公开(公告)号：US20050285262A1

公开(公告)日：2005-12-29

申请号：US10524894

申请日：2002-09-10

申请人： James Knapp ,  Francis Carney ,  Harold Anderson ,  Yenting Wen ,  Cang Ngo

发明人： James Knapp ,  Francis Carney ,  Harold Anderson ,  Yenting Wen ,  Cang Ngo

IPC分类号： H01L21/44 ,  H01L23/34 ,  H01L23/495 ,  H01L23/522

CPC分类号： H01L24/85 ,  H01L23/495 ,  H01L23/4952 ,  H01L23/5227 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/05553 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/78301 ,  H01L2224/85047 ,  H01L2224/8517 ,  H01L2224/85181 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19104 ,  H01L2924/19107 ,  H01L2924/20755 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2224/85399 ,  H01L2224/05599

摘要： A semiconductor device (10) includes a semiconductor die (20) and an inductor (30, 50) formed with a bonding wire (80) attached to a top surface (21) of the semiconductor die. The bonding wire is extended laterally a distance (L30, L150) greater than its height (H30, H50) to define an insulating core (31, 57). In one embodiment, the inductor is extended beyond an edge (35, 39) of the semiconductor die to reduce loading.

摘要翻译： 半导体器件（10）包括半导体管芯（20）和形成有连接到半导体管芯的顶表面（21）的接合线（80）的电感器（30,50）。 接合线横向延伸大于其高度（H 30，H 50）的距离（L 30，L 150）以限定绝缘芯（31,57）。 在一个实施例中，电感器延伸超过半导体管芯的边缘（35,39）以减少负载。

公开(公告)号：US07227240B2

公开(公告)日：2007-06-05

申请号：US10524894

申请日：2002-09-10

申请人： James Knapp ,  Francis Carney ,  Harold Anderson ,  Yenting Wen ,  Cang Ngo

发明人： James Knapp ,  Francis Carney ,  Harold Anderson ,  Yenting Wen ,  Cang Ngo

IPC分类号： H01L23/52 ,  H01L23/64 ,  H01L23/48 ,  H01L23/58 ,  H01F17/00

CPC分类号： H01L24/85 ,  H01L23/495 ,  H01L23/4952 ,  H01L23/5227 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/05553 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/78301 ,  H01L2224/85047 ,  H01L2224/8517 ,  H01L2224/85181 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19104 ,  H01L2924/19107 ,  H01L2924/20755 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2224/85399 ,  H01L2224/05599

摘要： A semiconductor device (10) includes a semiconductor die (20) and an inductor (30, 50) formed with a bonding wire (80) attached to a top surface (21) of the semiconductor die. The bonding wire is extended laterally a distance (L30, L150) greater than its height (H30, H50) to define an insulating core (31, 57). In one embodiment, the inductor is extended beyond an edge (35, 39) of the semiconductor die to reduce loading.

摘要翻译： 半导体器件（10）包括半导体管芯（20）和形成有连接到半导体管芯的顶表面（21）的接合线（80）的电感器（30,50）。 接合线横向延伸大于其高度（H 30，H 50）的距离（L 30，L 150）以限定绝缘芯（31,57）。 在一个实施例中，电感器延伸超过半导体管芯的边缘（35,39）以减少负载。

公开(公告)号：US20070114676A1

公开(公告)日：2007-05-24

申请号：US11281141

申请日：2005-11-18

申请人： Harold Anderson ,  Cang Ngo ,  Yong Xu ,  James Mohr

发明人： Harold Anderson ,  Cang Ngo ,  Yong Xu ,  James Mohr

IPC分类号： H01L23/28

CPC分类号： H01L23/3142 ,  H01L23/3107 ,  H01L23/49524 ,  H01L24/40 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/84 ,  H01L24/91 ,  H01L2224/32245 ,  H01L2224/40095 ,  H01L2224/40245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4903 ,  H01L2224/49051 ,  H01L2224/73219 ,  H01L2224/73221 ,  H01L2224/73263 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/84801 ,  H01L2224/8485 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2224/37099

摘要： In one embodiment, a semiconductor package is formed by adding a layer of particles to desired portions of a packing substrate. The layer of particles forms a matrix of crevices that provides a micro-lock feature for mechanically locking or engaging encapsulating materials.

摘要翻译： 在一个实施例中，通过在包装衬底的期望部分添加一层颗粒来形成半导体封装。 颗粒层形成缝隙矩阵，其提供用于机械地锁定或接合封装材料的微锁特征。

公开(公告)号：US20070117259A1

公开(公告)日：2007-05-24

申请号：US11281160

申请日：2005-11-18

申请人： Harold Anderson ,  Jay Yoder ,  Cang Ngo ,  Joseph Fauty ,  James Lettlerman

发明人： Harold Anderson ,  Jay Yoder ,  Cang Ngo ,  Joseph Fauty ,  James Lettlerman

IPC分类号： H01L21/00

CPC分类号： H01L21/67132 ,  H01L24/96 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00

摘要： A circuit component having one or more encapsulated circuit elements that are not disposed on a rigid support substrate and a method for manufacturing the circuit component. A semiconductor wafer is disposed on a dicing film and singulated into individual semiconductor chips. The dicing film is stretched and a protective film is placed in contact with the active surfaces of the semiconductor chips. An encapsulating material is formed over the semiconductor chips. The encapsulating material covers the semiconductor chips and the portions of the protective film between the semiconductor chips to form a unitary structure. A support film is coupled to the unitary structure and the protective film is removed. The unitary structure is singulated into individual semiconductor components. Alternatively, multichip circuit components can be manufactured that may include active circuit elements, passive circuit elements, or combinations thereof.

摘要翻译： 具有不设置在刚性支撑基板上的一个或多个封装电路元件的电路元件和用于制造电路元件的方法。 将半导体晶片设置在切割薄膜上，并分割成单独的半导体芯片。 切割膜被拉伸，保护膜与半导体芯片的活性表面接触。 在半导体芯片上形成封装材料。 封装材料覆盖半导体芯片和半导体芯片之间的保护膜的部分，以形成整体结构。 支撑膜耦合到整体结构，并且保护膜被去除。 单一结构被分成单独的半导体元件。 或者，可以制造可以包括有源电路元件，无源电路元件或其组合的多芯片电路部件。

公开(公告)号：US20060134836A1

公开(公告)日：2006-06-22

申请号：US10548563

申请日：2003-04-29

申请人： James Knapp ,  Jay Yoder ,  Harold Anderson

发明人： James Knapp ,  Jay Yoder ,  Harold Anderson

IPC分类号： H01L21/50 ,  H01L21/44

CPC分类号： H01L21/568 ,  H01L21/561 ,  H01L21/6835 ,  H01L23/3107 ,  H01L23/49562 ,  H01L24/06 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L24/97 ,  H01L2224/05553 ,  H01L2224/05599 ,  H01L2224/0603 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49111 ,  H01L2224/73265 ,  H01L2224/85205 ,  H01L2224/85399 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/19043 ,  H01L2924/00 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2224/45099 ,  H01L2924/00012

摘要： A semiconductor device (10) is made by mounting the bottom surfaces (31, 44, 54) of a semiconductor die (14) and a lead (15, 17) on a tape (12) and over a hole (19) in the tape. A vacuum is drawn through the hole to secure the die in place when the lead's top surface (43) is wirebonded to a top surface (32) of the semiconductor die. A molding material (49) is formed to encapsulate the top surface of the semiconductor die and to expose its bottom surface.

摘要翻译： 半导体器件（10）通过将半导体管芯（14）的底表面（31,44,54）和引线（15,17）安装在带（12）上并在其中的孔（19）上方形成 胶带。 当引线的顶表面（43）引线接合到半导体管芯的顶表面（32）时，通过孔抽出真空以将管芯固定就位。 形成模塑材料（49）以封装半导体管芯的顶表面并露出其底表面。

公开(公告)号：US06969091B2

公开(公告)日：2005-11-29

申请号：US10273898

申请日：2002-10-16

申请人： Richard Hilicki ,  Harold Anderson

发明人： Richard Hilicki ,  Harold Anderson

IPC分类号： B42F5/00 ,  A63H3/40

CPC分类号： B42F5/00 ,  Y10S283/903

摘要： A book that is capable of displaying one or more coins related to its theme, including a front cover and a back cover. At least one book cover defines one or more apertures that are capable of receiving coins. The book theme is displayed on at least one of the book covers. The book may optionally include one or more caps that may be inserted into and removed from the coin-receivable apertures. These caps will preferably display images that are related to the theme of the book. The invention provides a coin specific display that stores and displays one or more coins in an appealing manner, and that also conveys or provides additional information about the theme displayed on the coin.

摘要翻译： 能够显示与其主题相关的一个或多个硬币的书，包括前盖和后盖。 至少一本书套限定了能够接收硬币的一个或多个孔。 该书的主题至少显示在一本书封面上。 书可以可选地包括一个或多个可以插入硬币可接收孔径的盖子。 这些帽将优选地显示与书的主题相关的图像。 本发明提供一种硬币专用显示器，其以吸引人的方式存储和显示一个或多个硬币，并且还传达或提供关于在硬币上显示的主题的附加信息。

公开(公告)号：US06336019B1

公开(公告)日：2002-01-01

申请号：US09450375

申请日：1999-11-29

申请人： Vittorio Castelli ,  Barry Wolf ,  Robert Lofthus ,  Harold Anderson

发明人： Vittorio Castelli ,  Barry Wolf ,  Robert Lofthus ,  Harold Anderson

IPC分类号： G03G1500

摘要： Systems and methods are provided that improve the registration between the color separation images. The systems and methods control the output of the image data for one or more of the color separation images and the velocity of an image-carrying member to remove or reduce registration offsets based on determined position and velocity of the image-carrying member. A position-determining sensor on an image-carrying member device module is used to determine the process-direction position of the image-carrying member to provide real time motion information by simultaneously sensing a plurality of position-determining marks. A position-determining controller determines the process-direction position of the image-carrying member by detecting the plurality of position-determining marks using the position-determining sensor and averaging or correlating the detected data.

公开(公告)号：US5748221A

公开(公告)日：1998-05-05

申请号：US551306

申请日：1995-11-01

申请人： Vittorio Castelli ,  Edward J. Solcz ,  John J. Ricciardelli ,  Harold Anderson ,  Harold Brown

发明人： Vittorio Castelli ,  Edward J. Solcz ,  John J. Ricciardelli ,  Harold Anderson ,  Harold Brown

IPC分类号： G01J3/50 ,  G03G15/01 ,  H04N1/40 ,  H04N1/50 ,  B41J2/47

CPC分类号： H04N1/506 ,  G03G2215/0174

摘要： A method and apparatus for measuring colorimetric, gloss and registration data on a substrate exiting a printing machine. A detector using a series of red, green, and blue filters collects image data and maps the collected data to absolute color coordinates. The apparatus is factory calibrated to the specific colorants used in the printing machine. Gloss measurements are made using the same apparatus. Registration data between the various color separations is also obtained and feedback delivered to the various imaging modules. The detector allows on the fly data to be obtained and machine specific corrections to be made.

摘要翻译： 一种用于在离开印刷机的基板上测量比色，光泽和配准数据的方法和装置。 使用一系列红色，绿色和蓝色滤光片的检测器收集图像数据并将收集的数据映射到绝对颜色坐标。 该设备在印刷机上用于特定着色剂的工厂校准。 使用相同的装置进行光泽度测量。 还获得了各种分色之间的记录数据，并将反馈传送到各种成像模块。 检测器允许获取飞行数据，并进行机器特定的校正。

公开(公告)号：US20080093911A1

公开(公告)日：2008-04-24

申请号：US11575273

申请日：2005-09-09

申请人： Garry Drummond ,  Eugene Honeycutt ,  Harold Anderson

发明人： Garry Drummond ,  Eugene Honeycutt ,  Harold Anderson

IPC分类号： E21C41/26 ,  B65G47/74

CPC分类号： E21C47/00 ,  B65G41/008 ,  E21C47/04

摘要： A bench mining system and mining method, particularly useful for open pit bench mining, employs a combination of bulldozers and transversely movable apron feeders to provide the primary mechanism for removal of overburden. The apron feeders are preferably equipped with a self-cleaning arrangement to facilitate continuous operation without undue stoppages.

摘要翻译： 特别适用于露天台面采矿的台式采矿系统和采矿方法采用推土机和横向移动围裙进料器的组合，为去除上覆岩层提供了主要机制。 围裙进料器优选配备有自清洁装置，以便连续操作而不会有不适当的停机。

公开(公告)号：US07347453B1

公开(公告)日：2008-03-25

申请号：US09606426

申请日：2000-06-28

申请人： Richard Hilicki ,  Harold Anderson

发明人： Richard Hilicki ,  Harold Anderson

IPC分类号： A63H3/40

CPC分类号： B42F5/00 ,  Y10S283/903

摘要： A book that is capable of displaying one or more coins related to its theme, including a front cover and a back cover. At least one book cover defines one or more apertures that are capable of receiving coins. The book theme is displayed on at least one of the book covers. The book may optionally include one or more caps that may be inserted into and removed from the coin-receivable apertures. These caps will preferably display images that are related to the theme of the book. The invention provides a coin specific display that stores and displays one or more coins in an appealing manner, and that also conveys or provides additional information about the theme displayed on the coin.

摘要翻译： 能够显示与其主题相关的一个或多个硬币的书，包括前盖和后盖。 至少一本书套限定了能够接收硬币的一个或多个孔。 该书的主题至少显示在一本书封面上。 书可以可选地包括一个或多个可以插入硬币可接收孔径的盖子。 这些帽将优选地显示与书的主题相关的图像。 本发明提供一种硬币专用显示器，其以吸引人的方式存储和显示一个或多个硬币，并且还传达或提供关于在硬币上显示的主题的附加信息。