公开(公告)号：US20250062168A1

公开(公告)日：2025-02-20

申请号：US18451852

申请日：2023-08-18

Applicant: Intel Corporation

Inventor： Justin WHETTEN ,  Zhou YANG ,  Zheng KANG ,  Haowen LIU ,  Bassam ZIADEH ,  Vijay Krishnan SUBRAMANIAN ,  John HARPER ,  Pramod MALATKAR ,  Patrick NARDI ,  Anthony MONTERROSA ,  Michael TAN ,  Sean BUSHELL

IPC: H01L23/24 ,  B23K26/362 ,  H01L21/268 ,  H01L21/67

Abstract: The present disclosure is directed to a patterned stiffener that includes a metallic body, which is a component of and is attached to a semiconductor device platform for providing rigidity. In an aspect, there are patterned sections formed on the metallic body that act to modulate the metallic body to obtain a desired configuration for the semiconductor device platform. In another aspect, the present disclosure is also directed to a method that includes providing a platform for forming an electronic component, disposing a stiffener having a metallic body on the platform, disposing at least one semiconductor device onto the platform, performing one or more bonding process steps, and exposing the stiffener to localized heating to modulate changes in the stiffener to a pre-determined shape or desired configuration.

公开(公告)号：US20160095209A1

公开(公告)日：2016-03-31

申请号：US14498958

申请日：2014-09-26

Applicant: Intel Corporation

Inventor： Robert STARKSTON ,  John GUZEK ,  Patrick NARDI ,  Keith JONES ,  Javier SOTO GONZALEZ

IPC: H05K1/02 ,  H01L23/498 ,  H05K1/18 ,  H01L21/48 ,  H05K1/11 ,  H01L23/31 ,  H01L23/00

CPC classification number: H05K1/0271 ,  H01L23/16 ,  H01L23/49833 ,  H01L23/562 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2924/15311 ,  H05K3/0052 ,  H05K3/0097 ,  H05K3/284 ,  H05K2201/09136 ,  H05K2201/10977 ,  H05K2201/2009

Abstract: Techniques are disclosed for forming a package substrate with integrated stiffener. A panel of package substrates are provided. An adhesion layer is then formed on each package substrate of the panel of package substrates. A panel of stiffeners are then attached to the panel of package substrates by the adhesion layer, each stiffener corresponding to a respective package substrate. The panel of package substrates is then singulated into individual package substrates with integrated stiffeners. The stiffeners on the singulated package substrates include tabs that extend to the edges of the package substrates.

Abstract translation: 公开了用于形成具有集成的加强件的封装衬底的技术。 提供了一组封装基板。 然后在封装衬底面板的每个封装衬底上形成粘附层。 然后，通过粘合层将一块扶强材板附接到封装基板的面板，每个加强件对应于相应的封装基板。 然后将封装衬底的面板分成具有集成的加强件的单个封装衬底。 单个封装衬底上的加强件包括延伸到封装衬底的边缘的突片。

公开(公告)号：US20250105114A1

公开(公告)日：2025-03-27

申请号：US18373879

申请日：2023-09-27

Applicant: Intel Corporation

Inventor： Alexander W. HUETTIS ,  Patrick NARDI ,  Abid AMEEN ,  Jiaqi WU ,  Andrew W. CARLSON

IPC: H01L23/498

Abstract: Embodiments disclosed herein include systems with interconnects that comprise four or more different interconnect types. In an embodiment, an apparatus comprises a substrate and a ball grid array across a surface of the substrate. In an embodiment, the ball grid array comprises first interconnects in a first region of the ball grid array, second interconnects in a second region of the ball grid array, third interconnects in a third region of the ball grid array, and fourth interconnects in a fourth region of the ball grid array. In an embodiment, the first interconnects, the second interconnects, the third interconnects, and the fourth interconnects all have a difference in one or more of a composition, a dimension, and a structure.

公开(公告)号：US20170154828A1

公开(公告)日：2017-06-01

申请号：US14953779

申请日：2015-11-30

Applicant: INTEL CORPORATION

Inventor： Timothy A. GOSSELIN ,  Patrick NARDI ,  Kartik SRINIVASAN ,  Amram EITAN ,  Ji Yong PARK ,  Christopher L. RUMER ,  George S. KOSTIEW

IPC: H01L21/66 ,  B23K20/02 ,  B23K20/00 ,  H01L23/00

CPC classification number: H01L22/12 ,  B23K1/0016 ,  B23K20/002 ,  B23K20/026 ,  B23K20/16 ,  B23K20/233 ,  B23K20/24 ,  B23K20/26 ,  B23K31/12 ,  B23K2101/42 ,  H01L22/20 ,  H01L24/14 ,  H01L24/75 ,  H01L2224/81192 ,  H01L2924/351

Abstract: A method and machine-readable medium including non-transitory program instructions that when executed by a processor cause the processor to perform a method including measuring at least one parameter of a substrate or a die; and establishing or modifying a thermal compression bonding recipe based on the at least one parameter, wherein the thermal compression bonding recipe is operable for thermal compression bonding of the die and the substrate. A thermal compression bonding tool including a pedestal operable to hold a substrate during a thermal compression bonding process and a bond head operable to engage a die, the tool including a controller machine readable instructions to process a substrate and a die combination, the instructions including an algorithm to implement or modify a thermal compression bonding process based on a parameter of a substrate or die.

公开(公告)号：US20230307379A1

公开(公告)日：2023-09-28

申请号：US17703768

申请日：2022-03-24

Applicant: Intel Corporation

Inventor： Phil GENG ,  Patrick NARDI ,  Ravindranath V. MAHAJAN ,  Dingying David XU ,  Prasanna RAGHAVAN ,  John HARPER ,  Sanjoy SAHA ,  Yang JIAO

IPC: H01L23/00 ,  H01L23/498

CPC classification number: H01L23/562 ,  H01L23/49816

Abstract: Embodiments disclosed herein include an electronic package. In an embodiment, the electronic package comprises a package substrate, and a die coupled to the package substrate. In an embodiment, the electronic package further comprises a stiffener on the package substrate surrounding the die. In an embodiment, the stiffener is a ring with one or more corner regions and one or more beams. In an embodiment, each beam is between a pair of corner regions, and the one or more corner regions have a first thickness and the one or more beams have a second thickness that is greater than the first thickness.

公开(公告)号：US20190103345A1

公开(公告)日：2019-04-04

申请号：US15721707

申请日：2017-09-29

Applicant: Intel Corporation

Inventor： Kyle YAZZIE ,  Venkata Suresh R. GUTHIKONDA ,  Patrick NARDI ,  Santosh SANKARASUBRAMANIAN ,  Kevin Y. LIN ,  Leigh M. TRIBOLET ,  John L. HARPER ,  Pramod MALATKAR

IPC: H01L23/498 ,  H01L23/367 ,  H01L21/50 ,  H01L23/52 ,  H01L23/00 ,  H05K1/02

Abstract: An apparatus, comprising a first platform comprising a first working surface having a first non-planar portion; and a second platform comprising a second working surface having a second non-planar portion, wherein: the second working surface is opposite the first working surface, a distance between the first working surface and the second working surface is adjustable, the first non-planar portion comprises a first curved portion, and the second non-planar portion comprises a second curved portion opposite the first curved portion.