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    CONDUCTIVE PASTE COMPOSITION FOR INNER ELECTRODE, LAMINATED CERAMIC ELECTRONIC PART USING THE SAME AND MANUFACTURING METHOD THEREOF
    1.
    发明申请
    CONDUCTIVE PASTE COMPOSITION FOR INNER ELECTRODE, LAMINATED CERAMIC ELECTRONIC PART USING THE SAME AND MANUFACTURING METHOD THEREOF 审中-公开
    用于内电极的导电性组合物，使用该电极的层压陶瓷电子部件及其制造方法

    公开(公告)号：US20120154976A1

    公开(公告)日：2012-06-21

    申请号：US13325384

    申请日：2011-12-14

    申请人： Jai Joon LEE ,  Hyun Chul Jung ,  Jae Man Park ,  Jong Han Kim

    发明人： Jai Joon LEE ,  Hyun Chul Jung ,  Jae Man Park ,  Jong Han Kim

    IPC分类号： H01G4/30 ,  B05D5/12 ,  H01B1/02

    CPC分类号： H01G4/008 ,  H01B1/22

    摘要： There are provided a conductive paste composition for an inner electrode, and a laminated ceramic electronic part and a manufacturing method thereof using the conductive paste composition. The conductive paste composition includes metal powder coated with an organosilica compound formed by polymerization of an organosilane compound having a structure of RnSi(OR′)4-n (wherein R is selected from alkyl and aryl groups, each having 20 or less carbon atoms, R′ is any one of the alkyl groups having 4 or less carbon atoms, and n is 1 or 2). Since the organosilica coating layer is coated around the metal powder particles, preventing the metal powder particles from being agglomerated, thereby allowing the conductive paste composition having very superior dispersibility to be manufactured. In addition, effects such as inhibited oxidation of the metal powder during plasticization and effectively inhibited shrinkage of the metal powder during sintering may be accomplished.

    摘要翻译： 提供了一种用于内部电极的导电糊剂组合物和层压陶瓷电子部件及其使用导电糊剂组合物的制造方法。 导电性糊料组合物包含金属粉末，其涂有由具有R n Si（OR'）4-n（其中R选自烷基和芳基，各自具有20个以下碳原子的结构）的有机硅烷化合物聚合形成的有机二甲基化合物， R'是具有4个或更少碳原子的烷基中的任何一个，n是1或2）。 由于有机硅涂层涂覆在金属粉末颗粒周围，防止金属粉末颗粒聚集，从而制备具有非常优异的分散性的导电浆料组合物。 此外，可以实现在增塑期间抑制金属粉末的氧化并有效抑制烧结期间金属粉末的收缩的效果。

    Multilayer ceramic electronic component and method of manufacturing the same
    2.
    发明授权
    Multilayer ceramic electronic component and method of manufacturing the same 有权
    多层陶瓷电子元件及其制造方法

    公开(公告)号：US08941973B2

    公开(公告)日：2015-01-27

    申请号：US13620559

    申请日：2012-09-14

    申请人： Jong Han Kim ,  Jae Man Park

    发明人： Jong Han Kim ,  Jae Man Park

    IPC分类号： H01G4/005 ,  H01G7/00

    CPC分类号： H01G4/0085 ,  H01G4/012 ,  H01G4/12 ,  H01G4/1227 ,  H01G4/30 ,  Y10T29/43

    摘要： There are provided a multilayer ceramic electronic component and a manufacturing method thereof, the multilayer ceramic electronic component including: a ceramic body including dielectric layers; a plurality of internal electrodes facing each other with the dielectric layer interposed therebetween; and external electrodes electrically connected to the internal electrodes, wherein a thickness to of the internal electrode satisfies 0.1 μm≦Te≦0.5 μm, and when, in a cross-section of the ceramic body taken in length and thickness directions, cut through a central portion of the ceramic body in a width direction, a distance, in the length direction, of a central portion of an internal electrode grain closest to a disconnected portion of the internal electrode is denoted by Tc, and a distance, in the length direction, of the internal electrode grain at a point equal to 25% of the thickness thereof above or below the central portion thereof is denoted by Tl, 0.7≦Tl/Tc≦1.3 is satisfied.

    摘要翻译： 提供了一种多层陶瓷电子部件及其制造方法，所述多层陶瓷电子部件包括：包含电介质层的陶瓷体; 多个内部电极彼此面对，介电层插入其间; 电连接到内部电极的外部电极，其中内部电极的厚度t 1满足0.1μm＆lt; NE; Te＆NlE;0.5μm，并且当在长度和厚度方向上取下的陶瓷体的截面中， 在陶瓷体的宽度方向上的距离最接近内部电极的断开部分的内部电极纹理的中心部分的长度方向的距离为Tc，长度方向上的距离， 的内部电极颗粒在其中心部分的上方或下方的厚度的25％的点处表示为T1，0.7＆nlE; T1 / Tc＆lt; N1; 1.3。

    MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME
    3.
    发明申请
    MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME 有权
    多层陶瓷电子元件及其制造方法

    公开(公告)号：US20130286538A1

    公开(公告)日：2013-10-31

    申请号：US13620559

    申请日：2012-09-14

    申请人： Jong Han KIM ,  Jae Man Park

    发明人： Jong Han KIM ,  Jae Man Park

    IPC分类号： H01G4/012 ,  H01G4/008

    CPC分类号： H01G4/0085 ,  H01G4/012 ,  H01G4/12 ,  H01G4/1227 ,  H01G4/30 ,  Y10T29/43

    摘要： There are provided a multilayer ceramic electronic component and a manufacturing method thereof, the multilayer ceramic electronic component including: a ceramic body including dielectric layers; a plurality of internal electrodes facing each other with the dielectric layer interposed therebetween; and external electrodes electrically connected to the internal electrodes, wherein a thickness to of the internal electrode satisfies 0.1 μm≦Te≦0.5 μm, and when, in a cross-section of the ceramic body taken in length and thickness directions, cut through a central portion of the ceramic body in a width direction, a distance, in the length direction, of a central portion of an internal electrode grain closest to a disconnected portion of the internal electrode is denoted by Tc, and a distance, in the length direction, of the internal electrode grain at a point equal to 25% of the thickness thereof above or below the central portion thereof is denoted by Tl, 0.7≦Tl/Tc≦1.3 is satisfied.

    摘要翻译： 提供了一种多层陶瓷电子部件及其制造方法，所述多层陶瓷电子部件包括：包含电介质层的陶瓷体; 多个内部电极彼此面对，介电层插入其间; 以及与内部电极电连接的外部电极，其中，内部电极的厚度t 1满足0.1μm@Te≤0.5μm，并且当在陶瓷体的长度和厚度方向的截面中切断中心 在陶瓷体的宽度方向上的距离最接近内部电极的断开部分的内部电极纹理的中心部分的长度方向的距离为Tc，长度方向上的距离， 的内部电极颗粒在等于其中心部分上方或下方的厚度的25％的点处由T1表示，满足0.7≤Tl/ Tc @ 1.3。

    MULTILAYER CERAMIC ELECTRONIC COMPONENT AND FABRICATION METHOD THEREOF
    4.
    发明申请
    MULTILAYER CERAMIC ELECTRONIC COMPONENT AND FABRICATION METHOD THEREOF 有权
    多层陶瓷电子元件及其制造方法

    公开(公告)号：US20130063862A1

    公开(公告)日：2013-03-14

    申请号：US13333359

    申请日：2011-12-21

    申请人： Jong Han KIM ,  Hyun Chul Jeong ,  Jae Man Park

    发明人： Jong Han KIM ,  Hyun Chul Jeong ,  Jae Man Park

    IPC分类号： H01G4/008 ,  B32B38/14

    CPC分类号： H01G4/30 ,  H01G4/005

    摘要： There is provided a multilayer ceramic electronic component, including: a ceramic main body including a dielectric layer; and inner electrodes disposed to face each other within the ceramic main body, with the dielectric layer interposed therebetween, wherein, when an average thickness of the dielectric layer is td and an average thickness of the inner electrodes is te, 0.1 μm≦te≦0.5 μm and (td+te)/te≦2.5 are satisfied, and when an average surface roughness on a virtual surface roughness center line of the inner electrode is Ra and an average roughness of ten points of the inner electrode is Rz, 5 nm≦Ra≦30 nm, 150 nm≦Rz≦td/2, and 8≦Rz/Ra≦20 are satisfied. The multilayer ceramic electronic component has excellent reliability by improving adhesion strength between the dielectric layer and the inner electrodes and withstand voltage characteristics.

    摘要翻译： 提供了一种多层陶瓷电子部件，包括：包括电介质层的陶瓷主体; 以及在陶瓷主体内部彼此相对配置的内部电极，介电层插入其间，其中，当电介质层的平均厚度为td，内部电极的平均厚度为te时，为0.1μm＆lt; lE; te＆nlE; 0.5 并且当内部电极的虚拟表面粗糙度中心线上的平均表面粗糙度为Ra并且内部电极的10个点的平均粗糙度为Rz时，为5nm＆amp; nlE;并且（td + te）/te＆ Ra和nlE; 30nm，150nm和nlE; Rz＆amp; NlE; td / 2和8＆nlE; Rz / Ra＆nlE; 20。 多层陶瓷电子部件通过提高介电层与内部电极之间的粘合强度和耐电压特性而具有优异的可靠性。

    Multilayer ceramic electronic component having an average surface roughness to provide adhesion strength between a dielectric layer and inner electrode and fabrication method thereof
    5.
    发明授权
    Multilayer ceramic electronic component having an average surface roughness to provide adhesion strength between a dielectric layer and inner electrode and fabrication method thereof 有权
    具有平均表面粗糙度以提供介电层和内部电极之间的粘附强度的多层陶瓷电子部件及其制造方法

    公开(公告)号：US08867190B2

    公开(公告)日：2014-10-21

    申请号：US13333359

    申请日：2011-12-21

    申请人： Jong Han Kim ,  Hyun Chul Jeong ,  Jae Man Park

    发明人： Jong Han Kim ,  Hyun Chul Jeong ,  Jae Man Park

    IPC分类号： H01G4/06 ,  H01G4/005 ,  H01G4/30

    CPC分类号： H01G4/30 ,  H01G4/005

    摘要： There is provided a multilayer ceramic electronic component, including: a ceramic main body including a dielectric layer; and inner electrodes disposed to face each other within the ceramic main body, with the dielectric layer interposed therebetween, wherein, when an average thickness of the dielectric layer is td and an average thickness of the inner electrodes is te, 0.1 μm≦te≦0.5 μm and (td+te)/te≦2.5 are satisfied, and when an average surface roughness on a virtual surface roughness center line of the inner electrode is Ra and an average roughness of ten points of the inner electrode is Rz, 5 nm≦Ra≦30 nm, 150 nm≦Rz≦td/2, and 8≦Rz/Ra≦20 are satisfied. The multilayer ceramic electronic component has excellent reliability by improving adhesion strength between the dielectric layer and the inner electrodes and withstand voltage characteristics.

    摘要翻译： 提供了一种多层陶瓷电子部件，包括：包括电介质层的陶瓷主体; 以及在陶瓷主体内部彼此相对配置的内部电极，介电层插入其间，其中，当电介质层的平均厚度为td，内部电极的平均厚度为te时，为0.1μm＆lt; lE; te＆nlE; 0.5 并且当内部电极的虚拟表面粗糙度中心线上的平均表面粗糙度为Ra并且内部电极的10个点的平均粗糙度为Rz时，为5nm＆amp; nlE;并且（td + te）/te＆ Ra和nlE; 30nm，150nm和nlE; Rz＆amp; NlE; td / 2和8＆nlE; Rz / Ra＆nlE; 20。 多层陶瓷电子部件通过提高介电层与内部电极之间的粘合强度和耐电压特性而具有优异的可靠性。

    MULTILAYERED CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF
    6.
    发明申请
    MULTILAYERED CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF 审中-公开
    多层陶瓷电子元件及其制造方法

    公开(公告)号：US20130002388A1

    公开(公告)日：2013-01-03

    申请号：US13292803

    申请日：2011-11-09

    申请人： Jong Han KIM ,  Jae Man Park ,  Hyun Chul Jeong

    发明人： Jong Han KIM ,  Jae Man Park ,  Hyun Chul Jeong

    IPC分类号： H01F5/00 ,  B05D5/12 ,  H01G4/12

    CPC分类号： H01G4/30 ,  H01G4/012 ,  H01G4/12

    摘要： There is provided a multilayered ceramic electronic component capable of securing capacitance by controlling electrode connectivity. The multilayered ceramic electronic component includes: a ceramic main body; and internal electrodes formed in the interior of the ceramic main body and having a central portion and a tapered portion becoming thinner from the central portion toward edges thereof, respectively, wherein the ratio of the area of the tapered portion to the overall area of the internal electrodes is 35% or less. A desired capacitance can be obtained by controlling an electrode connectivity even in the small high capacitance multilayered ceramic capacitor.

    摘要翻译： 提供了一种能够通过控制电极连接来确保电容的多层陶瓷电子部件。 多层陶瓷电子部件包括：陶瓷主体; 以及形成在陶瓷主体内部并具有中心部分和锥形部分的内部电极分别从其中心部分朝向其边缘变薄，其中锥形部分的面积与内部的总面积的比率 电极为35％以下。 通过控制即使在小的高电容多层陶瓷电容器中的电极连接也可以获得所需的电容。