公开(公告)号：US20190317285A1

公开(公告)日：2019-10-17

申请号：US16473216

申请日：2017-09-12

Applicant: Intel Corporation

Inventor： Shawna M. LIFF ,  Henning BRAUNISCH ,  Timothy A. GOSSELIN ,  Prasanna RAGHAVAN ,  Yikang DENG ,  Zhiguo QIAN

IPC: G02B6/42 ,  F21V8/00 ,  G02B6/293

Abstract: An optoelectronic apparatus is presented. In embodiments, the apparatus may include a package including a substrate with a first side and a second side opposite the first side, wherein the first side comprises a ball grid array (BGA) field. The apparatus may further include one or more integrated circuits (ICs) disposed on the first side of the substrate, inside the BGA field, that thermally interface with a printed circuit board (PCB), to which the package is to be coupled, one or more optical ICs coupled to the second side and communicatively coupled with the one or more ICs via interconnects provided in the substrate, wherein at least one of the optical ICs is at least partially covered by an integrated heat spreader (IHS), to provide dissipation of heat produced by the at least one optical IC.

公开(公告)号：US20170154828A1

公开(公告)日：2017-06-01

申请号：US14953779

申请日：2015-11-30

Applicant: INTEL CORPORATION

Inventor： Timothy A. GOSSELIN ,  Patrick NARDI ,  Kartik SRINIVASAN ,  Amram EITAN ,  Ji Yong PARK ,  Christopher L. RUMER ,  George S. KOSTIEW

IPC: H01L21/66 ,  B23K20/02 ,  B23K20/00 ,  H01L23/00

CPC classification number: H01L22/12 ,  B23K1/0016 ,  B23K20/002 ,  B23K20/026 ,  B23K20/16 ,  B23K20/233 ,  B23K20/24 ,  B23K20/26 ,  B23K31/12 ,  B23K2101/42 ,  H01L22/20 ,  H01L24/14 ,  H01L24/75 ,  H01L2224/81192 ,  H01L2924/351

Abstract: A method and machine-readable medium including non-transitory program instructions that when executed by a processor cause the processor to perform a method including measuring at least one parameter of a substrate or a die; and establishing or modifying a thermal compression bonding recipe based on the at least one parameter, wherein the thermal compression bonding recipe is operable for thermal compression bonding of the die and the substrate. A thermal compression bonding tool including a pedestal operable to hold a substrate during a thermal compression bonding process and a bond head operable to engage a die, the tool including a controller machine readable instructions to process a substrate and a die combination, the instructions including an algorithm to implement or modify a thermal compression bonding process based on a parameter of a substrate or die.

公开(公告)号：US20180358296A1

公开(公告)日：2018-12-13

申请号：US15778398

申请日：2015-12-22

Applicant: INTEL CORPORATION

Inventor： Eric J. LI ,  Nitin DESHPANDE ,  Shawna M. LIFF ,  Omkar KARHADE ,  Amram EITAN ,  Timothy A. GOSSELIN

IPC: H01L23/538 ,  H01L23/367 ,  H01L21/48

CPC classification number: H01L23/5381 ,  H01L21/4853 ,  H01L21/4871 ,  H01L23/13 ,  H01L23/36 ,  H01L23/367 ,  H01L23/48 ,  H01L23/5385 ,  H01L23/5386 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/92 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/0612 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/92125 ,  H01L2924/15159 ,  H01L2924/014 ,  H01L2924/00014

Abstract: An electronic assembly that includes a substrate having an upper surface and a bridge that includes an upper surface. The bridge is within a cavity in the upper surface of the substrate. A first electronic component is attached to the upper surface of the bridge and the upper surface of the substrate and a second electronic component is attached to the upper surface of the bridge and the upper surface of the substrate, wherein the bridge electrically connects the first electronic component to the second electronic component.