Abstract:
Provided are selector elements with active components comprising insulating matrices and mobile ions disposed within these insulating matrices. Also provided are methods of operating such selector elements. The insulating matrices and mobile ions may be formed from different combinations of materials. For example, the insulating matrix may comprise amorphous silicon or silicon oxide, while mobile ions may be silver ions. In another example, the active component comprises copper and germanium, selenium, or tellerium, e.g., Se61Cu39, Se67Cu33, or Se56Cu44. The active component may be a multilayered structure with a variable composition throughout the structure. For example, the concentration of mobile ions may be higher in a center of the structure, away from the electrode interfaces. In some embodiments, outer layers may be formed from Ge33Se24Cu47, while the middle layer may be formed from Ge47Se29Cu24.
Abstract:
Embodiments provided herein describe systems and methods for forming ferroelectric materials. A trench body may be provided. A trench may be formed in the trench body. A dielectric material and a filler material may be deposited within the trench. The filler material may be heated such that a stress is exerted on the dielectric material before the dielectric material is heated to generate a ferroelectric phase within the dielectric material. A non-contiguous layer may be formed above a substrate. A second layer including a high-k dielectric material may be formed above the first layer. The high-k dielectric material may be heated to generate a ferroelectric phase within the high-k dielectric material.
Abstract:
A nonvolatile sample and hold circuit can include a resistive switching circuit, a sample circuit, a reset circuit, and a converter circuit. The resistive switching circuit can be operable to accept an input voltage Vg, and provide a resistance response Rrs that corresponds to the input signal Vg. The sampling circuit can be operable to sample an input signal such as an input voltage Vin, to provide a sampled voltage Vg. The reset circuit can be operable to reset the resistive switching circuit to a high resistance state. The converter circuit can be operable to convert the resistive switching circuit to an output voltage. The novel sample and hold circuit can have no issues related to charge injection, no settling time and instantaneous sampling time, together with potentially infinite hold time.
Abstract:
A nonvolatile sample and hold circuit can include a resistive switching circuit, a sample circuit, a reset circuit, and a converter circuit. The resistive switching circuit can be operable to accept an input voltage Vg, and provide a resistance response Rrs that corresponds to the input signal Vg. The sampling circuit can be operable to sample an input signal such as an input voltage Vin, to provide a sampled voltage Vg. The reset circuit can be operable to reset the resistive switching circuit to a high resistance state. The converter circuit can be operable to convert the resistive switching circuit to an output voltage. The novel sample and hold circuit can have no issues related to charge injection, no settling time and instantaneous sampling time, together with potentially infinite hold time.
Abstract:
Provided are resistive random access memory (ReRAM) cells forming arrays and methods of operating such cells and arrays. The ReRAM cells of the same array may have the same structure, such as have the same bottom electrodes, top electrodes, and resistive switching layers. Yet, these cells may be operated in a different manner. For example, some ReRAM cells may be restively switched using lower switching voltages than other cells. The cells may also have different data retention characteristics. These differences may be achieved by using different forming operations for different cells or, more specifically, flowing forming currents in different directions for different cells. The resulting conductive paths formed within the resistive switching layers are believed to switch at or near different electrode interfaces, i.e., within a so called switching zone. In some embodiments, a switching zone of a ReRAM cell may be changed even after the initial formation.
Abstract:
A nonvolatile memory device contains a resistive switching memory element with improved device switching performance and life and methods for forming the same. The nonvolatile memory device has a first layer on a substrate, a resistive switching layer on the first layer, and a second layer. The resistive switching layer is disposed between the first layer and the second layer and the resistive switching layer comprises a material having the same morphology as the top surface of the first layer. A method of forming a nonvolatile memory element in a ReRAM device includes forming a resistive switching layer on a first layer and forming a second layer, so that the resistive switching layer is disposed between the first layer and the second layer. The resistive switching layer comprises a material formed with the same morphology as the top surface of the first layer.
Abstract:
Provided are resistive random access memory (ReRAM) cells and methods of fabricating thereof. The resistive switching nonvolatile memory cells may include a first layer disposed. The first layer may be operable as a bottom electrode. The resistive switching nonvolatile memory cells may also include a second layer disposed over the first layer. The second layer may be operable as a resistive switching layer that is configured to switch between a first resistive state and a second resistive state. The resistive switching nonvolatile memory cells may include a third layer disposed over the second layer. The third layer may be operable as a resistive layer that is configured to determine, at least in part, an electrical resistivity of the resistive switching nonvolatile memory element. The third layer may include a semi-metallic material. The resistive switching nonvolatile memory cells may include a fourth layer that may be operable as a top electrode.
Abstract:
Provided are voltage controlling assemblies that may be operable as clocks and/or oscillators. A voltage controlling assembly may include a comparator and a variable resistance device connected to one differential signal node of the comparator. The other node may be connected to a capacitor. Alternatively, no capacitors may be used in the assembly. During operation of the voltage controlling assembly, the variable resistance device changes its resistance between two different resistive states. The change from a low to a high resistive state may be associated with a voltage spike at the differential signal node of the comparator and trigger a response from the comparator. This resistance change may have a delay determining an operating frequency of the voltage controlling assembly. Specifically, the variable resistance device in the low resistive state may be kept for a period of time at a certain voltage before it switches into the high resistive state.
Abstract:
Forming a resistive switching layer having a vertical interface can generate defects confined along the interface between two electrodes. The confined defects can form a pre-determined region for filament formation and dissolution, leading to low power resistive switching and low program voltage or current variability. In addition, the filament forming process of the resistive memory device can be omitted due to the existence of the confined defects.
Abstract:
A resistive switching memory device can include three or more electrodes interfacing a switching layer, including a top electrode, a bottom electrode, and a side electrode. The top and bottom electrodes can be used for forming conductive filaments and for reading the memory device. The side electrode can be used to control the resistance state of the switching layer.