公开(公告)号：US08957530B2

公开(公告)日：2015-02-17

申请号：US13023293

申请日：2011-02-08

申请人： Il Kwon Shim ,  Seng Guan Chow ,  Heap Hoe Kuan ,  Seung Uk Yoon ,  Jong-Woo Ha

发明人： Il Kwon Shim ,  Seng Guan Chow ,  Heap Hoe Kuan ,  Seung Uk Yoon ,  Jong-Woo Ha

IPC分类号： H01L23/02 ,  H01L23/48 ,  H01L23/00 ,  H01L21/683 ,  H01L25/065 ,  H01L25/10

CPC分类号： H01L24/19 ,  H01L21/568 ,  H01L21/6835 ,  H01L24/96 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/105 ,  H01L2221/68345 ,  H01L2223/6677 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/20 ,  H01L2224/97 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2224/82 ,  H01L2924/00

摘要： An integrated circuit packaging system includes: an integrated circuit device; a conductive post adjacent the integrated circuit device, the conductive post with a contact surface having characteristics of a shaped platform removed; and an encapsulant around the conductive post and the integrated circuit device with the conductive post extending through the encapsulant and each end of the conductive post exposed from the encapsulant.

摘要翻译： 一种集成电路封装系统，包括：集成电路器件; 邻近集成电路器件的导电柱，具有去除成形平台特征的接触表面的导电柱; 以及围绕导电柱和集成电路器件的密封剂，其中导电柱延伸穿过密封剂并且从密封剂暴露出的导电柱的每个端部。

公开(公告)号：US07888184B2

公开(公告)日：2011-02-15

申请号：US12473233

申请日：2009-05-27

申请人： Il Kwon Shim ,  Seng Guan Chow ,  Heap Hoe Kuan ,  Seung Uk Yoon ,  Jong-Woo Ha

发明人： Il Kwon Shim ,  Seng Guan Chow ,  Heap Hoe Kuan ,  Seung Uk Yoon ,  Jong-Woo Ha

IPC分类号： H01L21/00 ,  H01L23/10

CPC分类号： H01L24/19 ,  H01L21/568 ,  H01L21/6835 ,  H01L24/96 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/105 ,  H01L2221/68345 ,  H01L2223/6677 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/20 ,  H01L2224/97 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2224/82 ,  H01L2924/00

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a shaped platform with a conductive post; mounting the shaped platform with the conductive post over a temporary carrier; mounting an integrated circuit device over the temporary carrier; encapsulating the conductive post and the integrated circuit device; removing a portion of the shaped platform isolating the conductive post; and removing the temporary carrier.

摘要翻译： 一种制造集成电路封装系统的方法，包括：提供具有导电柱的成形平台; 将具有导电柱的成形平台安装在临时载体上; 将集成电路装置安装在临时载体上; 封装导电柱和集成电路器件; 去除隔离导电柱的成形平台的一部分; 并移除临时载体。

公开(公告)号：US20090315170A1

公开(公告)日：2009-12-24

申请号：US12473233

申请日：2009-05-27

申请人： Il Kwon Shim ,  Seng Guan Chow ,  Heap Hoe Kuan ,  Seung Uk Yoon ,  Jong-Woo Ha

发明人： Il Kwon Shim ,  Seng Guan Chow ,  Heap Hoe Kuan ,  Seung Uk Yoon ,  Jong-Woo Ha

IPC分类号： H01L23/50 ,  H01L21/56 ,  H01L21/98 ,  H01L21/50

CPC分类号： H01L24/19 ,  H01L21/568 ,  H01L21/6835 ,  H01L24/96 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/105 ,  H01L2221/68345 ,  H01L2223/6677 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/20 ,  H01L2224/97 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2224/82 ,  H01L2924/00

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a shaped platform with a conductive post; mounting the shaped platform with the conductive post over a temporary carrier; mounting an integrated circuit device over the temporary carrier; encapsulating the conductive post and the integrated circuit device; removing a portion of the shaped platform isolating the conductive post; and removing the temporary carrier.

摘要翻译： 一种制造集成电路封装系统的方法，包括：提供具有导电柱的成形平台; 将具有导电柱的成形平台安装在临时载体上; 将集成电路装置安装在临时载体上; 封装导电柱和集成电路器件; 去除隔离导电柱的成形平台的一部分; 并移除临时载体。

公开(公告)号：US20110127678A1

公开(公告)日：2011-06-02

申请号：US13023293

申请日：2011-02-08

申请人： Il Kwon Shim ,  Seng Guan Chow ,  Heap Hoe Kuan ,  Seung Uk Yoon ,  Jong-Woo Ha

发明人： Il Kwon Shim ,  Seng Guan Chow ,  Heap Hoe Kuan ,  Seung Uk Yoon ,  Jong-Woo Ha

IPC分类号： H01L23/50

CPC分类号： H01L24/19 ,  H01L21/568 ,  H01L21/6835 ,  H01L24/96 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/105 ,  H01L2221/68345 ,  H01L2223/6677 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/20 ,  H01L2224/97 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2224/82 ,  H01L2924/00

摘要： An integrated circuit packaging system includes: an integrated circuit device; a conductive post adjacent the integrated circuit device, the conductive post with a contact surface having characteristics of a shaped platform removed; and an encapsulant around the conductive post and the integrated circuit device with the conductive post extending through the encapsulant and each end of the conductive post exposed from the encapsulant.

摘要翻译： 一种集成电路封装系统，包括：集成电路器件; 邻近集成电路器件的导电柱，具有去除成形平台特征的接触表面的导电柱; 以及围绕导电柱和集成电路器件的密封剂，其中导电柱延伸穿过密封剂并且从密封剂暴露出的导电柱的每个端部。

公开(公告)号：US08692388B2

公开(公告)日：2014-04-08

申请号：US13536268

申请日：2012-06-28

申请人： Sang-Ho Lee ,  Jong-Woo Ha ,  Soo-San Park

发明人： Sang-Ho Lee ,  Jong-Woo Ha ,  Soo-San Park

IPC分类号： H01L23/48

CPC分类号： H01L25/0657 ,  H01L24/73 ,  H01L25/50 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06575 ,  H01L2924/01067 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： An integrated circuit packaging system is provided including: a first device having a first backside and a first active side; and a waferscale spacer having an exact fit at all four corners adjacent to an edge of the first device and a recess along the edge of the first device.

摘要翻译： 提供一种集成电路封装系统，包括：具有第一背面和第一主动侧的第一装置; 以及具有与所述第一装置的边缘相邻的所有四个角处精确配合的晶片间隔件以及沿着所述第一装置的边缘的凹部。

公开(公告)号：US08581380B2

公开(公告)日：2013-11-12

申请号：US11456554

申请日：2006-07-10

申请人： Soo-San Park ,  Sang-Ho Lee ,  Jong-Woo Ha

发明人： Soo-San Park ,  Sang-Ho Lee ,  Jong-Woo Ha

IPC分类号： H01L23/02

CPC分类号： H01L25/0657 ,  H01L23/3128 ,  H01L24/03 ,  H01L24/05 ,  H01L24/48 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05556 ,  H01L2224/05599 ,  H01L2224/06183 ,  H01L2224/16 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2224/85444 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06551 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/1305 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/0665 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit packaging system with ultra-thin die is provided including providing an ultra-thin integrated circuit stack, having a vertical sidewall contact, including providing a semiconductor wafer having an active side, forming a solder bump on the active side of the semiconductor wafer, forming a support layer over the solder bump and the active side of the semiconductor wafer, forming an ultra-thin wafer from the semiconductor wafer and singulating the ultra-thin integrated circuit stack for exposing the vertical sidewall contact, mounting the ultra-thin integrated circuit stack on a substrate, and coupling the substrate to the vertical sidewall contact.

摘要翻译： 提供一种具有超薄管芯的集成电路封装系统，包括提供具有垂直侧壁接触的超薄集成电路堆叠，包括提供具有有源侧的半导体晶片，在半导体晶片的有源侧上形成焊料凸块 在焊料凸块和半导体晶片的有源侧上形成支撑层，从半导体晶片形成超薄晶片，并且对超薄集成电路堆叠进行单片化，以暴露垂直侧壁接触，安装超薄集成 电路堆叠，并将衬底耦合到垂直侧壁接触。

公开(公告)号：US08481420B2

公开(公告)日：2013-07-09

申请号：US13048859

申请日：2011-03-15

申请人： Jong-Woo Ha ,  DaeSik Choi ,  Byoung Wook Jang

发明人： Jong-Woo Ha ,  DaeSik Choi ,  Byoung Wook Jang

IPC分类号： H01L21/44 ,  H01L21/48

CPC分类号： H01L23/3128 ,  H01L21/565 ,  H01L23/3135 ,  H01L23/49541 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/03 ,  H01L2224/05554 ,  H01L2224/32145 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/4554 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/4911 ,  H01L2224/73265 ,  H01L2224/85001 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18165 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method of manufacture of an integrated circuit packaging system includes: providing an integrated circuit die having an active side and a passive side; providing a contact pad having a top side oriented in a same direction as the passive side; connecting an inner bond wire to the contact pad and the integrated circuit die; and molding a stacking structure around the contact pad, the inner bond wire, and the integrated circuit die with the passive side and the top side exposed, and the stacking structure having a top structure surface on top and adjacent to or below the integrated circuit die, and a horizontal member under the integrated circuit die and forming a cavity.

摘要翻译： 一种集成电路封装系统的制造方法，包括：提供具有有源侧和被动侧的集成电路管芯; 提供具有朝向与被动侧相同方向的顶面的接触垫; 将内部接合线连接到接触焊盘和集成电路管芯; 以及在所述接触焊盘，所述内部接合线和所述集成电路管芯周围形成堆叠结构，其中所述被动侧和所述顶侧暴露，并且所述堆叠结构具有位于所述集成电路模具的顶部并且靠近所述集成电路模具的顶部结构表面 ，以及集成电路模具下方的水平构件，并形成空腔。

公开(公告)号：US20120241979A1

公开(公告)日：2012-09-27

申请号：US13052590

申请日：2011-03-21

申请人： DaeSik Choi ,  Jong-Woo Ha ,  Seung Won Kim

发明人： DaeSik Choi ,  Jong-Woo Ha ,  Seung Won Kim

IPC分类号： H01L23/49 ,  H01L21/50

CPC分类号： H01L23/3135 ,  H01L23/3128 ,  H01L24/06 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L25/03 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/06155 ,  H01L2224/131 ,  H01L2224/13116 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/45565 ,  H01L2224/45599 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/8314 ,  H01L2224/8592 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/06568 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/00

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a substrate; connecting an integrated circuit die to the substrate, with the integrated circuit die having peripheral sides; molding a step mold covering one of the peripheral sides; attaching an intermediate die directly over the integrated circuit die, offset to one of the peripheral sides adjacent to the step mold; and directly connecting the intermediate die to the substrate.

摘要翻译： 一种集成电路封装系统的制造方法，包括：提供基板; 将集成电路管芯连接到衬底，集成电路管芯具有周边; 模制覆盖一个周边的阶梯模; 将中间模直接连接在集成电路模具上，偏移到与步进模具相邻的周边之一; 并将中间管芯直接连接到基板。

公开(公告)号：US20120028413A1

公开(公告)日：2012-02-02

申请号：US13269258

申请日：2011-10-07

申请人： Jong-Woo Ha

发明人： Jong-Woo Ha

IPC分类号： H01L21/50

CPC分类号： H01L23/49833 ,  H01L23/16 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/36 ,  H01L23/49816 ,  H01L24/16 ,  H01L24/48 ,  H01L24/73 ,  H01L25/03 ,  H01L25/105 ,  H01L25/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1052 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2225/1094 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method for manufacturing a ball grid array package stacking system includes: providing a base substrate; coupling an integrated circuit to the base substrate; coupling a stacking substrate over the base substrate; mounting a heat spreader, having an access port, around the base substrate and the stacking substrate; and coupling a stacked integrated circuit to the stacking substrate through the access port.

摘要翻译： 一种制造球栅阵列封装堆叠系统的方法，包括：提供基底; 将集成电路耦合到所述基底基板; 将堆叠衬底耦合在所述基底衬底上; 在所述基底基板和所述堆叠基板周围安装具有入口的散热器; 并通过接入端口将层叠的集成电路耦合到堆叠衬底。

公开(公告)号：US07951643B2

公开(公告)日：2011-05-31

申请号：US12325193

申请日：2008-11-29

申请人： Jong-Woo Ha ,  TaeWoo Kang ,  DongSoo Moon

发明人： Jong-Woo Ha ,  TaeWoo Kang ,  DongSoo Moon

IPC分类号： H01L21/00

CPC分类号： H01L23/49811 ,  H01L21/4853 ,  H01L23/3128 ,  H01L23/4334 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2225/1094 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/0401 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a base substrate; attaching a base device over the base substrate; attaching a leadframe having a leadframe pillar adjacent the base device over the base substrate; applying a base encapsulant over the base device, the base substrate, and the leadframe; and removing a portion of the base encapsulant and a portion of the leadframe providing the leadframe pillar partially exposed.

摘要翻译： 一种制造集成电路封装系统的方法，包括：提供基底; 将基底装置附接在基底基板上; 将具有与所述基底装置相邻的引线框柱的引线框架附接在所述基底基板上; 将基底密封剂施加在基底器件，基底衬底和引线框架上; 以及去除所述基底密封剂的一部分和所述引线框架的部分暴露的引线框架的一部分。