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    High density data storage medium
    1.
    发明申请
    High density data storage medium 失效
    高密度数据存储介质

    公开(公告)号：US20050050258A1

    公开(公告)日：2005-03-03

    申请号：US10652543

    申请日：2003-08-29

    申请人： Jane Frommer ,  Robert Miller ,  Craig Hawker ,  Victor Lee

    发明人： Jane Frommer ,  Robert Miller ,  Craig Hawker ,  Victor Lee

    IPC分类号： G11C13/02 ,  G11C5/00

    CPC分类号： G11C13/0014 ,  B82Y10/00 ,  G11B9/1472 ,  G11B9/149 ,  G11B11/007 ,  G11C13/0016 ,  G11C13/02

    摘要： An approach is presented for designing the polymeric recording layer for nanometer scale thermomechanical storage devices. Cross linked polymers are used as the recording layers in atomic force microscopy data storage devices, giving significantly improved performance when compared to the previously reported linear polymers. This results in superior wear resistance and enhanced erasing, critical features for the long-term multiple read-write cycles of such thermomechanical storage devices. In addition, this ability to introduce a predetermined extent of cross linking allows fine tuning of the thermal and force parameters in the R/W/E (read-write-erase) cycles.

    摘要翻译： 提出了一种用于设计纳米级热机械储存装置的聚合物记录层的方法。 交联聚合物用作原子力显微镜数据存储装置中的记录层，与先前报道的线性聚合物相比，显着提高了性能。 这导致了这种热机械储存装置的长期多次读写周期的优异的耐磨性和增强的擦除，关键特征。 此外，引入预定程度的交联的这种能力允许在R / W / E（读写擦除）周期中微调热和力参数。

    Sliders bonded by a debondable encapsulant comprising different polymers formed via in situ polymerization
    8.
    发明申请
    Sliders bonded by a debondable encapsulant comprising different polymers formed via in situ polymerization 有权
    通过包含通过原位聚合形成的不同聚合物的可剥离密封剂结合的滑块

    公开(公告)号：US20050243469A1

    公开(公告)日：2005-11-03

    申请号：US10835845

    申请日：2004-04-29

    申请人： Michael Chaw ,  Dan Dawson ,  Craig Hawker ,  James Hedrick ,  Wesley Hillman ,  Teddie Magbitang ,  Dennis McKean ,  Robert Miller ,  Willi Volksen

    发明人： Michael Chaw ,  Dan Dawson ,  Craig Hawker ,  James Hedrick ,  Wesley Hillman ,  Teddie Magbitang ,  Dennis McKean ,  Robert Miller ,  Willi Volksen

    IPC分类号： G11B5/60

    CPC分类号： G11B5/6082 ,  Y10T29/49032 ,  Y10T29/4905 ,  Y10T156/11

    摘要： A slider assembly is provided comprising a plurality of sliders bonded by a debondable solid encapsulant comprised of different first and second polymers The solid encapsulant is comprised of a polymer prepared by polymerizing an encapsulant fluid comprising a homogeneous mixture of first and second constituents. The first constituent is comprised of a first monomer suitable for in situ polymerization to form the first polymer. The second constituent is comprised of the second polymer or a second monomer suitable for in situ polymerization to form the second polymer. The first constituent does not substantially react with the second constituent. Each slider has a surface that is free from the encapsulant. The encapsulant-free surfaces are coplanar to each other. Also provided are methods for forming the assembly and methods for patterning a slider surface using the encapsulant.

    摘要翻译： 提供了一种滑块组件，其包括由不同的第一和第二聚合物组成的可分散固体密封剂结合的多个滑块。固体密封剂由通过聚合包含第一和第二组分的均匀混合物的密封剂流体制备的聚合物组成。 第一组分由适于原位聚合以形成第一聚合物的第一单体组成。 第二组分由第二聚合物或适于原位聚合形成第二聚合物的第二单体组成。 第一组分基本上不与第二组分反应。 每个滑块具有没有密封剂的表面。 无密封剂的表面彼此共面。 还提供了用于形成组件的方法和使用密封剂来图案化滑块表面的方法。

    Surface-decorated polymeric amphiphile porogens for the templation of nanoporous materials
    9.
    发明申请
    Surface-decorated polymeric amphiphile porogens for the templation of nanoporous materials 有权
    用于纳米多孔材料模板的表面改性聚合物两亲性致孔剂

    公开(公告)号：US20060247383A1

    公开(公告)日：2006-11-02

    申请号：US11119306

    申请日：2005-04-28

    申请人： James Hedrick ,  Victor Lee ,  Teddie Magbitang ,  Robert Miller

    发明人： James Hedrick ,  Victor Lee ,  Teddie Magbitang ,  Robert Miller

    IPC分类号： C08F297/02

    CPC分类号： C08G83/003

    摘要： A nanoparticle which includes a multi-armed core and surface decoration which is attached to the core is prepared. A multi-armed core is provided by any of a number of possible routes, exemplary preferred routes being living anionic polymerization that is initiated by a reactive, functionalized anionic initiator and ε-caprolactone polymerization of a bis-MPA dendrimer. The multi-armed core is preferably functionalized on some or all arms. A coupling reaction is then employed to bond surface decoration to one or more arms of the multi-armed core. The surface decoration is a small molecule or oligomer with a degree of polymerization less than 50, a preferred decoration being a PEG oligomer with degree of polymerization between 2 and 24. The nanoparticles (particle size ≦10 nm) are employed as sacrificial templating porogens to form porous dielectrics. The porogens are mixed with matrix precursors (e.g., methyl silsesquioxane resin), the matrix vitrifies, and the porogens are removed via burnout. Greater porosity reduces the dielectric constant k of the resulting dielectrics. The porous dielectrics are incorporated into integrated circuits as lower k alternatives to silicon dioxide.

    摘要翻译： 制备了一种纳米颗粒，其包括附着在芯上的多核芯和表面装饰。 通过多种可能途径中的任一种提供多核心核心，示例性的优选途径是由反应性官能化阴离子引发剂引发的活性阴离子聚合和双-MPA树枝状聚合物的ε-己内酯聚合。 多臂核心优选在一些或所有臂上功能化。 然后使用偶联反应将表面装饰粘合到多臂芯的一个或多个臂上。 表面装饰是聚合度小于50的小分子或低聚物，优选的装饰是聚合度为2至24的PEG低聚物。纳米颗粒（粒径<= 10nm）用作牺牲模板致孔剂 以形成多孔电介质。 将致孔剂与基质前体（例如甲基倍半硅氧烷树脂）混合，基体玻璃化，并通过烧尽除去致孔剂。 更大的孔隙度降低了所得电介质的介电常数k。 将多孔电介质作为二氧化硅的较低k替代物并入集成电路中。