High-K dielectric and metal gate stack with minimal overlap with isolation region
    3.
    发明授权
    High-K dielectric and metal gate stack with minimal overlap with isolation region 有权
    高K电介质和金属栅极堆叠与隔离区域重叠

    公开(公告)号:US08232606B2

    公开(公告)日:2012-07-31

    申请号:US13150378

    申请日:2011-06-01

    IPC分类号: H01L29/76

    摘要: A high-k dielectric and metal gate stack with minimal overlap with an adjacent oxide isolation region and related methods are disclosed. One embodiment of the gate stack includes a high dielectric constant (high-k) dielectric layer, a tuning layer and a metal layer positioned over an active region defined by an oxide isolation region in a substrate, wherein an outer edge of the high-k dielectric layer, the tuning layer and the metal layer overlaps the oxide isolation region by less than approximately 200 nanometers. The gate stack and related methods eliminate the regrowth effect in short channel devices by restricting the amount of overlap area between the gate stack and adjacent oxide isolation regions.

    摘要翻译: 公开了一种与相邻氧化物隔离区域具有最小重叠的高k电介质和金属栅极叠层及相关方法。 栅堆叠的一个实施例包括高介电常数(高k)电介质层,调谐层和位于由衬底中的氧化物隔离区限定的有源区上的金属层,其中高k的外边缘 电介质层,调谐层和金属层与氧化物隔离区重叠小于约200纳米。 栅极堆叠和相关方法通过限制栅极堆叠和相邻氧化物隔离区域之间的重叠区域的量来消除短沟道器件中的再生长效应。

    Techniques for enabling multiple Vt devices using high-K metal gate stacks
    4.
    发明授权
    Techniques for enabling multiple Vt devices using high-K metal gate stacks 有权
    使用高K金属栅极堆叠实现多个Vt器件的技术

    公开(公告)号:US08212322B2

    公开(公告)日:2012-07-03

    申请号:US12720354

    申请日:2010-03-09

    IPC分类号: H01L21/8234 H01L21/8244

    摘要: Techniques for combining transistors having different threshold voltage requirements from one another are provided. In one aspect, a semiconductor device comprises a substrate having a first and a second nFET region, and a first and a second pFET region; a logic nFET on the substrate over the first nFET region; a logic pFET on the substrate over the first pFET region; a SRAM nFET on the substrate over the second nFET region; and a SRAM pFET on the substrate over the second pFET region, each comprising a gate stack having a metal layer over a high-K layer. The logic nFET gate stack further comprises a capping layer separating the metal layer from the high-K layer, wherein the capping layer is further configured to shift a threshold voltage of the logic nFET relative to a threshold voltage of one or more of the logic pFET, SRAM nFET and SRAM pFET.

    摘要翻译: 提供了用于组合彼此具有不同阈值电压要求的晶体管的技术。 在一个方面,一种半导体器件包括具有第一和第二nFET区的衬底以及第一和第二pFET区; 在第一nFET区域上的衬底上的逻辑nFET; 在第一pFET区上的衬底上的逻辑pFET; 位于第二nFET区上的衬底上的SRAM nFET; 以及在第二pFET区上的衬底上的SRAM pFET,每个包括在高K层上具有金属层的栅极堆叠。 逻辑nFET栅极堆叠还包括将金属层与高K层分隔开的覆盖层,其中封盖层还被配置为相对于逻辑pFET中的一个或多个的阈值电压移动逻辑nFET的阈值电压 ,SRAM nFET和SRAM pFET。

    Nanowire Mesh FET with Multiple Threshold Voltages
    5.
    发明申请
    Nanowire Mesh FET with Multiple Threshold Voltages 有权
    具有多个阈值电压的纳米线网状FET

    公开(公告)号:US20100295022A1

    公开(公告)日:2010-11-25

    申请号:US12470159

    申请日:2009-05-21

    摘要: Nanowire-based field-effect transistors (FETs) and techniques for the fabrication thereof are provided. In one aspect, a FET is provided having a plurality of device layers oriented vertically in a stack, each device layer having a source region, a drain region and a plurality of nanowire channels connecting the source region and the drain region, wherein one or more of the device layers are configured to have a different threshold voltage from one or more other of the device layers; and a gate common to each of the device layers surrounding the nanowire channels.

    摘要翻译: 提供了基于纳米线的场效应晶体管(FET)及其制造技术。 在一个方面,提供了一种FET,其具有在堆叠中垂直取向的多个器件层,每个器件层具有源极区,漏极区和连接源极区和漏极区的多个纳米线通道,其中一个或多个 的器件层被配置为具有来自一个或多个其它器件层的不同阈值电压; 以及围绕纳米线通道的每个器件层共用的栅极。

    Techniques for Enabling Multiple Vt Devices Using High-K Metal Gate Stacks
    6.
    发明申请
    Techniques for Enabling Multiple Vt Devices Using High-K Metal Gate Stacks 有权
    使用高K金属栅极堆栈启用多个Vt器件的技术

    公开(公告)号:US20100164011A1

    公开(公告)日:2010-07-01

    申请号:US12720354

    申请日:2010-03-09

    IPC分类号: H01L29/78

    摘要: Techniques for combining transistors having different threshold voltage requirements from one another are provided. In one aspect, a semiconductor device comprises a substrate having a first and a second nFET region, and a first and a second pFET region; a logic nFET on the substrate over the first nFET region; a logic pFET on the substrate over the first pFET region; a SRAM nFET on the substrate over the second nFET region; and a SRAM pFET on the substrate over the second pFET region, each comprising a gate stack having a metal layer over a high-K layer. The logic nFET gate stack further comprises a capping layer separating the metal layer from the high-K layer, wherein the capping layer is further configured to shift a threshold voltage of the logic nFET relative to a threshold voltage of one or more of the logic pFET, SRAM nFET and SRAM pFET.

    摘要翻译: 提供了用于组合彼此具有不同阈值电压要求的晶体管的技术。 在一个方面,一种半导体器件包括具有第一和第二nFET区的衬底以及第一和第二pFET区; 在第一nFET区域上的衬底上的逻辑nFET; 在第一pFET区上的衬底上的逻辑pFET; 位于第二nFET区上的衬底上的SRAM nFET; 以及在第二pFET区上的衬底上的SRAM pFET,每个包括在高K层上具有金属层的栅极堆叠。 逻辑nFET栅极堆叠还包括将金属层与高K层分隔开的覆盖层,其中封盖层还被配置为相对于逻辑pFET中的一个或多个的阈值电压移动逻辑nFET的阈值电压 ,SRAM nFET和SRAM pFET。

    Single gate inverter nanowire mesh
    7.
    发明授权
    Single gate inverter nanowire mesh 失效
    单门逆变器纳米线网

    公开(公告)号:US08466451B2

    公开(公告)日:2013-06-18

    申请号:US13316515

    申请日:2011-12-11

    摘要: A FET inverter is provided that includes a plurality of device layers oriented vertically in a stack, each device layer having a source region, a drain region and a plurality of nanowire channels, wherein the source and drain regions of one or more of the device layers are doped with an n-type dopant and the source and drain regions of one or more other of the device layers are doped with a p-type dopant; a gate common to each of the device layers surrounding the nanowire channels; a first contact to the source regions of the one or more device layers doped with an n-type dopant; a second contact to the source regions of the one or more device layers doped with a p-type dopant; and a third contact common to the drain regions of each of the device layers. Techniques for fabricating a FET inverter are also provided.

    摘要翻译: 提供一种FET逆变器,其包括在堆叠中垂直取向的多个器件层,每个器件层具有源极区,漏极区和多个纳米线通道,其中一个或多个器件层的源极和漏极区 掺杂有n型掺杂剂,并且一个或多个其它器件层的源极和漏极区掺杂有p型掺杂剂; 围绕纳米线通道的每个器件层共用的栅极; 与掺杂有n型掺杂剂的一个或多个器件层的源极区的第一接触; 与掺杂有p型掺杂剂的一个或多个器件层的源极区的第二接触; 以及每个器件层的漏极区域共同的第三接触。 还提供了用于制造FET逆变器的技术。

    Nanowire mesh FET with multiple threshold voltages
    8.
    发明授权
    Nanowire mesh FET with multiple threshold voltages 有权
    具有多个阈值电压的纳米线网状FET

    公开(公告)号:US08422273B2

    公开(公告)日:2013-04-16

    申请号:US12470159

    申请日:2009-05-21

    IPC分类号: G11C11/00

    摘要: Nanowire-based field-effect transistors (FETs) and techniques for the fabrication thereof are provided. In one aspect, a FET is provided having a plurality of device layers oriented vertically in a stack, each device layer having a source region, a drain region and a plurality of nanowire channels connecting the source region and the drain region, wherein one or more of the device layers are configured to have a different threshold voltage from one or more other of the device layers; and a gate common to each of the device layers surrounding the nanowire channels.

    摘要翻译: 提供了基于纳米线的场效应晶体管(FET)及其制造技术。 在一个方面,提供了一种FET,其具有在堆叠中垂直取向的多个器件层,每个器件层具有源极区,漏极区和连接源区和漏区的多个纳米线通道,其中一个或多个 的器件层被配置为具有来自一个或多个其它器件层的不同阈值电压; 以及围绕纳米线通道的每个器件层共用的栅极。

    Structure with reduced fringe capacitance
    10.
    发明授权
    Structure with reduced fringe capacitance 有权
    具有降低的边缘电容的结构

    公开(公告)号:US08247877B2

    公开(公告)日:2012-08-21

    申请号:US12550543

    申请日:2009-08-31

    IPC分类号: H01L29/78

    摘要: A structure includes a substrate and a gate stack disposed on the substrate. The structure also includes a nitride encapsulation layer disposed on a side wall of the gate stack and which has been exposed to a plasma source. The structure also includes at least one other element contacting the nitride encapsulation layer in a region where the nitride encapsulation layer contacts the side wall of the gate stack.

    摘要翻译: 一种结构包括衬底和设置在衬底上的栅叠层。 该结构还包括设置在栅极堆叠的侧壁上并已经暴露于等离子体源的氮化物封装层。 该结构还包括在氮化物封装层接触栅叠层的侧壁的区域中与氮化物封装层接触的至少一个其它元件。