公开(公告)号：US20060068579A1

公开(公告)日：2006-03-30

申请号：US10954999

申请日：2004-09-29

申请人： Daewoong Suh ,  Saikumar Jayaraman ,  Stephen Lehman ,  Mitesh Patel ,  Tiffany Byrne ,  Edward Martin ,  Mohd Erwan Basiron ,  Wei Keat Loh ,  Sheau Hooi Lim ,  Yoong Tatt Chin

发明人： Daewoong Suh ,  Saikumar Jayaraman ,  Stephen Lehman ,  Mitesh Patel ,  Tiffany Byrne ,  Edward Martin ,  Mohd Erwan Basiron ,  Wei Keat Loh ,  Sheau Hooi Lim ,  Yoong Tatt Chin

IPC分类号： H01L21/44

CPC分类号： H05K3/3436 ,  H01L23/562 ,  H01L24/16 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01025 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H05K1/0271 ,  H05K3/3463 ,  H05K2201/10977 ,  H05K2203/0126 ,  Y02P70/613 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A stress-relief layer is formed by dispensing a polymer upon a substrate lower surface under conditions to partially embed a low melting-point solder bump that is disposed upon the lower surface. The stress-relief layer flows against the low melting-point solder bump. A stress-compensation collar is formed on a board to which the substrate is mated, and the stress-compensation collar partially embeds the low melting-point solder bump. An article that exhibits a stress-relief layer and a stress-compensation collar is also included. A computing system that includes the low melting-point solder, the stress-relief layer, and the stress-compensation collar is also included.

摘要翻译： 通过在基底下表面上分配聚合物以部分地嵌入设置在下表面上的低熔点焊料凸点的条件来形成应力消除层。 应力消除层流向低熔点焊料凸块。 应力补偿轴环形成在与基板相配合的基板上，并且应力补偿套环部分嵌入低熔点焊料凸块。 还包括展示应力消除层和应力补偿套环的物品。 还包括包括低熔点焊料，应力消除层和应力补偿环的计算系统。

公开(公告)号：US20070190772A1

公开(公告)日：2007-08-16

申请号：US11736280

申请日：2007-04-17

申请人： Daewoong Suh ,  Saikumar Jayaraman ,  Stephen Lehman ,  Mitesh Patel ,  Tiffany Byrne ,  Eward Martin ,  Mohd Erwan Basiron ,  Wei Loh ,  Sheau Lim ,  Yoong Tatt Chin

发明人： Daewoong Suh ,  Saikumar Jayaraman ,  Stephen Lehman ,  Mitesh Patel ,  Tiffany Byrne ,  Eward Martin ,  Mohd Erwan Basiron ,  Wei Loh ,  Sheau Lim ,  Yoong Tatt Chin

IPC分类号： H01L21/44

CPC分类号： H05K3/3436 ,  H01L23/562 ,  H01L24/16 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01025 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H05K1/0271 ,  H05K3/3463 ,  H05K2201/10977 ,  H05K2203/0126 ,  Y02P70/613 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A stress-relief layer is formed by dispensing a polymer upon a substrate lower surface under conditions to partially embed a low melting-point solder bump that is disposed upon the lower surface. The stress-relief layer flows against the low melting-point solder bump. A stress-compensation collar is formed on a board to which the substrate is mated, and the stress-compensation collar partially embeds the low melting-point solder bump. An article that exhibits a stress-relief layer and a stress-compensation collar is also included. A computing system that includes the low melting-point solder, the stress-relief layer, and the stress-compensation collar is also included.

摘要翻译： 通过在基底下表面上分配聚合物以部分地嵌入设置在下表面上的低熔点焊料凸点的条件来形成应力消除层。 应力消除层流向低熔点焊料凸块。 应力补偿轴环形成在与基板相配合的基板上，并且应力补偿套环部分嵌入低熔点焊料凸块。 还包括展示应力消除层和应力补偿套环的物品。 还包括包括低熔点焊料，应力消除层和应力补偿环的计算系统。

公开(公告)号：US07253088B2

公开(公告)日：2007-08-07

申请号：US10954999

申请日：2004-09-29

申请人： Daewoong Suh ,  Saikumar Jayaraman ,  Stephen E. Lehman ,  Mitesh Patel ,  Tiffany A. Byrne ,  Edward L. Martin ,  Mohd Erwan B. Basiron ,  Wei Keat Loh ,  Sheau Hooi Lim ,  Yoong Tatt P. Chin

发明人： Daewoong Suh ,  Saikumar Jayaraman ,  Stephen E. Lehman ,  Mitesh Patel ,  Tiffany A. Byrne ,  Edward L. Martin ,  Mohd Erwan B. Basiron ,  Wei Keat Loh ,  Sheau Hooi Lim ,  Yoong Tatt P. Chin

IPC分类号： H01L21/44

CPC分类号： H05K3/3436 ,  H01L23/562 ,  H01L24/16 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01025 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H05K1/0271 ,  H05K3/3463 ,  H05K2201/10977 ,  H05K2203/0126 ,  Y02P70/613 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A stress-relief layer is formed by dispensing a polymer upon a substrate lower surface under conditions to partially embed a low melting-point solder bump that is disposed upon the lower surface. The stress-relief layer flows against the low melting-point solder bump. A stress-compensation collar is formed on a board to which the substrate is mated, and the stress-compensation collar partially embeds the low melting-point solder bump. An article that exhibits a stress-relief layer and a stress-compensation collar is also included. A computing system that includes the low melting-point solder, the stress-relief layer, and the stress-compensation collar is also included.

公开(公告)号：US07291548B2

公开(公告)日：2007-11-06

申请号：US11736280

申请日：2007-04-17

申请人： Daewoong Suh ,  Saikumar Jayaraman ,  Stephen E. Lehman ,  Mitesh Patel ,  Tiffany A. Byrne ,  Edward L. Martin ,  Mohd Erwan B. Basiron ,  Wei Keat Loh ,  Sheau Hooi Lim ,  Yoong Tatt P. Chin

发明人： Daewoong Suh ,  Saikumar Jayaraman ,  Stephen E. Lehman ,  Mitesh Patel ,  Tiffany A. Byrne ,  Edward L. Martin ,  Mohd Erwan B. Basiron ,  Wei Keat Loh ,  Sheau Hooi Lim ,  Yoong Tatt P. Chin

IPC分类号： H01L21/44

CPC分类号： H05K3/3436 ,  H01L23/562 ,  H01L24/16 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01025 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H05K1/0271 ,  H05K3/3463 ,  H05K2201/10977 ,  H05K2203/0126 ,  Y02P70/613 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A stress-relief layer is formed by dispensing a polymer upon a substrate lower surface under conditions to partially embed a low melting-point solder bump that is disposed upon the lower surface. The stress-relief layer flows against the low melting-point solder bump. A stress-compensation collar is formed on a board to which the substrate is mated, and the stress-compensation collar partially embeds the low melting-point solder bump. An article that exhibits a stress-relief layer and a stress-compensation collar is also included. A computing system that includes the low melting-point solder, the stress-relief layer, and the stress-compensation collar is also included.

摘要翻译： 通过在基底下表面上分配聚合物以部分地嵌入设置在下表面上的低熔点焊料凸点的条件来形成应力消除层。 应力消除层流向低熔点焊料凸块。 应力补偿轴环形成在与基板相配合的基板上，并且应力补偿套环部分嵌入低熔点焊料凸块。 还包括展示应力消除层和应力补偿套环的物品。 还包括包括低熔点焊料，应力消除层和应力补偿环的计算系统。

公开(公告)号：US07244634B2

公开(公告)日：2007-07-17

申请号：US10815968

申请日：2004-03-31

申请人： Daewoong Suh ,  Saikumar Jayaraman ,  Mohd Erwan P. Bin Basiron ,  Sheau Hooi Lim ,  Yoong Tatt P. Chin

发明人： Daewoong Suh ,  Saikumar Jayaraman ,  Mohd Erwan P. Bin Basiron ,  Sheau Hooi Lim ,  Yoong Tatt P. Chin

IPC分类号： H01L21/00

CPC分类号： H05K3/3436 ,  H01L23/49816 ,  H01L23/49838 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01077 ,  H01L2924/15311 ,  H05K1/0271 ,  H05K2201/10977 ,  H05K2203/0126 ,  H05K2203/1189 ,  Y02P70/613 ,  H01L2224/05599

摘要： A stress-relief layer is formed by dispensing a polymer upon a substrate lower surface under conditions to partially embed a solder bump that is disposed upon the lower surface. The stress-relief layer flows against the solder bump. A stress-compensation collar is formed on a board to which the substrate is mated and the SCC partially embeds the solder bump. An article that exhibits a stress-relief layer and a stress-compensation collar is also included. A computing system that includes a stress-relief layer and a stress-compensation collar is also included.

摘要翻译： 通过在基底下表面上分配聚合物以部分地嵌入设置在下表面上的焊料凸块的条件来形成应力消除层。 应力消除层流向焊料凸块。 应力补偿轴环形成在与基板配合的板上，并且SCC部分地嵌入焊料凸块。 还包括展示应力消除层和应力补偿套环的物品。 还包括一个包括应力消除层和应力补偿环的计算系统。

公开(公告)号：US20060067852A1

公开(公告)日：2006-03-30

申请号：US10954959

申请日：2004-09-29

申请人： Daewoong Suh ,  Tiffany Byrne ,  Melissa Baeten ,  Edward Martin

发明人： Daewoong Suh ,  Tiffany Byrne ,  Melissa Baeten ,  Edward Martin

IPC分类号： C22C30/04 ,  C22C12/00 ,  C22C28/00

CPC分类号： C22C28/00 ,  C22C12/00 ,  C22C13/00 ,  C22C30/04 ,  C22C32/00 ,  H01L24/11 ,  H01L24/81 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/1132 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L2224/48235 ,  H01L2224/48464 ,  H01L2224/48471 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01051 ,  H01L2924/01057 ,  H01L2924/01059 ,  H01L2924/0107 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/16152 ,  H05K3/3463 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A composition includes a tin-containing solder with a melting temperature below about 150° C. The tin-containing solder includes indium, tin, and bismuth as alloy elements, and optionally contains a doping material and/or a second-phase dispersiod. A process includes blending the tin-containing solder under non-alloying conditions to achieve the discrete dispersion of the doping material. A process also includes blending the tin-containing solder with the particulate to achieve the discrete dispersion of the particulate. The composition is also combined with a microelectronic device to form a package. The composition is also combined with a microelectronic device and at least one I/O functionality to form a computing system.

摘要翻译： 组合物包括熔融温度低于约150℃的含锡焊料。含锡焊料包括铟，锡和铋作为合金元素，并且任选地包含掺杂材料和/或第二相分散体。 一种方法包括在非合金化条件下混合含锡焊料以实现掺杂材料的离散分散。 一种方法还包括将含锡焊料与颗粒混合以实现颗粒的离散分散。 组合物还与微电子器件组合以形成包装。 组合物还与微电子器件和至少一个I / O功能组合以形成计算系统。

公开(公告)号：US20060060639A1

公开(公告)日：2006-03-23

申请号：US10946711

申请日：2004-09-21

申请人： Tiffany Byrne ,  Edward Martin ,  Carl Deppisch ,  Daewoong Suh

发明人： Tiffany Byrne ,  Edward Martin ,  Carl Deppisch ,  Daewoong Suh

IPC分类号： B23K31/00

CPC分类号： H05K3/3436 ,  B23K35/0244 ,  B23K35/26 ,  H01L23/49816 ,  H01L2924/0002 ,  H05K3/3463 ,  H05K3/3484 ,  H05K2201/0209 ,  H05K2201/0215 ,  H05K2201/10992 ,  Y02P70/613 ,  H01L2924/00

摘要： According to one aspect of the invention, a contact formation and an electronic assembly incorporating the contact formation are provided. The contact formation may include a low temperature solder material and a plurality of dopant material particles within the solder material. The dopant material may include at least one of an insoluble metal, an intermetallic compound, and an oxide. The low temperature solder material may have a first liquidus temperature, and the contact formation may have a second liquidus temperature. The second liquidus temperature may be approximately the same as the first liquidus temperature.

摘要翻译： 根据本发明的一个方面，提供一种接触形式和包括接触形成的电子组件。 接触形成可以包括焊料材料内的低温焊料材料和多个掺杂剂材料颗粒。 掺杂剂材料可以包括不溶性金属，金属间化合物和氧化物中的至少一种。 低温焊料材料可以具有第一液相线温度，并且接触形成可以具有第二液相线温度。 第二液相线温度可以与第一液相线温度大致相同。

公开(公告)号：US09929080B2

公开(公告)日：2018-03-27

申请号：US10990228

申请日：2004-11-15

申请人： Daewoong Suh ,  Saikumar Jayaraman

发明人： Daewoong Suh ,  Saikumar Jayaraman

IPC分类号： H01L21/56 ,  H01L23/498 ,  H01L21/48 ,  H01L23/00 ,  H05K3/34 ,  H05K3/30

CPC分类号： H01L23/49816 ,  H01L21/4853 ,  H01L21/563 ,  H01L23/562 ,  H01L2924/0002 ,  H01L2924/15311 ,  H05K3/305 ,  H05K3/3436 ,  H05K3/3484 ,  H05K2201/10977 ,  H05K2203/043 ,  H05K2203/0568 ,  Y02P70/613 ,  H01L2924/00

摘要： Methods of forming a microelectronic structure are described. Those methods comprise forming a stress compensation layer on a substrate, forming at least one opening within the stress compensation layer, and forming an interconnect paste within the at least one opening.

公开(公告)号：US20060105497A1

公开(公告)日：2006-05-18

申请号：US10990228

申请日：2004-11-15

申请人： Daewoong Suh ,  Saikumar Jayaraman

发明人： Daewoong Suh ,  Saikumar Jayaraman

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L23/49816 ,  H01L21/4853 ,  H01L21/563 ,  H01L23/562 ,  H01L2924/0002 ,  H01L2924/15311 ,  H05K3/305 ,  H05K3/3436 ,  H05K3/3484 ,  H05K2201/10977 ,  H05K2203/043 ,  H05K2203/0568 ,  Y02P70/613 ,  H01L2924/00

摘要： Methods of forming a microelectronic structure are described. Those methods comprise forming a stress compensation layer on a substrate, forming at least one opening within the stress compensation layer, and forming an interconnect paste within the at least one opening.

摘要翻译： 描述形成微电子结构的方法。 这些方法包括在衬底上形成应力补偿层，在应力补偿层内形成至少一个开口，以及在至少一个开口内形成互连膏。

公开(公告)号：US20050224951A1

公开(公告)日：2005-10-13

申请号：US10815565

申请日：2004-03-31

申请人： Daewoong Suh ,  Christos Economopoulos ,  Saikumar Jayaraman ,  Mohd Basiron ,  Sheau Lim ,  Yoong Chin

发明人： Daewoong Suh ,  Christos Economopoulos ,  Saikumar Jayaraman ,  Mohd Basiron ,  Sheau Lim ,  Yoong Chin

IPC分类号： H01L21/48 ,  H01L23/12 ,  H01L23/498 ,  H05K3/34

CPC分类号： H01L23/49816 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/15311 ,  H05K3/3436 ,  H05K2201/0209 ,  H05K2201/10977 ,  H05K2203/0126 ,  Y02P70/613 ,  H01L2224/05599

摘要： A stress-relief layer is formed by dispensing a polymer upon a substrate lower surface under conditions to partially embed a solder bump that is disposed upon the lower surface. The stress-relief layer flows against the solder bump. An article that exhibits a stress-relief layer with a structure characteristic of the manner of dispensing is also included. A computing system that includes a stress-relief layer with a structure characteristic of the manner of dispensing is also included.

摘要翻译： 通过在基底下表面上分配聚合物以部分地嵌入设置在下表面上的焊料凸块的条件来形成应力消除层。 应力消除层流向焊料凸块。 还包括具有分配方式结构特征的应力消除层的制品。 还包括包括具有分配方式的结构特征的应力消除层的计算系统。