公开(公告)号：US20060267223A1

公开(公告)日：2006-11-30

申请号：US11138203

申请日：2005-05-25

申请人： James Matayabas ,  Leonel Arana ,  Stephen Lehman

发明人： James Matayabas ,  Leonel Arana ,  Stephen Lehman

IPC分类号： H01L23/29

CPC分类号： H01L23/293 ,  C08L101/005 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/181 ,  Y10S430/128 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Integrated circuit packages and their manufacture are described, wherein the packages comprise dendrimers or hyperbranched polymers. In some implementations, the dendrimers or hyperbranched polymers include repeat units having one or more ring structures and having surface groups to react with one or more components of a plastic. In some implementations, the dendrimers or hyperbranched polymers have a glass transition temperature of less than an operating temperature of the integrated circuit and form at least a partially separate phase.

摘要翻译： 描述了集成电路封装及其制造，其中封装包括树状聚合物或超支化聚合物。 在一些实施方案中，树枝状聚合物或超支化聚合物包括具有一个或多个环结构并具有与塑料的一种或多种组分反应的表面基团的重复单元。 在一些实施方案中，树枝状聚合物或超支化聚合物具有小于集成电路的工作温度的玻璃化转变温度并且形成至少部分分离的相。

公开(公告)号：US20070262421A1

公开(公告)日：2007-11-15

申请号：US11432986

申请日：2006-05-12

申请人： Stephen Lehman ,  James Matayabas ,  Saikumar Jayaraman

发明人： Stephen Lehman ,  James Matayabas ,  Saikumar Jayaraman

IPC分类号： H01L23/29 ,  H01L21/56

CPC分类号： H01L23/24 ,  C08G73/10 ,  C08L79/08 ,  C08L2203/20 ,  C08L2205/02 ,  H01L21/563 ,  H01L21/566 ,  H01L24/29 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2924/00

摘要： Dendrimer/hyperbranched materials are combined with polyimide to form a low CTE material for use as a dielectric substrate layer or an underfill. In the alternative, ruthenium carbene complexes are used to catalyze ROMP cross-linking reactions in polyimides to produce a class of cross-linkable, thermal and mechanical stable material for use as a dielectric substrate or underfill. In another alternative, dendrimers/hyperbranched materials are synthesized by different methods to produce low viscosity, high Tg, fast curing, mechanically and chemically stable materials for imprinting applications.

摘要翻译： 树枝状聚合物/超支化材料与聚酰亚胺组合以形成用作电介质基底层或底部填充剂的低CTE材料。 另一方面，钌卡宾络合物用于催化聚酰亚胺中的ROMP交联反应，以产生用作电介质基底或底部填充剂的一类可交联，热和机械稳定的材料。 在另一种替代方案中，树枝状大分子/超支化材料通过不同的方法合成，以产生用于印记应用的低粘度，高Tg，快速固化，机械和化学稳定的材料。

公开(公告)号：US20080080950A1

公开(公告)日：2008-04-03

申请号：US11973228

申请日：2007-10-09

申请人： Stephen Lehman

发明人： Stephen Lehman

IPC分类号： F16B25/00 ,  F16B35/04 ,  F16B43/00

CPC分类号： F16B43/00 ,  F16B35/044

摘要： In relation to a nut and bolt combination that can fasten together a myriad of objects, one constant has remained the same; the nut must be threaded on to or off of the bolt to facilitate the proper employment of the two complementary devices. Oftentimes this can be a tedious, time consuming exercise. In this invention, a nut, unique bolt and unique washer combination work as one unit to facilitate the speedy removal and reinstatement, respectively, of said nut, bolt and washer from and to any two or more objects meant to be joined together by use of such a device.

摘要翻译： 关于可以将各种物品固定在一起的螺母和螺栓组合，一个常数保持不变; 必须将螺母拧入螺栓，以便正确使用两个互补装置。 通常这可能是一个乏味，耗时的运动。 在本发明中，螺母，独特的螺栓和独特的垫圈组合作为一个单元工作，以便于分别从所述螺母，螺栓和垫圈快速移除和恢复意图通过使用 这样的设备。

公开(公告)号：US20060094258A1

公开(公告)日：2006-05-04

申请号：US10976627

申请日：2004-10-29

申请人： Stephen Lehman

发明人： Stephen Lehman

IPC分类号： H01L21/31 ,  H01L21/50

CPC分类号： H01L21/02118 ,  C08F230/04 ,  C08G61/06 ,  H01L21/02288 ,  H01L21/312 ,  H01L23/293 ,  H01L2924/0002 ,  H01L2924/12044 ,  H01L2924/00

摘要： An embodiment is a cyclic olefin semiconductor package. Further an embodiment is a combination of a cyclic olefin monomer and a ruthenium-based catalyst that is stable at approximately room temperature and humidity for extended storage life and pot life, and that can be screen printed or valve/jet deposited.

摘要翻译： 一个实施方案是环烯烃半导体封装。 另外一个实施方案是在大约室温和湿度下稳定的环烯烃单体和钌基催化剂的组合，以延长储存寿命和适用期，并且可以是丝网印刷或阀/喷射沉积。

公开(公告)号：US20070029653A1

公开(公告)日：2007-02-08

申请号：US11199682

申请日：2005-08-08

申请人： Stephen Lehman ,  Nirupama Chakrapani

发明人： Stephen Lehman ,  Nirupama Chakrapani

IPC分类号： H01L23/02

CPC分类号： H01L21/563 ,  H01L23/293 ,  H01L23/562 ,  H01L24/29 ,  H01L24/743 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83194 ,  H01L2924/01033 ,  H01L2924/0106 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/3512

摘要： A method, apparatus and system with an autonomic, self-healing polymer capable of slowing crack propagation within the polymer and slowing delamination at a material interface.

摘要翻译： 具有自主自愈聚合物的方法，装置和系统，其能够减缓聚合物内的裂纹扩展并减缓材料界面处的分层。

公开(公告)号：US20060068579A1

公开(公告)日：2006-03-30

申请号：US10954999

申请日：2004-09-29

申请人： Daewoong Suh ,  Saikumar Jayaraman ,  Stephen Lehman ,  Mitesh Patel ,  Tiffany Byrne ,  Edward Martin ,  Mohd Erwan Basiron ,  Wei Keat Loh ,  Sheau Hooi Lim ,  Yoong Tatt Chin

发明人： Daewoong Suh ,  Saikumar Jayaraman ,  Stephen Lehman ,  Mitesh Patel ,  Tiffany Byrne ,  Edward Martin ,  Mohd Erwan Basiron ,  Wei Keat Loh ,  Sheau Hooi Lim ,  Yoong Tatt Chin

IPC分类号： H01L21/44

CPC分类号： H05K3/3436 ,  H01L23/562 ,  H01L24/16 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01025 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H05K1/0271 ,  H05K3/3463 ,  H05K2201/10977 ,  H05K2203/0126 ,  Y02P70/613 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A stress-relief layer is formed by dispensing a polymer upon a substrate lower surface under conditions to partially embed a low melting-point solder bump that is disposed upon the lower surface. The stress-relief layer flows against the low melting-point solder bump. A stress-compensation collar is formed on a board to which the substrate is mated, and the stress-compensation collar partially embeds the low melting-point solder bump. An article that exhibits a stress-relief layer and a stress-compensation collar is also included. A computing system that includes the low melting-point solder, the stress-relief layer, and the stress-compensation collar is also included.

摘要翻译： 通过在基底下表面上分配聚合物以部分地嵌入设置在下表面上的低熔点焊料凸点的条件来形成应力消除层。 应力消除层流向低熔点焊料凸块。 应力补偿轴环形成在与基板相配合的基板上，并且应力补偿套环部分嵌入低熔点焊料凸块。 还包括展示应力消除层和应力补偿套环的物品。 还包括包括低熔点焊料，应力消除层和应力补偿环的计算系统。

公开(公告)号：US20070154627A1

公开(公告)日：2007-07-05

申请号：US11322402

申请日：2005-12-30

申请人： Stephen Lehman ,  Vijay Wakharkar

发明人： Stephen Lehman ,  Vijay Wakharkar

IPC分类号： B05D5/12

CPC分类号： B05D3/108 ,  Y10T428/31511 ,  Y10T428/31551 ,  Y10T428/31855 ,  Y10T428/31931 ,  Y10T428/31935

摘要： Smart curing by coupling a catalyst to one or more surface(s) of one or more microelectronic element(s) is generally described. In this regard, according to one example embodiment, a catalyst is coupled to one or more surface(s) of one or more microelectronic element(s) to promote polymerization of an adhesive brought in contact with the catalyst.

摘要翻译： 通常将一种催化剂与一种或多种微电子元件的一个或多个表面偶联进行智能固化。 在这方面，根据一个示例性实施方案，将催化剂偶联到一个或多个微电子元件的一个或多个表面以促进与催化剂接触的粘合剂的聚合。

公开(公告)号：US20070090532A1

公开(公告)日：2007-04-26

申请号：US11241258

申请日：2005-09-30

申请人： Stephen Lehman

发明人： Stephen Lehman

IPC分类号： H01L23/52

CPC分类号： H01L23/3128 ,  H01L21/563 ,  H01L23/293 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83192 ,  H01L2924/0001 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/19041 ,  H05K3/305 ,  H05K3/3436 ,  H05K2201/10674 ,  H05K2201/10734 ,  H05K2201/10977 ,  H05K2203/1189 ,  Y02P70/613 ,  Y10T428/31504 ,  H01L2924/01083 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2924/00012 ,  H01L2224/05599

摘要： A chip-packaging composition includes a thermosetting resin and at least one of an N-heterocyclic carbene adduct, an imidazole, and a cycloaliphatic amine hardener. The chip-packaging composition is applied to flip-chip technology during no-flow underfill mounting of the flip-chip to a mounting substrate. The mounting substrate can be further mounted on a board. A process includes formation of the chip-packaging composition. A method includes assembly of the chip-packaging composition with the flip-chip, and further can include assembly of the mounting substrate to a board. A computing system is also included that uses the chip-packaging composition.

摘要翻译： 芯片包装组合物包括热固性树脂和N-杂环卡宾加合物，咪唑和脂环族胺固化剂中的至少一种。 将芯片封装组合物应用于倒装芯片技术，在倒装芯片的无填充底部安装到安装基板。 安装基板可以进一步安装在板上。 一种方法包括形成芯片包装组合物。 一种方法包括使用倒装芯片组装芯片封装组合物，还可以包括将安装基板组装到板上。 还包括使用芯片封装组合物的计算系统。

公开(公告)号：US20080116497A1

公开(公告)日：2008-05-22

申请号：US12022250

申请日：2008-01-30

申请人： Stephen Lehman

发明人： Stephen Lehman

IPC分类号： H01L27/108 ,  C08G59/00 ,  C08G59/50 ,  B32B27/00 ,  B05D5/12

CPC分类号： H01L23/3128 ,  H01L21/563 ,  H01L23/293 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83192 ,  H01L2924/0001 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/19041 ,  H05K3/305 ,  H05K3/3436 ,  H05K2201/10674 ,  H05K2201/10734 ,  H05K2201/10977 ,  H05K2203/1189 ,  Y02P70/613 ,  Y10T428/31504 ,  H01L2924/01083 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2924/00012 ,  H01L2224/05599

摘要： A chip-packaging composition includes a thermosetting resin and at least one of an N-hetero cyclic carbene adduct, an imidazole, and a cycloaliphatic amine hardener. The chip-packaging composition is applied to flip-chip technology during no-flow underfill mounting of the flip-chip to a mounting substrate. The mounting substrate can be further mounted on a board. A process includes formation of the chip-packaging composition. A method includes assembly of the chip-packaging composition with the flip-chip, and further can include assembly of the mounting substrate to a board. A computing system is also included that uses the chip-packaging composition.

摘要翻译： 芯片包装组合物包括热固性树脂和N-杂环碳烯加合物，咪唑和脂环族胺固化剂中的至少一种。 将芯片封装组合物应用于倒装芯片技术，在倒装芯片的无填充底部安装到安装基板。 安装基板可以进一步安装在板上。 一种方法包括形成芯片包装组合物。 一种方法包括使用倒装芯片组装芯片封装组合物，还可以包括将安装基板组装到板上。 还包括使用芯片封装组合物的计算系统。

公开(公告)号：US20070190772A1

公开(公告)日：2007-08-16

申请号：US11736280

申请日：2007-04-17

申请人： Daewoong Suh ,  Saikumar Jayaraman ,  Stephen Lehman ,  Mitesh Patel ,  Tiffany Byrne ,  Eward Martin ,  Mohd Erwan Basiron ,  Wei Loh ,  Sheau Lim ,  Yoong Tatt Chin

发明人： Daewoong Suh ,  Saikumar Jayaraman ,  Stephen Lehman ,  Mitesh Patel ,  Tiffany Byrne ,  Eward Martin ,  Mohd Erwan Basiron ,  Wei Loh ,  Sheau Lim ,  Yoong Tatt Chin

IPC分类号： H01L21/44

CPC分类号： H05K3/3436 ,  H01L23/562 ,  H01L24/16 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01025 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H05K1/0271 ,  H05K3/3463 ,  H05K2201/10977 ,  H05K2203/0126 ,  Y02P70/613 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A stress-relief layer is formed by dispensing a polymer upon a substrate lower surface under conditions to partially embed a low melting-point solder bump that is disposed upon the lower surface. The stress-relief layer flows against the low melting-point solder bump. A stress-compensation collar is formed on a board to which the substrate is mated, and the stress-compensation collar partially embeds the low melting-point solder bump. An article that exhibits a stress-relief layer and a stress-compensation collar is also included. A computing system that includes the low melting-point solder, the stress-relief layer, and the stress-compensation collar is also included.

摘要翻译： 通过在基底下表面上分配聚合物以部分地嵌入设置在下表面上的低熔点焊料凸点的条件来形成应力消除层。 应力消除层流向低熔点焊料凸块。 应力补偿轴环形成在与基板相配合的基板上，并且应力补偿套环部分嵌入低熔点焊料凸块。 还包括展示应力消除层和应力补偿套环的物品。 还包括包括低熔点焊料，应力消除层和应力补偿环的计算系统。