公开(公告)号：US4914950A

公开(公告)日：1990-04-10

申请号：US259321

申请日：1988-10-18

申请人： Ikuo Uematsu ,  Masao Fukunaga ,  Akiomi Kohno

发明人： Ikuo Uematsu ,  Masao Fukunaga ,  Akiomi Kohno

IPC分类号： F16L49/00 ,  G01F1/58 ,  G01F15/18

CPC分类号： F16L49/00 ,  G01F1/58 ,  G01F15/185

摘要： A ceramic conduit with a metal outer tube is joined to bonding rings through insert members between end surfaces of the rings and annular bonding surfaces, with the annular bonding surface being not parallel to the axis of the conduit and the insert member being bonded to the ring and conduit. The rings are joined to the outer tube through welds between forward ends of annular protrusions provided in end surfaces which are the reverse surfaces of the surface bonded with the insert members and the forward ends of annular protrusions provided in axial end surfaces of the outer tube. The inner periphery of the outer tube is fitted on the outer periphery of the conduit with a small gap therebetween. The rings are bonded to the conduit with the insert members by being pressed against the conduit in the axial direction of the conduit and only a small quantity of heat is transmitted from the welds to other portions. The outer tube is joined to the rings through portions having a low rigidity to achieve a highly reliable metal and ceramic bonding is achieved and the bonded surfaces are not deteriorated by the welding nor is the outer tube deformed by the welding heat, and an external load is not substantially transmitted to the bonded surfaces.

摘要翻译： 具有金属外管的陶瓷导管通过环的端表面之间的插入构件和环形接合表面连接到结合环，环形接合表面不平行于导管的轴线并且插入构件结合到环 和导管。 这些环通过设置在端面的环形突起的前端之间的焊接部分与外管接合，端面是与插入件接合的表面的相反表面，以及设置在外管的轴向端面中的环形突起的前端。 外管的内周与导管的外周嵌合，间隙较小。 通过在管道的轴向方向上被压靠在管道上，环通过插入件结合到导管上，并且只有少量的热量从焊缝传递到其它部分。 外管通过具有低刚度的部分连接到环，以实现高可靠性的金属，并且实现陶瓷接合，并且接合表面不会由于焊接而劣化，也不会由于焊接热而导致外管变形，并且外部负载 基本上不传递到接合表面。

公开(公告)号：US5233260A

公开(公告)日：1993-08-03

申请号：US913348

申请日：1992-07-15

申请人： Takeshi Harada ,  Akiomi Kohno ,  Akiomi Kohno ,  Shigeru Jomura

发明人： Takeshi Harada ,  Akiomi Kohno ,  Akiomi Kohno ,  Shigeru Jomura

IPC分类号： H01L41/047 ,  H01L41/083 ,  H01L41/297

CPC分类号： H01L41/297 ,  H01L41/0477 ,  H01L41/083 ,  Y10T29/42

摘要： In an overall stacked piezoelectric element, the material for the electrode was selected from aluminum, nickel and copper each alone or alloys based on aluminum, nickel or copper, and further the parts of the electrodes which contact with molding resin on the side face of the stacked body and the parts which have to be insulated from the lead-out terminals were subjected to an oxidation or nitriding treatment. As the result, an improved element was obtained which is of a high reliability, suited to low voltage operation and suffers no short-circuit of the electrodes even when water permeates to the side face of the stacked body during operation in a humid atmosphere.

摘要翻译： 在整体堆叠的压电元件中，用于电极的材料单独选自铝，镍和铜或基于铝，镍或铜的合金，还有在模制树脂的侧面上与模制树脂接触的部分 堆叠体和必须与引出端子绝缘的部件进行氧化或氮化处理。 结果，获得了具有高可靠性的改进元件，其适用于低电压操作，并且即使当在潮湿气氛中操作期间水渗透到堆叠体的侧面时也不会发生电极的短路。

公开(公告)号：US5400659A

公开(公告)日：1995-03-28

申请号：US12472

申请日：1993-02-02

申请人： Kazuaki Yokoi ,  Masatsugu Arai ,  Akiomi Kohno ,  Yuji Yoshitomi ,  Yutaka Sakurai ,  Tamio Ishihara

发明人： Kazuaki Yokoi ,  Masatsugu Arai ,  Akiomi Kohno ,  Yuji Yoshitomi ,  Yutaka Sakurai ,  Tamio Ishihara

IPC分类号： C04B37/02 ,  G01F1/58

CPC分类号： G01F1/588 ,  C04B35/645 ,  C04B35/653 ,  C04B37/021 ,  G01F1/584 ,  C04B2235/6567 ,  C04B2237/34 ,  C04B2237/343 ,  C04B2237/348 ,  C04B2237/365 ,  C04B2237/368 ,  C04B2237/402 ,  C04B2237/704 ,  C04B2237/706 ,  C04B2237/765

摘要： An electromagnetic flowmeter comprises a ceramic measuring tube through which fluid to be measured flows, a pair of electromagnetic coils disposed on the outer surface of the measuring tube in the central region thereof at diametrically opposite positions and generating a magnetic field in a direction perpendicular to the direction of flow of the fluid, a pair of measuring electrodes fixed to the outer surface of the measuring tube in the central region thereof at diametrically opposite positions and having electrode axes perpendicular to both the direction of flow of the fluid and the direction of the magnetic field, and a pair of metallic shields fixed to the outer surface of the measuring tube in surrounding relation to the measuring electrodes. A pair of the measuring electrodes and a pair of the metallic shields are fixed to the ceramic measuring tube by a reaction product due to an interface reaction with the ceramic measuring tube under heating.

摘要翻译： 电磁流量计包括陶瓷测量管，待测量的流体流过测量管的外表面上的一对电磁线圈，其中心区域在直径相对的位置处设置在测量管的外表面上，并在垂直于该测量管的方向上产生磁场 流体的流动方向，一对测量电极在其中心区域的直径相对的位置处固定在测量管的外表面上，并且具有垂直于流体的流动方向和磁性方向两者的电极轴线 以及与测量电极相关的固定到测量管的外表面的一对金属屏蔽件。 一对测量电极和一对金属屏蔽件由于与陶瓷测量管在加热下的界面反应而被反应产物固定在陶瓷测量管上。

公开(公告)号：US4871107A

公开(公告)日：1989-10-03

申请号：US140224

申请日：1987-12-31

申请人： Toshihiro Yamada ,  Akiomi Kohno

发明人： Toshihiro Yamada ,  Akiomi Kohno

IPC分类号： B23K20/00 ,  C04B37/00 ,  C04B37/02

CPC分类号： C04B37/006 ,  C04B37/026 ,  C04B2235/6581 ,  C04B2237/121 ,  C04B2237/346 ,  C04B2237/348 ,  C04B2237/36 ,  C04B2237/365 ,  C04B2237/368 ,  C04B2237/401 ,  C04B2237/402 ,  C04B2237/406 ,  C04B2237/407 ,  C04B2237/61 ,  C04B2237/64 ,  C04B2237/704 ,  C04B2237/708 ,  C04B2237/72 ,  C04B2237/76

摘要： A three-layer clad plate or a laminated sheet comprising a core piece made of aluminum or its alloy and surfaces made of an aluminum-silicon alloy is inserted between the bonding surfaces of ceramics or between the bonding surface of a ceramic and that of a metal. The resulting structure is maintained at a bonding temperature lower than the melting point of aluminum or its alloy and higher than the solidus of the aluminum-silicon alloy while pressurizing the inserting material, thus bonding the ceramics to each other or the ceramic to the metal.

摘要翻译： 在陶瓷的接合面或陶瓷的接合面与金属的接合面之间插入由铝或其合金构成的芯片及由铝 - 硅合金制成的表面的三层复合板或层叠片 。 所得到的结构在对铝或其合金的熔点低于铝 - 硅合金的固相线的粘合温度下进行保持，同时对插入材料加压，从而将陶瓷彼此或陶瓷结合到金属上。

公开(公告)号：US5358032A

公开(公告)日：1994-10-25

申请号：US13423

申请日：1993-02-04

申请人： Masatsugu Arai ,  Akiomi Kohno ,  Toshio Hatada ,  Yoshihiro Kondo ,  Toshihiro Komatsu ,  Kanji Otsuka ,  Yuji Shirai ,  Susumu Iwai

发明人： Masatsugu Arai ,  Akiomi Kohno ,  Toshio Hatada ,  Yoshihiro Kondo ,  Toshihiro Komatsu ,  Kanji Otsuka ,  Yuji Shirai ,  Susumu Iwai

IPC分类号： H01L23/36 ,  F28F3/02 ,  H01L23/367 ,  H01L23/467 ,  F28F7/00

CPC分类号： F28F3/022 ,  H01L23/3677 ,  H01L2224/45015 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L24/45 ,  H01L24/49 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/16195

摘要： Disclosed is an LSI package cooling heat sink having a heat diffusion plate and thin wire fins joined to the heat diffusion plate. The heat sink is mounted on an LSI package and the LSI package is cooled by the flowing of fluid through the thin wire fins. The wire fins are made of a net formed of longitudinal thin wires intersecting with horizontal thin wires. The net is formed to continuous rectangular shapes or a swirl shape and joined to the heat diffusion plate. The net is constituted so that the number of the thin wires vertical to the heat diffusion plate is larger than the number of the thin wires parallel thereto and the net is joined to the heat diffusion plate by brazing, diffusion joint, pressure welding or the like. Since the heat sink is formed of the net composed of the longitudinal thin wires intersecting with the horizontal thin wires, the irregular portions of the adjacent thin wires are formed at a dislocated position and fluid striking against the thin wires produces many turbulent flows so that a high heat transfer performance can be obtained. Further, since the net formed of the thin wires is used, the size of cooling fins can be reduced and noise can be also lowered. Further, it is possible to produce an LSI package cooling heat sink in a short time which heat sink is excellent in mass-production.

摘要翻译： 公开了具有热扩散板的LSI封装冷却散热器和与散热板接合的细线散热片。 散热器安装在LSI封装上，并且LSI封装通过流体流过细金属丝散热片来冷却。 金属丝散热片由与水平细线相交的纵向细线形成的网构成。 网形成为连续的矩形形状或漩涡形状并且连接到热扩散板。 网构成为与散热板垂直的细线的数量大于与其平行的细线的数量，并且网通过钎焊，扩散接头，压焊等连接到热扩散板 。 由于散热器由与横向细线相交的纵向细线组成的网形成，所以相邻细线的不规则部分形成在脱位位置，并且撞击细线的流体产生许多湍流，使得 可以获得高的传热性能。 此外，由于使用由细线形成的网，所以能够降低散热片的尺寸，降低噪音。 此外，可以在短时间内制造LSI封装冷却散热器，散热器的批量生产性优异。

公开(公告)号：US5188280A

公开(公告)日：1993-02-23

申请号：US812024

申请日：1991-12-23

申请人： Takashi Nakao ,  Yoshiaki Emoto ,  Koichiro Sekiguchi ,  Masayuki Iketani ,  Kunizo Sahara ,  Ikuo Yoshida ,  Akiomi Kohno ,  Masaya Horino ,  Hideaki Kamohara ,  Shouichi Irie ,  Hiroshi Akasaki ,  Kanji Otsuka

发明人： Takashi Nakao ,  Yoshiaki Emoto ,  Koichiro Sekiguchi ,  Masayuki Iketani ,  Kunizo Sahara ,  Ikuo Yoshida ,  Akiomi Kohno ,  Masaya Horino ,  Hideaki Kamohara ,  Shouichi Irie ,  Hiroshi Akasaki ,  Kanji Otsuka

IPC分类号： H01L21/48 ,  H01L21/60 ,  H01L23/055 ,  H01L23/498 ,  H05K3/34

CPC分类号： H01L24/81 ,  H01L21/4853 ,  H01L23/055 ,  H01L23/49816 ,  H05K3/3478 ,  H01L2224/11003 ,  H01L2224/13111 ,  H01L2224/136 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/166 ,  H05K2203/0113 ,  H05K2203/016 ,  H05K2203/0338 ,  H05K2203/041 ,  H05K3/3489

摘要： A technique for producing a chip mount type package or a TAB package with high reliability, without use of a flux which would cause environmental pollution or would hinder an enhancement of reliability, more particularly pertains to a method of irradiating bonding surfaces, for which a solder is used, and solder bump electrodes of a package with an atomic or ion energy beam, and bonding the bonding surfaces to each other under normal pressure (about 1 atm) in a continuous apparatus.

摘要翻译： 具有高可靠性的芯片安装型封装或TAB封装的生产技术，不使用会导致环境污染或阻碍可靠性提高的焊剂，更具体地涉及一种照射焊接面的方法，焊接面 以及具有原子或离子能量束的封装的焊料凸块电极，并且在连续设备中在常压（约1atm）下将结合表面彼此粘合。

公开(公告)号：US5163209A

公开(公告)日：1992-11-17

申请号：US510875

申请日：1990-04-18

申请人： Takeshi Harada ,  Masatoshi Kanamaru ,  Akiomi Kohno ,  Shigeru Jomura

发明人： Takeshi Harada ,  Masatoshi Kanamaru ,  Akiomi Kohno ,  Shigeru Jomura

IPC分类号： H01L41/047 ,  H01L41/083 ,  H01L41/297

CPC分类号： H01L41/297 ,  H01L41/0477 ,  H01L41/083 ,  Y10T29/42

摘要： In an overall stacked piezoelectric element, the material for the electrode was selected from aluminum, nickel and copper each alone or alloys based on aluminum, nickel or copper, and further the parts of the electrode which contact with molding resin on the side face of the stacked body and the parts which have to be insulated from the lead-out terminals were subjected to an oxidation or nitriding treatment. As the result, an improved element was obtained which is of a high reliability, suited to low voltage operation and suffers no short-circuit of the electrode even when water permeates to the side face of the stacked body during operation in humid atmosphere.

公开(公告)号：US5090609A

公开(公告)日：1992-02-25

申请号：US514943

申请日：1990-04-26

申请人： Takashi Nakao ,  Yoshiaki Emoto ,  Koichiro Sekiguchi ,  Masayuki Iketani ,  Kunizo Sahara ,  Ikuo Yoshida ,  Akiomi Kohno ,  Masaya Horino ,  Hideaki Kamohara ,  Shouichi Irie ,  Hiroshi Akasaki ,  Kanji Otsuka

发明人： Takashi Nakao ,  Yoshiaki Emoto ,  Koichiro Sekiguchi ,  Masayuki Iketani ,  Kunizo Sahara ,  Ikuo Yoshida ,  Akiomi Kohno ,  Masaya Horino ,  Hideaki Kamohara ,  Shouichi Irie ,  Hiroshi Akasaki ,  Kanji Otsuka

IPC分类号： H01L21/48 ,  H01L21/60 ,  H01L23/055 ,  H01L23/498 ,  H05K3/34

CPC分类号： H01L24/81 ,  H01L21/4853 ,  H01L23/055 ,  H01L23/49816 ,  H05K3/3478 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/13111 ,  H01L2224/136 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/166 ,  H05K2203/0113 ,  H05K2203/016 ,  H05K2203/0338 ,  H05K2203/041 ,  H05K3/3489

摘要： An invention relating to a technique for producing a chip mount type package or a TAB package with high reliability, without use of a flux which would cause environmental pollution or would hinder an enhancement of reliability, and more particularly pertaining to a method of irradiating bonding surfaces, for which a solder is used, and solder bump electrodes of a package with an atomic or ion energy beam and bonding the bonding surfaces to each other under normal pressure (about 1 atm) in a continuous apparatus.

摘要翻译： 本发明涉及一种具有高可靠性的芯片安装型封装或TAB封装的生产技术，而不使用会引起环境污染或阻碍可靠性提高的焊剂，更具体地涉及一种照射焊接表面的方法 ，以及具有原子或离子能量束的封装的焊料凸块电极，并且在连续设备中在常压（约1atm）下将结合表面彼此粘合。

公开(公告)号：US5964398A

公开(公告)日：1999-10-12

申请号：US929089

申请日：1997-09-15

申请人： Akiomi Kohno ,  Kazuaki Yokoi ,  Keiji Taguchi ,  Hiroshi Misumi ,  Yoshiharu Ueyama ,  Kazuyuki Koide ,  Koji Hayashi

发明人： Akiomi Kohno ,  Kazuaki Yokoi ,  Keiji Taguchi ,  Hiroshi Misumi ,  Yoshiharu Ueyama ,  Kazuyuki Koide ,  Koji Hayashi

IPC分类号： B23K20/00 ,  B23K20/02 ,  B23K20/16 ,  C21D1/00 ,  C21D9/00 ,  F04D29/02 ,  F04D29/22 ,  F04D29/28 ,  F04D29/54 ,  B23K31/00 ,  B23P15/04

CPC分类号： B23K20/023 ,  B23K20/16 ,  F04D29/023 ,  F04D29/026 ,  F04D29/2222 ,  F04D29/284 ,  F05D2230/236 ,  F05D2300/10 ,  F05D2300/11 ,  F05D2300/171 ,  Y10T29/49325 ,  Y10T29/49336

摘要： A vane member comprises a first member and a second member, the first member and the second member are joined by that an insert member whose melting temperature is lower than melting temperatures of the first and second members contacts the first and second members, the insert member is heated to a welding temperature which is lower than the melting temperatures of the first and second members and is higher than the melting temperature of the insert member so that a mutual diffusion between at least an original base component of the insert member and at least an original base component of the first member different from the original base component of the insert member and a mutual diffusion between at least the original base component of the insert member and at least an original base component of the second member different from the original base component of the insert member are caused by the heating, and the mutual diffusions by the heating are continued at least until the original base component of the insert member is replaced by at least one of the original base components of the first member and the second member and the at least one of the original base components of the first member and the second member becomes a substitute base component of the insert member.

摘要翻译： 叶片构件包括第一构件和第二构件，第一构件和第二构件通过熔化温度低于第一和第二构件的熔化温度的插入构件接合第一和第二构件而接合，插入构件 被加热到低于第一和第二构件的熔化温度的焊接温度并且高于插入构件的熔化温度，使得至少插入构件的原始基底部件和至少一个 第一构件的原始基座部件与插入构件的原始基座部件不同，并且至少在插入构件的原始基座部件和至少与第二构件的原始基座部件之间的相互扩散不同于原始基座部件 插入构件由加热引起，并且通过加热的相互扩散继续至少直到原始 插入构件的基部构件被第一构件和第二构件的原始基座构件中的至少一个代替，并且第一构件和第二构件的原始基础构件中的至少一个成为第二构件的替代基础构件 插入成员。

公开(公告)号：US5276573A

公开(公告)日：1994-01-04

申请号：US801352

申请日：1991-12-02

申请人： Takeshi Harada ,  Masatoshi Kanamaru ,  Atsushi Hosogane ,  Akiomi Kohno ,  Kenji Mori

发明人： Takeshi Harada ,  Masatoshi Kanamaru ,  Atsushi Hosogane ,  Akiomi Kohno ,  Kenji Mori

IPC分类号： G11B5/60 ,  G11B21/21

CPC分类号： G11B5/6005 ,  G11B21/21 ,  G11B5/483

摘要： A slider unit having a reading or reproducing head, with the head being adapted to float over a surface of an information recording disc. The slider unit includes a slider body having a flying height sensor with float surfaces on an underside thereof to generate a lifting force. A piezoelectrically or electrostatically controlled valve layer may be positioned over a vent communicating between an upper surface of the slider, with the vent opening to a recess for generating a negative lift component at an underside of the slider unit. The slider body is made from a ceramic base portion and includes a semiconductive insert portion of, for example, silicon or a photosensitive glass with an adjustment device being formed by utilization of microfabrication techniques such as deposition and etching.

摘要翻译： 具有读取或再现头的滑块单元，其头部适于在信息记录盘的表面上浮动。 滑块单元包括具有飞行高度传感器的滑块体，浮体表面在其下侧以产生提升力。 压电或静电控制的阀层可以位于在滑块的上表面之间连通的通风口上，通气口通向凹槽，用于在滑块单元的下侧产生负提升部件。 滑块体由陶瓷基部制成，并且包括例如硅或感光玻璃的半导体插入部分，其中调整装置通过利用诸如沉积和蚀刻的微细加工技术形成。