  H01L2224/48747 ,  H01L2224/49109 ,  H01L2224/49175 ,  H01L2224/49433 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/85051 ,  H01L2224/85205 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/85986 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0106 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2224/85181 ,  H01L2224/85186 ,  H01L2924/2065 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/4554

摘要： A method of manufacture of a semiconductor package includes: providing a substrate; mounting a semiconductor die on the substrate, the semiconductor die having a die pad; mounting a lead finger on the substrate; attaching a support pedestal on sides of the lead finger; and attaching a wire interconnection between the die pad and the support pedestal, the wire interconnection having a ball bond on the die pad and a stitch bond on the support pedestal.

摘要翻译： 半导体封装的制造方法包括：提供衬底; 将半导体管芯安装在基板上，半导体管芯具有管芯焊盘; 将引线安装在基板上; 在所述引导指的侧面附接支撑基座; 并且在芯片焊盘和支撑基座之间附接电线互连，电线互连在芯片焊盘上具有球接合，并且在支撑基座上具有针脚接合。

公开(公告)号：US07453156B2

公开(公告)日：2008-11-18

申请号：US11273635

申请日：2005-11-14

申请人： Hun-Teak Lee ,  Jong-Kook Kim ,  Chul-Sik Kim ,  Ki-Youn Jang ,  Rajendra D. Pendse

发明人： Hun-Teak Lee ,  Jong-Kook Kim ,  Chul-Sik Kim ,  Ki-Youn Jang ,  Rajendra D. Pendse

IPC分类号： H01L23/48 ,  H01L23/52

CPC分类号： H01L24/85 ,  H01L23/13 ,  H01L23/4952 ,  H01L23/49833 ,  H01L24/05 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05556 ,  H01L2224/05599 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48011 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/48455 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48475 ,  H01L2224/48479 ,  H01L2224/4848 ,  H01L2224/48599 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/48699 ,  H01L2224/48744 ,  H01L2224/48747 ,  H01L2224/49109 ,  H01L2224/49175 ,  H01L2224/49433 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/85051 ,  H01L2224/85205 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/85986 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0106 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2224/85181 ,  H01L2224/85186 ,  H01L2924/2065 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/4554

摘要： A wire bond interconnection between a die pad and a bond finger includes a support pedestal at a bond site of the lead finger, a ball bond on the die pad, and a stitch bond on the support pedestal, in which a width of the lead finger at the bond site is less than a diameter of the support pedestal. Also, a semiconductor package including a die mounted onto and electrically connected by a plurality of wire bonds to a substrate, in which each of the wire bonds includes a wire ball bonded to a pad on the die and stitch bonded to a support pedestal on a bond site on a lead finger, and in which the width of the lead finger at the bond site is less than the diameter of the support pedestal.

摘要翻译： 芯片焊盘和键合指状物之间的引线键合互连包括在引线指的键合位置处的支撑基座，芯片焊盘上的球接合以及支撑基座上的线圈接合，其中引线指 在焊接点处小于支撑基座的直径。 此外，包括安装在多个引线键合并且电连接到基板的裸片的半导体封装，其中每个引线键合包括接合到模具上的焊盘的线球，并且在与基板上的支撑基座上接合 引线指的键位置，并且其中引线指在键合位置处的宽度小于支撑基座的直径。

公开(公告)号：US08269356B2

公开(公告)日：2012-09-18

申请号：US12973410

申请日：2010-12-20

申请人： Rajendra D. Pendse ,  Byung Joon Han ,  Hun Teak Lee

发明人： Rajendra D. Pendse ,  Byung Joon Han ,  Hun Teak Lee

IPC分类号： H01L23/48 ,  H01L21/44

CPC分类号： H01L23/13 ,  H01L23/49833 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L2224/05554 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4807 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/48458 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48475 ,  H01L2224/48479 ,  H01L2224/4848 ,  H01L2224/48499 ,  H01L2224/48599 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/48699 ,  H01L2224/48744 ,  H01L2224/48747 ,  H01L2224/48844 ,  H01L2224/48847 ,  H01L2224/49109 ,  H01L2224/49175 ,  H01L2224/49433 ,  H01L2224/73265 ,  H01L2224/85051 ,  H01L2224/85205 ,  H01L2224/85385 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/85986 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2224/85181 ,  H01L2224/85186 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2224/4554

摘要： A semiconductor package has a semiconductor die disposed on a substrate. A bond wire is connected between a first bonding site on the semiconductor die and a second bonding site on the substrate. The first bonding site is a die bond pad; the second bonding site is a stitch bond. The second bonding site has a bond finger formed on the substrate, a conductive layer in direct physical contact with the bond finger, and a bond stud coupled to the bond wire and in direct physical contact with the conductive layer to conduct an electrical signal from the semiconductor die to the bond finger. The bond finger is made of copper. The conductive layer is made of copper or gold. The bond stud is made of gold and overlies a side portion and top portion of the copper layer.

摘要翻译： 半导体封装具有设置在基板上的半导体管芯。 接合线连接在半导体管芯上的第一接合部位和基板上的第二接合部位之间。 第一个结合位置是一个管芯焊盘; 第二粘结部位是针迹。 第二结合部位具有形成在基板上的粘结指状物，与粘结指状物直接物理接触的导电层和耦合到接合线的接合柱，并与导电层直接物理接触以传导电信号 半导体裸片粘到手指上。 键指由铜制成。 导电层由铜或金制成。 接合柱由金制成，并覆盖铜层的侧部和顶部。

公开(公告)号：US08853001B2

公开(公告)日：2014-10-07

申请号：US12959709

申请日：2010-12-03

申请人： Rajendra D. Pendse

发明人： Rajendra D. Pendse

IPC分类号： H01L23/48 ,  H01L23/00 ,  H01L23/498 ,  H01L23/50 ,  H01L21/56 ,  H01L23/31

CPC分类号： H01L24/17 ,  H01L21/56 ,  H01L21/563 ,  H01L21/768 ,  H01L23/3128 ,  H01L23/49838 ,  H01L23/50 ,  H01L23/528 ,  H01L24/03 ,  H01L24/09 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/09133 ,  H01L2224/09135 ,  H01L2224/11 ,  H01L2224/1134 ,  H01L2224/13 ,  H01L2224/13016 ,  H01L2224/13018 ,  H01L2224/13019 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/16237 ,  H01L2224/17133 ,  H01L2224/27013 ,  H01L2224/274 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48105 ,  H01L2224/48157 ,  H01L2224/48158 ,  H01L2224/4816 ,  H01L2224/48227 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81191 ,  H01L2224/812 ,  H01L2224/81385 ,  H01L2224/81801 ,  H01L2224/94 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device has a semiconductor die with a die pad layout. Signal pads in the die pad layout are located primarily near a perimeter of the semiconductor die, and power pads and ground pads are located primarily inboard from the signal pads. The signal pads are arranged in a peripheral row or in a peripheral array generally parallel to an edge of the semiconductor die. Bumps are formed over the signal pads, power pads, and ground pads. The bumps can have a fusible portion and non-fusible portion. Conductive traces with interconnect sites are formed over a substrate. The bumps are wider than the interconnect sites. The bumps are bonded to the interconnect sites so that the bumps cover a top surface and side surfaces of the interconnect sites. An encapsulant is deposited around the bumps between the semiconductor die and substrate.

摘要翻译： 半导体器件具有具有管芯焊盘布局的半导体管芯。 管芯焊盘布局中的信号焊盘主要位于半导体管芯的周边附近，并且电源焊盘和接地焊盘主要位于信号焊盘的内侧。 信号焊盘被布置在大致平行于半导体管芯的边缘的外围行或周边阵列中。 在信号焊盘，电源焊盘和接地焊盘上形成凸起。 凸块可以具有可熔部分和非易熔部分。 具有互连部位的导电迹线形成在衬底上。 凸块比互连部位宽。 凸块与互连部位接合，使得凸块覆盖互连部位的顶表面和侧表面。 围绕半导体管芯和衬底之间的凸块沉积密封剂。

公开(公告)号：US08574959B2

公开(公告)日：2013-11-05

申请号：US12960178

申请日：2010-12-03

申请人： Rajendra D. Pendse

发明人： Rajendra D. Pendse

IPC分类号： H01L21/44 ,  H01L23/48

CPC分类号： H01L24/17 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/3157 ,  H01L23/49811 ,  H01L23/49838 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L33/62 ,  H01L2224/11 ,  H01L2224/1134 ,  H01L2224/13 ,  H01L2224/13016 ,  H01L2224/13018 ,  H01L2224/13019 ,  H01L2224/13023 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1411 ,  H01L2224/16 ,  H01L2224/1601 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/16237 ,  H01L2224/16238 ,  H01L2224/17107 ,  H01L2224/27013 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/75 ,  H01L2224/75301 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81194 ,  H01L2224/81203 ,  H01L2224/81208 ,  H01L2224/81345 ,  H01L2224/81385 ,  H01L2224/81801 ,  H01L2224/83051 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83385 ,  H01L2224/83856 ,  H01L2224/93 ,  H01L2224/94 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15174 ,  H01L2924/15787 ,  H01L2924/1579 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/13109 ,  H01L2924/3512 ,  H01L2924/0665 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/81805

摘要： A semiconductor device has a semiconductor die with a plurality of composite bumps formed over a surface of the semiconductor die. The composite bumps have a fusible portion and non-fusible portion, such as a conductive pillar and bump formed over the conductive pillar. The composite bumps can also be tapered. Conductive traces are formed over a substrate with interconnect sites having edges parallel to the conductive trace from a plan view for increasing escape routing density. The interconnect site can have a width less than 1.2 times a width of the conductive trace. The composite bumps are wider than the interconnect sites. The fusible portion of the composite bumps is bonded to the interconnect sites so that the fusible portion covers a top surface and side surface of the interconnect sites. An encapsulant is deposited around the composite bumps between the semiconductor die and substrate.