公开(公告)号：US07884392B2

公开(公告)日：2011-02-08

申请号：US12362210

申请日：2009-01-29

申请人： Hyuek-Jae Lee ,  Tae-Je Cho ,  Yong-Hwan Kwon ,  Un-Byoung Kang ,  Chung-Sun Lee ,  Woon-Seong Kwon ,  Hyung-Sun Jang

发明人： Hyuek-Jae Lee ,  Tae-Je Cho ,  Yong-Hwan Kwon ,  Un-Byoung Kang ,  Chung-Sun Lee ,  Woon-Seong Kwon ,  Hyung-Sun Jang

IPC分类号： H01L31/0328

CPC分类号： H01L27/14623 ,  H01L27/14618 ,  H01L27/14636 ,  H01L2224/02372 ,  H01L2224/05001 ,  H01L2224/05009 ,  H01L2224/05023 ,  H01L2224/05548 ,  H01L2224/05624 ,  H01L2224/05666 ,  H01L2224/05671 ,  H01L2224/13 ,  H01L2924/00014 ,  H01L2224/05099

摘要： One embodiment exemplarily described herein can be characterized as an image sensor including a substrate having a front surface and a rear surface; a photoelectric converting portion on the front surface of the substrate; a through via extending through the substrate, wherein the through via is electrically connected to the photoelectric converting portion; an external connection terminal on the rear surface of the substrate, wherein the external connection terminal is connected to the through via; and a light shading layer formed on a portion of the rear surface of the substrate, wherein the light shading layer is substantially opaque with respect to an external light. In some embodiments, the portion of the rear surface of the substrate on which the light shading layer is formed is not overlapped by the through via or the external connection terminal.

摘要翻译： 本文示例性描述的一个实施例可以被表征为包括具有前表面和后表面的基板的图像传感器; 在所述基板的前表面上的光电转换部; 贯穿所述基板延伸的通孔，其中所述通孔电连接到所述光电转换部分; 在所述基板的后表面上的外部连接端子，其中所述外部连接端子连接到所述通孔; 以及形成在所述基板的后表面的一部分上的遮光层，其中所述遮光层相对于外部光基本上是不透明的。 在一些实施例中，其上形成有遮光层的基板的后表面的部分不与通孔或外部连接端子重叠。

公开(公告)号：US20090256931A1

公开(公告)日：2009-10-15

申请号：US12381489

申请日：2009-03-12

申请人： Chung-Sun Lee ,  Yong-Hwan Kwon ,  Un-Byoung Kang ,  Hyuek-Jae Lee ,  Woon-Seong Kwon ,  Hyung-Sun Jang

发明人： Chung-Sun Lee ,  Yong-Hwan Kwon ,  Un-Byoung Kang ,  Hyuek-Jae Lee ,  Woon-Seong Kwon ,  Hyung-Sun Jang

IPC分类号： H04N5/76 ,  H01L21/50 ,  H04N5/225

CPC分类号： H04N5/2253 ,  H01L24/97 ,  H01L2224/05001 ,  H01L2224/05009 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05572 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/05671 ,  H01L2224/16 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/3025 ,  H04N5/2257 ,  H01L2924/00014

摘要： A camera module, a method of manufacturing the same, and an electronic system having the same are provided. The camera module includes an image sensor chip having an active plane and a backside, a ground wiring extending from a sidewall of the image sensor chip to the backside, a lens structure having a light detector with at least one lens stacked on the active plane, and a conductive housing extending to the ground wiring along with an outer wall of the lens structure excluding the light detector.

摘要翻译： 提供了相机模块，其制造方法和具有该相机模块的电子系统。 相机模块包括具有活动平面和背面的图像传感器芯片，从图像传感器芯片的侧壁延伸到背面的接地布线，具有至少一个透镜的光检测器的透镜结构，该透镜结构堆叠在主动平面上， 以及与除了光检测器之外的透镜结构的外壁一起延伸到接地布线的导电外壳。

公开(公告)号：US08114701B2

公开(公告)日：2012-02-14

申请号：US12274642

申请日：2008-11-20

申请人： Woon-Seong Kwon ,  Tae-Je Cho ,  Yong-Hwan Kwon ,  Un-Byoung Kang ,  Chung-Sun Lee ,  Hyung-Sun Jang

发明人： Woon-Seong Kwon ,  Tae-Je Cho ,  Yong-Hwan Kwon ,  Un-Byoung Kang ,  Chung-Sun Lee ,  Hyung-Sun Jang

IPC分类号： H01L21/00

CPC分类号： H04N5/2252 ,  H01L27/14618 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05024 ,  H01L2224/05548 ,  H01L2224/13 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2924/00014 ,  H04N5/2253 ,  H04N5/2257 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/05099

摘要： Provided are camera modules capable of effectively shielding electromagnetic (EM) waves and methods of fabricating the same. A method of fabricating a camera module includes, preparing a first wafer including an array of lens units. Then, a second wafer including an array of image sensor CSPs (chip-scale packages) is prepared. Each of the image sensor CSPs includes an image sensor chip corresponding to one of the lens units. The first wafer is stacked on the second wafer. The first wafer and the second wafer are cut to form a trench exposing the top surface of the image sensor chip at the interface between adjacent lens units. The trench is filled with a first material used for forming a housing. The first material and the image sensor chip are cut at the interface between the adjacent lens units.

摘要翻译： 提供能够有效屏蔽电磁波（EM）波的相机模块及其制造方法。 制造相机模块的方法包括：制备包括透镜单元阵列的第一晶片。 然后，制备包括图像传感器CSP阵列（芯片级封装）的第二晶片。 图像传感器CSP中的每一个包括对应于一个透镜单元的图像传感器芯片。 第一晶片被堆叠在第二晶片上。 切割第一晶片和第二晶片以形成在相邻透镜单元之间的界面处暴露图像传感器芯片的顶表面的沟槽。 沟槽填充有用于形成壳体的第一材料。 第一材料和图像传感器芯片在相邻透镜单元之间的界面处被切割。

公开(公告)号：US07893514B2

公开(公告)日：2011-02-22

申请号：US11831768

申请日：2007-07-31

申请人： Woon-Seong Kwon ,  Yong-Hwan Kwon ,  Un-Byoung Kang ,  Chung-Sun Lee ,  Hyung-Sun Jang

发明人： Woon-Seong Kwon ,  Yong-Hwan Kwon ,  Un-Byoung Kang ,  Chung-Sun Lee ,  Hyung-Sun Jang

IPC分类号： H01L31/0203 ,  H01L31/0232 ,  H01L23/02 ,  H01L21/00

CPC分类号： H01L27/14618 ,  H01L24/97 ,  H01L27/14625 ,  H01L27/14683 ,  H01L27/14685 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： An image sensor package, a method of manufacturing the same, and an image sensor module including the image sensor package are provided. In the image sensor package, an image sensor chip is installed onto a depression of a transmissive substrate. An adhesive bonds the image sensor chip to the transmissive substrate and seals an Active Pixel Sensor (APS) on the image sensor chip, protecting it from fine particle contamination. An IR cutting film is disposed on the transmissive substrate to minimize the height of the image sensor package. The image sensor package is electrically connected to external connection pads in the depression. Consequently, the image sensor package has a minimum height, is not susceptible to particle contamination, and does not require expensive alignment processes during manufacturing.

摘要翻译： 提供了图像传感器封装，其制造方法和包括图像传感器封装的图像传感器模块。 在图像传感器封装中，将图像传感器芯片安装在透光性基板的凹部上。 粘合剂将图像传感器芯片粘合到透射基板上，并将图像传感器芯片上的有源像素传感器（APS）密封并保护其免受细颗粒污染。 将IR切割膜设置在透射基底上以最小化图像传感器封装的高度。 图像传感器封装电连接到凹陷中的外部连接焊盘。 因此，图像传感器封装具有最小高度，不易受到颗粒污染，并且在制造期间不需要昂贵的对准过程。

公开(公告)号：US07619315B2

公开(公告)日：2009-11-17

申请号：US11952426

申请日：2007-12-07

申请人： Woon-Seong Kwon ,  Yong-Hwan Kwon ,  Un-Byoung Kang ,  Chung-Sun Lee ,  Hyung-Sun Jang

发明人： Woon-Seong Kwon ,  Yong-Hwan Kwon ,  Un-Byoung Kang ,  Chung-Sun Lee ,  Hyung-Sun Jang

IPC分类号： H01L21/56

CPC分类号： H01L21/568 ,  H01L21/561 ,  H01L24/48 ,  H01L24/96 ,  H01L24/97 ,  H01L25/0657 ,  H01L27/14618 ,  H01L31/0203 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/13025 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/484 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/06524 ,  H01L2225/06551 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A stack type semiconductor chip package includes a first wafer mold, a protection substrate, and a second wafer mold that are stacked in a wafer level process. The first wafer mold includes a first chip having first pads and a first mold layer encapsulating the first chip. The protection substrate is placed on the first wafer mold, is mechanically bonded with the first wafer mold using a first adhesive layer, and includes wiring layers facing the first pads. The second wafer mold is placed under the first wafer mold, is mechanically bonded with the first wafer mold using a second adhesive layer, and includes a second chip having second pads, and a second mold layer encapsulating the second chip. First vias electrically connect the wiring layers of the protection substrate with the second pads. Second vias electrically connect the wiring layers of the protection substrate with external connection terminals.

摘要翻译： 堆叠型半导体芯片封装包括在晶片级工艺中堆叠的第一晶片模具，保护基板和第二晶片模具。 第一晶片模具包括具有第一焊盘的第一芯片和封装第一芯片的第一模具层。 保护基板被放置在第一晶片模具上，使用第一粘合剂层与第一晶片模具机械结合，并且包括面向第一焊盘的布线层。 第二晶片模具放置在第一晶片模具下面，使用第二粘合剂层与第一晶片模具机械结合，并且包括具有第二焊盘的第二芯片和封装第二芯片的第二模具层。 第一通孔将保护衬底的布线层与第二衬垫电连接。 第二通孔将保护基板的布线层与外部连接端子电连接。

公开(公告)号：US07948555B2

公开(公告)日：2011-05-24

申请号：US12254354

申请日：2008-10-20

申请人： Yong-Hwan Kwon ,  Un-Byoung Kang ,  Chung-Sun Lee ,  Woon-Seong Kwon ,  Hyung-Sun Jang

发明人： Yong-Hwan Kwon ,  Un-Byoung Kang ,  Chung-Sun Lee ,  Woon-Seong Kwon ,  Hyung-Sun Jang

IPC分类号： H04N5/225 ,  H04N9/077 ,  H01L31/0232

CPC分类号： H04N5/2254 ,  H01L27/14618 ,  H01L2924/0002 ,  H04N5/2253 ,  H04N5/2257 ,  H04N2007/145 ,  H01L2924/00

摘要： A camera module includes an image sensor chip, a lens structure, a transparent substrate, an adhesive portion, and a light blocking layer. The image sensor chip includes a light receiving area and a circuit area. The lens structure is positioned on the image sensor chip and configured to allow light to enter the image sensor chip. The transparent substrate is positioned between the image sensor chip and the lens structure, the transparent substrate allowing light from the lens structure to enter the light receiving area. The adhesive portion attaches the image sensor chip and the transparent substrate, and covers the circuit area. The light blocking layer is attached to the transparent substrate to block light from entering the circuit area.

摘要翻译： 相机模块包括图像传感器芯片，透镜结构，透明基板，粘合部分和遮光层。 图像传感器芯片包括光接收区域和电路区域。 透镜结构位于图像传感器芯片上并且被配置为允许光进入图像传感器芯片。 透明基板位于图像传感器芯片和透镜结构之间，透明基板允许来自透镜结构的光进入光接收区域。 粘合剂部附着图像传感器芯片和透明基板，并且覆盖电路区域。 遮光层附着到透明基板上以阻挡光线进入电路区域。

公开(公告)号：US20080012084A1

公开(公告)日：2008-01-17

申请号：US11826124

申请日：2007-07-12

申请人： Yong-Hwan Kwon ,  Un-Byoung Kang ,  Chung-Sun Lee ,  Woon-Seong Kwon ,  Hyung-Sun Jang

发明人： Yong-Hwan Kwon ,  Un-Byoung Kang ,  Chung-Sun Lee ,  Woon-Seong Kwon ,  Hyung-Sun Jang

IPC分类号： H01L31/0232

CPC分类号： H01L27/14618 ,  H01L2924/0002 ,  H01L2924/00

摘要： An image sensor package may include a transparent substrate, an image sensor chip having a sensing region disposed over the transparent substrate, a resin protection dam disposed between the image sensor chip and the transparent substrate inside a wiring pattern, the resin protection dam having an aperture formed to expose a sensing region of the image sensor chip and defining a cavity between the sensing region and the transparent substrate, a resin filled on the transparent substrate outside the resin protection dam, and a black matrix pattern disposed on each side of the transparent substrate and configured to block excess transmission of light.

摘要翻译： 图像传感器封装可以包括透明基板，具有设置在透明基板上的感测区域的图像传感器芯片，设置在图像传感器芯片和布线图案内的透明基板之间的树脂保护坝，树脂保护坝具有孔 形成为暴露图像传感器芯片的感测区域并且在感测区域和透明基板之间限定空腔，填充在树脂保护堤外的透明基板上的树脂和布置在透明基板的每一侧上的黑矩阵图案 并且被配置为阻止光的过量透射。

公开(公告)号：US20060091504A1

公开(公告)日：2006-05-04

申请号：US11256650

申请日：2005-10-21

申请人： Un-Byoung Kang ,  Chung-Sun Lee ,  Sa-Yoon Kang ,  Yong-Hwan Kwon

发明人： Un-Byoung Kang ,  Chung-Sun Lee ,  Sa-Yoon Kang ,  Yong-Hwan Kwon

IPC分类号： H01L23/58

CPC分类号： H05K3/3463 ,  H01L24/81 ,  H01L2224/05001 ,  H01L2224/05026 ,  H01L2224/05572 ,  H01L2224/13144 ,  H01L2224/136 ,  H01L2224/16 ,  H01L2224/75 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/75301 ,  H01L2224/8181 ,  H01L2224/81825 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/351 ,  H05K1/189 ,  H05K3/244 ,  H05K3/3436 ,  H05K3/3473 ,  H05K2201/10674 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/05099

摘要： In one embodiment, a film circuit substrate comprises an insulating film made of polyimide resin; a conductive circuit pattern formed on the insulating film, the circuit pattern including an inner lead to be connected with a conductive bump of a semiconductor chip through a bump bonding process; and a tin-indium alloy layer formed on the inner lead to produce an inter-metallic compound layer of AuxSn composition during the bump bonding process.

摘要翻译： 在一个实施例中，薄膜电路基板包括由聚酰亚胺树脂制成的绝缘膜; 形成在所述绝缘膜上的导电电路图案，所述电路图案包括通过凸块接合工艺与半导体芯片的导电凸块连接的内部引线; 以及形成在内部引线上的锡铟合金层，以在凸点焊接工艺期间产生Au / Sn组分的金属间化合物层。

公开(公告)号：US20060202334A1

公开(公告)日：2006-09-14

申请号：US11421680

申请日：2006-06-01

申请人： Yong-Hwan KWON ,  Sa-Yoon Kang ,  Chung-Sun Lee

发明人： Yong-Hwan KWON ,  Sa-Yoon Kang ,  Chung-Sun Lee

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L24/11 ,  H01L23/3114 ,  H01L24/12 ,  H01L24/16 ,  H01L2224/0231 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/05671 ,  H01L2224/13099 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/013

摘要： Provided are a method of forming a bump whose upper surface is substantially flat and whose area can be enlarged in a uniform pad pitch to simplify mounting a liquid crystal display drive IC (LDI) and a semiconductor chip and a mount structure using the method to minimize a pad area inside the chip. Thus, the pad area on an edge of a conventional chip is minimized and the bump is formed in a substantially flat location inside the chip and an electrical connection between the pad and the bump is performed by a redistribution metal line.

摘要翻译： 提供了一种形成凸起的方法，该凸块的上表面基本上是平的，并且其面积可以以均匀的垫间距扩大，以简化安装液晶显示驱动IC（LDI）和半导体芯片以及使用该方法的安装结构 芯片内部的焊盘区域。 因此，传统芯片的边缘上的焊盘区域被最小化，并且凸块形成在芯片内部的基本上平坦的位置，并且焊盘和凸块之间的电连接由再分布金属线执行。

公开(公告)号：US07554201B2

公开(公告)日：2009-06-30

申请号：US11513173

申请日：2006-08-31

申请人： Uu-Byung Kang ,  Yong-Hwan Kwon ,  Jong-Ho Lee ,  Chung-Sun Lee

发明人： Uu-Byung Kang ,  Yong-Hwan Kwon ,  Jong-Ho Lee ,  Chung-Sun Lee

IPC分类号： H01L23/48

CPC分类号： C22C30/06 ,  B23K35/025 ,  B23K35/262 ,  B23K35/264 ,  B23K2101/40 ,  C22C12/00 ,  C22C13/00 ,  C22C13/02 ,  C22C30/02 ,  C22C30/04 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/11 ,  H01L2224/1134 ,  H01L2224/13 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/15787 ,  H05K3/3463 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/00014

摘要： Example embodiments of the present invention relate to an alloy solder and a semiconductor device using the alloy solder. Other example embodiments relate to an alloy solder capable of increasing reliability of a junction between a semiconductor chip and a substrate. According to still In still other example embodiments of the present invention, there may be a tin-bismuth (Sn—Bi) family alloy solder between a semiconductor chip and a substrate, and a semiconductor device using the alloy solder. The semiconductor device may include a semiconductor chip formed with a plurality of gold bumps, a substrate having metal wirings connected to the gold bumps, and a junction including a tin-bismuth family alloy solder interposed between and connecting the gold bump and the metal wiring.

摘要翻译： 本发明的示例性实施例涉及合金焊料和使用该合金焊料的半导体器件。 其他示例实施例涉及能够增加半导体芯片和基板之间的结的可靠性的合金焊料。 根据本发明的另一个示例性实施例，可以在半导体芯片和基板之间存在锡 - 铋（Sn-Bi）族合金焊料，以及使用该合金焊料的半导体器件。 半导体器件可以包括形成有多个金凸块的半导体芯片，具有连接到金凸块的金属布线的基板以及插入在金凸块和金属布线之间并连接金凸块和金属布线的锡 - 铋系合金焊料的接合部。