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1.发明申请公开(公告)号：US20110114380A1
公开(公告)日：2011-05-19
申请号：US12725345
申请日：2010-03-16
申请人： Jee Soo MOK , Dek Gin Yang
发明人： Jee Soo MOK , Dek Gin Yang
IPC分类号： H05K9/00
CPC分类号： H01P1/2005 , H05K1/0236 , H05K2201/09309 , H05K2201/09627 , H05K2201/09781
摘要： Disclosed herein is an electromagnetic bandgap structure, including: a dielectric layer; a plurality of conductive plates formed on one side of the dielectric layer; a stitching via serving to electrically connect two adjacent conductive plates of the plurality of conductive plates; and a first dummy via formed each of the plurality of conductive plates in a direction of thickness of the dielectric layer, and a printed circuit board comprising the electromagnetic bandgap structure. The printed circuit board comprising the electromagnetic bandgap structure can solve a mixed signal problem even when an analog circuit and a digital circuit are simultaneously mounted therein.
摘要翻译： 本文公开了一种电磁带隙结构，包括：电介质层; 形成在电介质层一侧的多个导电板; 缝合通孔，用于电连接多个导电板中的两个相邻的导电板; 以及在电介质层的厚度方向上形成多个导电板中的每一个的第一虚拟通孔，以及包括电磁带隙结构的印刷电路板。 包括电磁带隙结构的印刷电路板即使当模拟电路和数字电路同时安装在其中时也可以解决混合信号问题。
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公开(公告)号：US08759986B2
公开(公告)日：2014-06-24
申请号：US13373297
申请日：2011-11-10
申请人： Chul Min Lee , Won Hyung Park , Kyung Jin Heo , Dek Gin Yang , Jin Su Yeo , Sung Wook Chun
发明人： Chul Min Lee , Won Hyung Park , Kyung Jin Heo , Dek Gin Yang , Jin Su Yeo , Sung Wook Chun
IPC分类号： B32B15/01
CPC分类号： H05K3/244 , C23C18/1605 , C23C18/1651 , C23C18/44 , C23C18/54 , H05K3/243 , H05K2203/073 , Y10T428/12493 , Y10T428/12514 , Y10T428/12861 , Y10T428/12868 , Y10T428/12875 , Y10T428/24802
摘要： Provided is a substrate structure including: a base substrate on which a conductive pattern is formed; a first plating layer covering the conductive pattern; and a second plating layer covering the first plating layer, wherein the first plating layer includes an electroless reduction plating layer.
摘要翻译： 提供一种基板结构，其包括：形成有导电图案的基底基板; 覆盖导电图案的第一镀层; 以及覆盖所述第一镀层的第二镀层，其中所述第一镀层包括无电还原镀层。
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公开(公告)号：US20090242251A1
公开(公告)日：2009-10-01
申请号：US12213704
申请日：2008-06-23
申请人： Kwang Soo Park , Myung Gun Chong , Dek Gin Yang , Dae Jung Byun
发明人： Kwang Soo Park , Myung Gun Chong , Dek Gin Yang , Dae Jung Byun
CPC分类号： H05K1/185 , H01L23/5389 , H01L24/24 , H01L24/25 , H01L24/29 , H01L24/82 , H01L24/83 , H01L2224/04105 , H01L2224/24227 , H01L2224/2518 , H01L2224/2919 , H01L2224/8385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/0665 , H01L2924/07802 , H01L2924/14 , H05K3/4602 , H05K2201/10674 , H05K2203/1469 , Y10T29/4913 , Y10T29/49146 , Y10T29/49156 , H01L2924/00
摘要： The present invention relates to an embedded printed circuit board and a manufacturing method thereof. The present invention provides an embedded printed circuit board including a substrate in which a cavity is formed in a predetermined portion and a wiring layer is formed in a portion without the cavity; a chip inserted into the cavity and including a plurality of pads; a filler filled between the chip and the cavity to fix the chip; and a connection layer formed between the wiring layer and the pads to connect the wiring layer and the pads to each other. Further, the present invention provides a manufacturing method of the embedded printed circuit board.
摘要翻译： 本发明涉及嵌入式印刷电路板及其制造方法。 本发明提供了一种嵌入式印刷电路板，其包括基板，其中在预定部分中形成空腔，并且布线层形成在没有空腔的部分中; 插入所述腔并且包括多个垫的芯片; 填充在芯片和腔体之间的填充物以固定芯片; 以及形成在布线层和焊盘之间的连接层，以将布线层和焊盘彼此连接。 此外，本发明提供了一种嵌入式印刷电路板的制造方法。
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公开(公告)号：US08418356B2
公开(公告)日：2013-04-16
申请号：US12213704
申请日：2008-06-23
申请人： Kwang Soo Park , Myung Gun Chong , Dek Gin Yang , Dae Jung Byun
发明人： Kwang Soo Park , Myung Gun Chong , Dek Gin Yang , Dae Jung Byun
CPC分类号： H05K1/185 , H01L23/5389 , H01L24/24 , H01L24/25 , H01L24/29 , H01L24/82 , H01L24/83 , H01L2224/04105 , H01L2224/24227 , H01L2224/2518 , H01L2224/2919 , H01L2224/8385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/0665 , H01L2924/07802 , H01L2924/14 , H05K3/4602 , H05K2201/10674 , H05K2203/1469 , Y10T29/4913 , Y10T29/49146 , Y10T29/49156 , H01L2924/00
摘要： The present invention relates to an embedded printed circuit board and a manufacturing method thereof. The present invention provides an embedded printed circuit board including a substrate in which a cavity is formed in a predetermined portion and a wiring layer is formed in a portion without the cavity; a chip inserted into the cavity and including a plurality of pads; a filler filled between the chip and the cavity to fix the chip; and a connection layer formed between the wiring layer and the pads to connect the wiring layer and the pads to each other. Further, the present invention provides a manufacturing method of the embedded printed circuit board.
摘要翻译： 嵌入式印刷电路板及其制造方法技术领域本发明涉及嵌入式印刷电路板及其制造方法。 本发明提供了一种嵌入式印刷电路板，其包括基板，其中在预定部分中形成空腔，并且布线层形成在没有空腔的部分中; 插入所述腔并且包括多个垫的芯片; 填充在芯片和腔体之间的填充物以固定芯片; 以及形成在布线层和焊盘之间的连接层，以将布线层和焊盘彼此连接。 此外，本发明提供了一种嵌入式印刷电路板的制造方法。
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公开(公告)号：US20120171432A1
公开(公告)日：2012-07-05
申请号：US13373297
申请日：2011-11-10
申请人： Chul Min Lee , Won Hyung Park , Kyung Jin Heo , Dek Gin Yang , Jin Su Yeo , Sung Wook Chun
发明人： Chul Min Lee , Won Hyung Park , Kyung Jin Heo , Dek Gin Yang , Jin Su Yeo , Sung Wook Chun
CPC分类号： H05K3/244 , C23C18/1605 , C23C18/1651 , C23C18/44 , C23C18/54 , H05K3/243 , H05K2203/073 , Y10T428/12493 , Y10T428/12514 , Y10T428/12861 , Y10T428/12868 , Y10T428/12875 , Y10T428/24802
摘要： Provided is a substrate structure including: a base substrate on which a conductive pattern is formed; a first plating layer covering the conductive pattern; and a second plating layer covering the first plating layer, wherein the first plating layer includes an electroless reduction plating layer.
摘要翻译： 提供一种基板结构，其包括：形成有导电图案的基底基板; 覆盖导电图案的第一镀层; 以及覆盖所述第一镀层的第二镀层，其中所述第一镀层包括无电还原镀层。
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公开(公告)号：US20100319982A1
公开(公告)日：2010-12-23
申请号：US12650477
申请日：2009-12-30
申请人： Won Woo Cho , Dek Gin Yang , Jung Soo Kim , Hyung Ho Kim
发明人： Won Woo Cho , Dek Gin Yang , Jung Soo Kim , Hyung Ho Kim
IPC分类号： H01R4/00
CPC分类号： H05K1/0218 , H05K1/0236 , H05K3/429 , H05K2201/09618 , H05K2201/09627 , H05K2201/09636 , H05K2201/09718
摘要： Disclosed herein is an electromagnetic wave shielding substrate including an electromagnetic bandgap structure which is formed along the edge thereof in order to prevent electromagnetic waves from being emitted therefrom. The electromagnetic wave shielding substrate can effectively prevent the emission of electromagnetic waves.
摘要翻译： 这里公开了一种电磁波屏蔽基板，其包括沿其边缘形成的电磁带隙结构，以防止电磁波从其发射。 电磁波屏蔽基板可以有效地防止电磁波的发射。
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公开(公告)号：US20100319980A1
公开(公告)日：2010-12-23
申请号：US12650474
申请日：2009-12-30
申请人： Hyung Ho KIM , Dek Gin Yang , Myung Gun Chong , Jung Soo Kim , Won Woo Cho
发明人： Hyung Ho KIM , Dek Gin Yang , Myung Gun Chong , Jung Soo Kim , Won Woo Cho
CPC分类号： H05K1/0236 , H05K2201/09309 , H05K2201/09627
摘要： Disclosed herein is a printed circuit board. When power layers for supplying different voltages are sequentially stacked, a first EBG cell formed between a first power layer and a ground layer is arranged within a second EBG cell formed between a second power layer and the ground layer to allow the first EBG cell and the second EBG cell to have a double EBG structure. Accordingly, the present invention can prevent a DC open state while preventing noise and realizing band-stop characteristics.
摘要翻译： 这里公开了一种印刷电路板。 当依次堆叠用于提供不同电压的功率层时，形成在第一功率层和接地层之间的第一EBG单元被布置在形成在第二功率层和接地层之间的第二EBG单元内，以允许第一EBG单元和 第二EBG细胞具有双EBG结构。 因此，本发明可以在防止噪声并实现带阻特性的同时防止DC打开状态。
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公开(公告)号：US20100252320A1
公开(公告)日：2010-10-07
申请号：US12650489
申请日：2009-12-30
申请人： Won Woo CHO , Young Soo Kim , Yoon Jung Kim , Dek Gin Yang , Myung Gun Chong , Hyung Ho Kim
发明人： Won Woo CHO , Young Soo Kim , Yoon Jung Kim , Dek Gin Yang , Myung Gun Chong , Hyung Ho Kim
IPC分类号： H05K9/00
CPC分类号： H05K1/0236 , H05K1/165 , H05K2201/09309 , H05K2201/09627
摘要： Disclosed herein are an electromagnetic bandgap structure and a printed circuit board having the same. The bandgap structure includes a conductive layer including a plurality of conductive plates, a first metal layer disposed under the conductive layer and including a first stitching pattern electrically connected to a first conductive plate of the plurality of conductive plates, and a second metal layer disposed under the first metal layer and including a second stitching pattern electrically connected to both the first stitching pattern and a second conductive plate of the plurality of conductive plates. The bandgap to structure includes stitching patterns formed in two layers different from the conductive layer, thus offering a stop-band having a desired bandwidth in a compact structure.
摘要翻译： 本文公开了一种电磁带隙结构和具有该电阻带隙结构的印刷电路板。 所述带隙结构包括导电层，所述导电层包括多个导电板，第一金属层，设置在所述导电层下方，并且包括电连接到所述多个导电板中的第一导电板的第一拼接图案;以及第二金属层， 第一金属层并且包括电连接到多个导电板的第一缝合图案和第二导电板的第二缝合图案。 结构的带隙包括形成在与导电层不同的两层中的缝合图案，从而在紧凑的结构中提供具有期望带宽的阻挡带。
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公开(公告)号：US07347950B2
公开(公告)日：2008-03-25
申请号：US11214965
申请日：2005-08-29
申请人： Bum Young Myung , Dong Kuk Kim , Young Po Park , Young Seok Yoon , Dek Gin Yang
发明人： Bum Young Myung , Dong Kuk Kim , Young Po Park , Young Seok Yoon , Dek Gin Yang
CPC分类号： H05K3/4691 , C23C26/00 , C23C28/00 , C23C28/023 , H05K3/4652 , H05K2201/0187 , H05K2201/0355 , H05K2201/0382 , H05K2201/09109 , H05K2203/063 , Y10T29/49155
摘要： A rigid flexible printed circuit board (PCB) and a method of fabricating the same. Since a polyimide copper clad laminate is not used during the fabrication of the rigid flexible PCB, an increase in cost resulting from use of the polyimide copper clad laminate and poor reliability of adhesion at an interface between different materials are avoided.
摘要翻译： 一种刚性柔性印刷电路板（PCB）及其制造方法。 由于在刚性柔性PCB的制造期间不使用聚酰亚胺覆铜层压板，所以避免了使用聚酰亚胺覆铜层压板所产生的成本的增加以及在不同材料之间的界面处的粘附可靠性差。
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公开(公告)号：US20100328178A1
公开(公告)日：2010-12-30
申请号：US12650482
申请日：2009-12-30
申请人： Won Woo Cho , Dek Gin Yang , Myung Gun Chong , Jung Soo Kim , Hyung Ho Kim
发明人： Won Woo Cho , Dek Gin Yang , Myung Gun Chong , Jung Soo Kim , Hyung Ho Kim
IPC分类号： H01Q1/52
CPC分类号： H01Q1/38 , H01L2223/6677 , H01L2224/16227 , H01L2924/15313 , H01Q1/2283 , H01Q15/008
摘要： Disclosed is a printed circuit board, which includes an electromagnetic bandgap structure disposed around an antenna so as to prevent noise from being transmitted to the antenna. The printed circuit board includes an antenna, a circuit chip, a plurality of metal layers and a plurality of dielectric layers, a pair of transmission lines for transmitting a signal to the antenna, and an electromagnetic bandgap structure disposed between the antenna and the circuit chip and for preventing an electromagnetic wave from being transmitted from the circuit chip to the antenna.
摘要翻译： 公开了一种印刷电路板，其包括设置在天线周围的电磁带隙结构，以防止噪声被传输到天线。 印刷电路板包括天线，电路芯片，多个金属层和多个电介质层，用于将信号传输到天线的一对传输线以及设置在天线和电路芯片之间的电磁带隙结构 并且用于防止电磁波从电路芯片传输到天线。
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