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    Nitrided STI liner oxide for reduced corner device impact on vertical device performance
    7.
    发明授权
    Nitrided STI liner oxide for reduced corner device impact on vertical device performance 有权
    氮化氮化物衬垫氧化物，用于减少拐角装置对垂直装置性能的影响

    公开(公告)号：US06998666B2

    公开(公告)日：2006-02-14

    申请号：US10707754

    申请日：2004-01-09

    申请人： Jochen Beintner ,  Rama Divakaruni ,  Rajarao Jammy

    发明人： Jochen Beintner ,  Rama Divakaruni ,  Rajarao Jammy

    IPC分类号： H01L21/8242

    CPC分类号： H01L27/10864 ,  H01L27/10841 ,  H01L27/10894

    摘要： A method of fabricating an integrated circuit device comprises etching a trench in a substrate and forming a dynamic random access memory (DRAM) cell having a storage capacitor at a lower end and an overlying vertical metal oxide semiconductor field effect transistor (MOSFET) comprising a gate conductor and a boron-doped channel. The method includes forming trenches adjacent the DRAM cell and a silicon-oxy-nitride isolation liner on either side of the DRAM cell, adjacent the gate conductor. Isolation regions are then formed in the trenches on either side of the DRAM cell. Thereafter, the DRAM cell, including the boron-containing channel region adjacent the gate conductor, is subjected to elevated temperatures by thermal processing, for example, forming a support device on the substrate adjacent the isolation regions. The nitride-containing isolation liner reduces segregation of the boron in the channel region, as compared to an essentially nitrogen-free oxide-containing isolation liner.

    摘要翻译： 一种制造集成电路器件的方法包括蚀刻衬底中的沟槽并形成具有位于下端的存储电容器的动态随机存取存储器（DRAM）单元和覆盖的垂直金属氧化物半导体场效应晶体管（MOSFET），其包括栅极 导体和掺硼通道。 该方法包括在DRAM单元附近形成沟槽和在DRAM单元的任一侧上与栅极导体相邻的硅 - 氮氧化物隔离衬垫。 然后在DRAM单元的两侧的沟槽中形成隔离区。 此后，包括与栅极导体相邻的含硼沟道区域的DRAM单元通过热处理受到升高的温度，例如，在邻近隔离区域的衬底上形成支撑器件。 与基本上不含氮氧化物的隔离衬垫相比，含氮化物的隔离衬垫减少了沟道区域中的硼的偏析。

    STRUCTURE AND METHOD OF SELF-ALIGNED BIPOLAR TRANSISTOR HAVING TAPERED COLLECTOR
    8.
    发明申请
    STRUCTURE AND METHOD OF SELF-ALIGNED BIPOLAR TRANSISTOR HAVING TAPERED COLLECTOR 有权
    带有收集器的自对准双极晶体管的结构和方法

    公开(公告)号：US20050184359A1

    公开(公告)日：2005-08-25

    申请号：US10708340

    申请日：2004-02-25

    申请人： Hiroyuki Akatsu ,  Rama Divakaruni ,  Gregory Freeman ,  David Greenberg ,  Marwan Khater ,  William Tonti

    发明人： Hiroyuki Akatsu ,  Rama Divakaruni ,  Gregory Freeman ,  David Greenberg ,  Marwan Khater ,  William Tonti

    IPC分类号： H01L21/331 ,  H01L27/082 ,  H01L29/08 ,  H01L29/737

    CPC分类号： H01L29/66242 ,  H01L29/0821 ,  H01L29/7378

    摘要： A bipolar transistor is provided which includes a tapered, i.e. frustum-shaped, collector pedestal having an upper substantially planar surface, a lower surface, and a slanted sidewall extending between the upper surface and the lower surface, the upper surface having substantially less area than the lower surface. The bipolar transistor further includes an intrinsic base overlying the upper surface of the collector pedestal, a raised extrinsic base conductively connected to the intrinsic base and an emitter overlying the intrinsic base. In a particular embodiment, the emitter is self-aligned to the collector pedestal, having a centerline which is aligned to the centerline of the collector pedestal.

    摘要翻译： 提供了一种双极晶体管，其包括锥形的，即截头锥形的收集器基座，其具有上部基本平坦的表面，下表面和在上表面和下表面之间延伸的倾斜侧壁，上表面具有基本上较小的面积 下表面。 双极晶体管还包括覆盖集电极基座的上表面的本征基极，与本征基极导电连接的升高的外部基极和覆盖本征基极的发射极。 在特定实施例中，发射器与收集器基座自对准，具有与收集器基座的中心线对准的中心线。

    Filling high aspect ratio isolation structures with polysilazane based material
    10.
    发明授权
    Filling high aspect ratio isolation structures with polysilazane based material 失效
    用聚硅氮烷基材料填充高纵横比隔离结构

    公开(公告)号：US06869860B2

    公开(公告)日：2005-03-22

    申请号：US10250092

    申请日：2003-06-03

    申请人： Michael P. Belyansky ,  Rama Divakaruni ,  Laertis Economikos ,  Rajarao Jammy ,  Kenneth T. Settlemeyer, Jr. ,  Padraic C. Shafer

    发明人： Michael P. Belyansky ,  Rama Divakaruni ,  Laertis Economikos ,  Rajarao Jammy ,  Kenneth T. Settlemeyer, Jr. ,  Padraic C. Shafer

    IPC分类号： H01L21/76 ,  H01L21/762 ,  H01L21/8242 ,  H01L27/108

    CPC分类号： H01L21/76229

    摘要： Isolation trenches and capacitor trenches containing vertical FETs (or any prior levels p-n junctions or dissimilar material interfaces) having an aspect ratio up to 60 are filled with a process comprising: applying a spin-on material based on silazane and having a low molecular weight; pre-baking the applied material in an oxygen ambient at a temperature below about 450 deg C.; converting the stress in the material by heating at an intermediate temperature between 450 deg C. and 800 deg C. in an H2O ambient; and heating again at an elevated temperature in an O2 ambient, resulting in a material that is stable up to 1000 deg C., has a compressive stress that may be tuned by variation of the process parameters, has an etch rate comparable to oxide dielectric formed by HDP techniques, and is durable enough to withstand CMP polishing.

    摘要翻译： 包含具有高达60的纵横比的垂直FET（或任何先前级别的p-n结或异种材料界面）的隔离沟槽和电容器沟槽被填充了一种方法，其包括：施加基于硅氮烷并且具有低分子量的旋涂材料; 在低于约450℃的温度下在氧环境中预烘烤施加的材料; 通过在H 2 O环境中在450摄氏度和800摄氏度之间的中间温度下加热来转化材料中的应力; 并且在高温下再次在O 2环境中加热，得到稳定至高达1000℃的材料，具有可通过工艺参数变化调节的压缩应力，具有与形成的氧化物电介质相当的蚀刻速率 通过HDP技术，并且耐用性足以承受CMP抛光。