公开(公告)号：US07888184B2

公开(公告)日：2011-02-15

申请号：US12473233

申请日：2009-05-27

申请人： Il Kwon Shim ,  Seng Guan Chow ,  Heap Hoe Kuan ,  Seung Uk Yoon ,  Jong-Woo Ha

发明人： Il Kwon Shim ,  Seng Guan Chow ,  Heap Hoe Kuan ,  Seung Uk Yoon ,  Jong-Woo Ha

IPC分类号： H01L21/00 ,  H01L23/10

CPC分类号： H01L24/19 ,  H01L21/568 ,  H01L21/6835 ,  H01L24/96 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/105 ,  H01L2221/68345 ,  H01L2223/6677 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/20 ,  H01L2224/97 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2224/82 ,  H01L2924/00

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a shaped platform with a conductive post; mounting the shaped platform with the conductive post over a temporary carrier; mounting an integrated circuit device over the temporary carrier; encapsulating the conductive post and the integrated circuit device; removing a portion of the shaped platform isolating the conductive post; and removing the temporary carrier.

摘要翻译： 一种制造集成电路封装系统的方法，包括：提供具有导电柱的成形平台; 将具有导电柱的成形平台安装在临时载体上; 将集成电路装置安装在临时载体上; 封装导电柱和集成电路器件; 去除隔离导电柱的成形平台的一部分; 并移除临时载体。

公开(公告)号：US20090315170A1

公开(公告)日：2009-12-24

申请号：US12473233

申请日：2009-05-27

申请人： Il Kwon Shim ,  Seng Guan Chow ,  Heap Hoe Kuan ,  Seung Uk Yoon ,  Jong-Woo Ha

发明人： Il Kwon Shim ,  Seng Guan Chow ,  Heap Hoe Kuan ,  Seung Uk Yoon ,  Jong-Woo Ha

IPC分类号： H01L23/50 ,  H01L21/56 ,  H01L21/98 ,  H01L21/50

CPC分类号： H01L24/19 ,  H01L21/568 ,  H01L21/6835 ,  H01L24/96 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/105 ,  H01L2221/68345 ,  H01L2223/6677 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/20 ,  H01L2224/97 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2224/82 ,  H01L2924/00

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a shaped platform with a conductive post; mounting the shaped platform with the conductive post over a temporary carrier; mounting an integrated circuit device over the temporary carrier; encapsulating the conductive post and the integrated circuit device; removing a portion of the shaped platform isolating the conductive post; and removing the temporary carrier.

摘要翻译： 一种制造集成电路封装系统的方法，包括：提供具有导电柱的成形平台; 将具有导电柱的成形平台安装在临时载体上; 将集成电路装置安装在临时载体上; 封装导电柱和集成电路器件; 去除隔离导电柱的成形平台的一部分; 并移除临时载体。

公开(公告)号：US08957530B2

公开(公告)日：2015-02-17

申请号：US13023293

申请日：2011-02-08

申请人： Il Kwon Shim ,  Seng Guan Chow ,  Heap Hoe Kuan ,  Seung Uk Yoon ,  Jong-Woo Ha

发明人： Il Kwon Shim ,  Seng Guan Chow ,  Heap Hoe Kuan ,  Seung Uk Yoon ,  Jong-Woo Ha

IPC分类号： H01L23/02 ,  H01L23/48 ,  H01L23/00 ,  H01L21/683 ,  H01L25/065 ,  H01L25/10

CPC分类号： H01L24/19 ,  H01L21/568 ,  H01L21/6835 ,  H01L24/96 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/105 ,  H01L2221/68345 ,  H01L2223/6677 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/20 ,  H01L2224/97 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2224/82 ,  H01L2924/00

摘要： An integrated circuit packaging system includes: an integrated circuit device; a conductive post adjacent the integrated circuit device, the conductive post with a contact surface having characteristics of a shaped platform removed; and an encapsulant around the conductive post and the integrated circuit device with the conductive post extending through the encapsulant and each end of the conductive post exposed from the encapsulant.

摘要翻译： 一种集成电路封装系统，包括：集成电路器件; 邻近集成电路器件的导电柱，具有去除成形平台特征的接触表面的导电柱; 以及围绕导电柱和集成电路器件的密封剂，其中导电柱延伸穿过密封剂并且从密封剂暴露出的导电柱的每个端部。

公开(公告)号：US20110127678A1

公开(公告)日：2011-06-02

申请号：US13023293

申请日：2011-02-08

申请人： Il Kwon Shim ,  Seng Guan Chow ,  Heap Hoe Kuan ,  Seung Uk Yoon ,  Jong-Woo Ha

发明人： Il Kwon Shim ,  Seng Guan Chow ,  Heap Hoe Kuan ,  Seung Uk Yoon ,  Jong-Woo Ha

IPC分类号： H01L23/50

CPC分类号： H01L24/19 ,  H01L21/568 ,  H01L21/6835 ,  H01L24/96 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/105 ,  H01L2221/68345 ,  H01L2223/6677 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/20 ,  H01L2224/97 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2224/82 ,  H01L2924/00

摘要： An integrated circuit packaging system includes: an integrated circuit device; a conductive post adjacent the integrated circuit device, the conductive post with a contact surface having characteristics of a shaped platform removed; and an encapsulant around the conductive post and the integrated circuit device with the conductive post extending through the encapsulant and each end of the conductive post exposed from the encapsulant.

摘要翻译： 一种集成电路封装系统，包括：集成电路器件; 邻近集成电路器件的导电柱，具有去除成形平台特征的接触表面的导电柱; 以及围绕导电柱和集成电路器件的密封剂，其中导电柱延伸穿过密封剂并且从密封剂暴露出的导电柱的每个端部。

公开(公告)号：US08354746B2

公开(公告)日：2013-01-15

申请号：US13174033

申请日：2011-06-30

申请人： Rui Huang ,  Il Kwon Shim ,  Seng Guan Chow ,  Heap Hoe Kuan

发明人： Rui Huang ,  Il Kwon Shim ,  Seng Guan Chow ,  Heap Hoe Kuan

IPC分类号： H01L21/00

CPC分类号： H01L23/49811 ,  H01L21/56 ,  H01L21/561 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49833 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L24/48 ,  H01L24/96 ,  H01L24/97 ,  H01L25/105 ,  H01L2221/68345 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor package is made using a prefabricated post carrier including a base plate and plurality of conductive posts. A film encapsulant is disposed over the base plate of the post carrier and around the conductive posts. A semiconductor die is mounted to a temporary carrier. The post carrier and temporary carrier are pressed together to embed the semiconductor die in the film encapsulant. The semiconductor die is disposed between the conductive posts in the film encapsulant. The temporary carrier and base plate of the post carrier are removed. A first circuit build-up layer is formed over a first side of the film encapsulant. The first circuit build-up layer is electrically connected to the conductive posts. A second circuit build-up layer is formed over a second side of the film encapsulant opposite the first side. The second circuit build-up layer is electrically connected to the conductive posts.

摘要翻译： 使用包括基板和多个导电柱的预制柱载体制成半导体封装。 胶片密封剂设置在柱载体的基板上并且在导电柱周围。 半导体管芯安装到临时载体上。 将载体和临时载体压在一起以将半导体管芯嵌入膜密封剂中。 半导体管芯设置在膜密封剂的导电柱之间。 卸载载体的临时载体和基板。 在膜密封剂的第一侧上形成第一电路堆积层。 第一电路堆积层电连接到导电柱。 第二电路堆积层形成在与第一侧相对的膜密封剂的第二侧上。 第二电路堆积层电连接到导电柱。

公开(公告)号：US20100224974A1

公开(公告)日：2010-09-09

申请号：US12714291

申请日：2010-02-26

申请人： Il Kwon Shim ,  Seng Guan Chow ,  Heap Hoe Kuan

发明人： Il Kwon Shim ,  Seng Guan Chow ,  Heap Hoe Kuan

IPC分类号： H01L23/52 ,  H01L21/70

CPC分类号： H01L23/49816 ,  H01L23/3128 ,  H01L23/49822 ,  H01L23/49827 ,  H01L25/105 ,  H01L2224/14181 ,  H01L2224/16225 ,  H01L2224/1703 ,  H01L2224/17181 ,  H01L2224/17519 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/3511 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/0401

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a package substrate having a component side and a system side; depositing a solder resist layer on the component side of the package substrate; patterning groups of access openings and a die mount opening in the solder resist layer; attaching an integrated circuit die in the die mount opening; forming conductive contacts in the access openings; and attaching system interconnects to the system side of the package substrate including controlling a coplanarity of the system interconnects by the solder resist layer.

摘要翻译： 一种集成电路封装系统的制造方法，包括：提供具有元件侧和系统侧的封装基板; 在所述封装衬底的所述元件侧上沉积阻焊层; 在阻焊层中形成存取开口的组和模具安装开口; 将集成电路管芯安装在管芯安装口中; 在所述进入开口中形成导电触点; 以及将系统互连件附接到封装衬底的系统侧，包括通过阻焊层控制系统互连的共面性。

公开(公告)号：US20100144101A1

公开(公告)日：2010-06-10

申请号：US12329430

申请日：2008-12-05

申请人： Seng Guan Chow ,  Il Kwon Shim ,  Heap Hoe Kuan ,  Rui Huang

发明人： Seng Guan Chow ,  Il Kwon Shim ,  Heap Hoe Kuan ,  Rui Huang

IPC分类号： H01L21/56

CPC分类号： H01L23/49811 ,  H01L21/56 ,  H01L21/561 ,  H01L21/568 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/18 ,  H01L24/19 ,  H01L24/48 ,  H01L24/97 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/18 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2224/82 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor package includes a post carrier having a base plate and plurality of conductive posts. A photosensitive encapsulant is deposited over the base plate of the post carrier and around the conductive posts. The photosensitive encapsulant is etched to expose a portion of the base plate of the post carrier. A semiconductor die is mounted to the base plate of the post carrier within the etched portions of the photosensitive encapsulant. A second encapsulant is deposited over the semiconductor die. A first circuit build-up layer is formed over the second encapsulant. The first circuit build-up layer is electrically connected to the conductive posts. The base plate of the post carrier is removed and a second circuit build-up layer is formed over the semiconductor die and the photosensitive encapsulant opposite the first circuit build-up layer. The second circuit build-up layer is electrically connected to the conductive posts.

摘要翻译： 半导体封装包括具有基板和多个导电柱的柱载体。 光敏密封剂沉积在柱载体的基板上并且在导电柱周围。 蚀刻光敏密封剂以暴露柱载体的基板的一部分。 在光敏密封剂的蚀刻部分内的半导体管芯安装到柱载体的基板上。 第二密封剂沉积在半导体管芯上。 在第二密封剂上形成第一电路堆积层。 第一电路堆积层电连接到导电柱。 去除柱载体的基板，并且在半导体管芯上形成第二电路堆积层，并且与第一电路堆积层相对的光敏封装体形成第二电路堆积层。 第二电路堆积层电连接到导电柱。

公开(公告)号：US20110037154A1

公开(公告)日：2011-02-17

申请号：US12912467

申请日：2010-10-26

申请人： Il Kwon Shim ,  Seng Guan Chow ,  Heap Hoe Kuan

发明人： Il Kwon Shim ,  Seng Guan Chow ,  Heap Hoe Kuan

IPC分类号： H01L23/495

CPC分类号： H01L21/561 ,  H01L21/568 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/48 ,  H01L24/97 ,  H01L25/105 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/97 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01047 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2224/82 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An embedded semiconductor die package is made by mounting a frame carrier to a temporary carrier with an adhesive. The frame carrier includes die mounting sites each having a leadframe interconnect structure around a cavity. A semiconductor die is disposed in each cavity. An encapsulant is deposited in the cavity over the die. A package interconnect structure is formed over the leadframe interconnect structure and encapsulant. The package interconnect structure and leadframe interconnect structure are electrically connected to the die. The frame carrier is singulated into individual embedded die packages. The semiconductor die can be vertically stacked or placed side-by-side within the cavity. The embedded die packages can be stacked and electrically interconnected through the leadframe interconnect structure. A semiconductor device can be mounted to the embedded die package and electrically connected to the die through the leadframe interconnect structure.

摘要翻译： 嵌入式半导体管芯封装通过使用粘合剂将框架载体安装到临时载体上而制成。 框架架包括每个具有围绕腔的引线框架互连结构的管芯安装位置。 半导体管芯设置在每个腔中。 将密封剂沉积在模具上的空腔中。 封装互连结构形成在引线框架互连结构和密封剂上。 封装互连结构和引线框互连结构电连接到管芯。 帧载体被分成单独的嵌入式芯片封装。 半导体管芯可以垂直堆叠或并排放置在腔内。 嵌入式管芯封装可以通过引线框互连结构堆叠并电互连。 半导体器件可以安装到嵌入式裸片封装并且通过引线框互连结构电连接到裸片。

公开(公告)号：US09299648B2

公开(公告)日：2016-03-29

申请号：US12714291

申请日：2010-02-26

申请人： Il Kwon Shim ,  Seng Guan Chow ,  Heap Hoe Kuan

发明人： Il Kwon Shim ,  Seng Guan Chow ,  Heap Hoe Kuan

IPC分类号： H01L23/02 ,  H01L23/498 ,  H01L23/31 ,  H01L25/10

CPC分类号： H01L23/49816 ,  H01L23/3128 ,  H01L23/49822 ,  H01L23/49827 ,  H01L25/105 ,  H01L2224/14181 ,  H01L2224/16225 ,  H01L2224/1703 ,  H01L2224/17181 ,  H01L2224/17519 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/3511 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/0401

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a package substrate having a component side and a system side; depositing a solder resist layer on the component side of the package substrate; patterning groups of access openings and a die mount opening in the solder resist layer; attaching an integrated circuit die in the die mount opening; forming conductive contacts in the access openings; and attaching system interconnects to the system side of the package substrate including controlling a coplanarity of the system interconnects by the solder resist layer.

摘要翻译： 一种集成电路封装系统的制造方法，包括：提供具有元件侧和系统侧的封装基板; 在所述封装衬底的所述元件侧上沉积阻焊层; 在阻焊层中形成存取开口的组和模具安装开口; 将集成电路管芯安装在管芯安装口中; 在所述进入开口中形成导电触点; 以及将系统互连件附接到封装衬底的系统侧，包括通过阻焊层控制系统互连的共面性。

公开(公告)号：US08604602B2

公开(公告)日：2013-12-10

申请号：US12777415

申请日：2010-05-11

申请人： Seng Guan Chow ,  Il Kwon Shim ,  Heap Hoe Kuan ,  Youngcheol Kim

发明人： Seng Guan Chow ,  Il Kwon Shim ,  Heap Hoe Kuan ,  Youngcheol Kim

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L21/00

CPC分类号： H01L21/563 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/0401

摘要： A method of manufacture of an integrated circuit packaging system includes: fabricating a base package substrate having a component side and a system side; coupling stacking interconnects on the component side; and forming an integrated circuit receptacle, for receiving an integrated circuit device, by molding a reinforced encapsulant on the component side and exposing a portion of the stacking interconnects.

摘要翻译： 一种集成电路封装系统的制造方法，包括：制造具有元件侧和系统侧的基底封装基板; 在组件侧耦合堆叠互连; 以及形成用于接收集成电路器件的集成电路插座，通过在组件侧上模制增强的密封剂并暴露所述堆叠互连的一部分。