公开(公告)号：US20140117475A1

公开(公告)日：2014-05-01

申请号：US14059202

申请日：2013-10-21

申请人： Johannes CLASSEN ,  Axel FRANKE ,  Jens FREY ,  Heribert WEBER ,  Frank FISCHER ,  Patrick WELLNER ,  Mirko HATTASS ,  Daniel Christoph MEISEL

发明人： Johannes CLASSEN ,  Axel FRANKE ,  Jens FREY ,  Heribert WEBER ,  Frank FISCHER ,  Patrick WELLNER ,  Mirko HATTASS ,  Daniel Christoph MEISEL

IPC分类号： B81B7/00

CPC分类号： B81C1/00246 ,  B81C1/0023 ,  B81C2203/075 ,  B81C2203/0771 ,  H01L2224/48463

摘要： A component has at least one MEMS element and at least one cap made of a semiconductor material. The cap, in addition to its mechanical function as a terminus of a cavity and protection of the micromechanical structure, is provided with an electrical functionality. The micromechanical structure of the MEMS element of the component is situated in a cavity between a carrier and the cap, and includes at least one structural element which is deflectable out of the component plane within the cavity. The cap includes at least one section extending over the entire thickness of the cap, which is electrically insulated from the adjoining semiconductor material in such a way that it may be electrically contacted independently from the remaining sections of the cap.

摘要翻译： 元件具有至少一个MEMS元件和至少一个由半导体材料制成的盖。 盖子除了作为空腔的终端的机械功能以及微机械结构的保护之外，还具有电功能。 元件的MEMS元件的微机械结构位于载体和盖之间的空腔中，并且包括至少一个结构元件，其可在空腔内偏离组件平面。 该帽包括至少一个在盖的整个厚度上延伸的部分，其与相邻的半导体材料电绝缘，使得其可以独立于帽的其余部分电接触。

公开(公告)号：US20130277774A1

公开(公告)日：2013-10-24

申请号：US13869428

申请日：2013-04-24

申请人： Jens FREY ,  Frank Fischer

发明人： Jens FREY ,  Frank Fischer

IPC分类号： B81C1/00 ,  B81B7/00

CPC分类号： B81C1/00269 ,  B81B7/007 ,  B81C1/00238 ,  B81C2203/0785

摘要： A simple and cost-effective manufacturing method for hybrid integrated components including at least one MEMS element, a cap for the micromechanical structure of the MEMS element, and at least one ASIC substrate, using which a high degree of miniaturization may be achieved. The micromechanical structure of the MEMS element and the cap are manufactured in a layered structure, proceeding from a shared semiconductor substrate, by applying at least one cap layer to a first surface of the semiconductor substrate, and by processing and structuring the semiconductor substrate proceeding from its other second surface, to produce and expose the micromechanical MEMS structure. The semiconductor substrate is then mounted with the MEMS-structured second surface on the ASIC substrate.

摘要翻译： 一种用于混合集成部件的简单和成本有效的制造方法，包括至少一个MEMS元件，用于MEMS元件的微机械结构的盖，以及至少一个ASIC基板，其可以实现高度的小型化。 MEMS元件和盖的微机械结构通过将至少一个盖层施加到半导体衬底的第一表面，并且通过加工和构造半导体衬底从共享半导体衬底开始，以分层结构制造，并且从 其另一个第二表面，以产生和暴露微机械MEMS结构。 然后将半导体衬底与MEMS结构的第二表面安装在ASIC衬底上。

公开(公告)号：US20140027927A1

公开(公告)日：2014-01-30

申请号：US13923035

申请日：2013-06-20

申请人： Jochen REINMUTH ,  Jens FREY ,  Yvonne BERGMANN

发明人： Jochen REINMUTH ,  Jens FREY ,  Yvonne BERGMANN

IPC分类号： H01L23/48 ,  H01L21/762

CPC分类号： H01L21/76224 ,  B81B7/007 ,  B81B2207/096 ,  B81C1/00095 ,  H01L21/76898 ,  H01L23/481 ,  H01L24/02 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L2224/02311 ,  H01L2224/05009 ,  H01L2224/29111 ,  H01L2224/29117 ,  H01L2224/29124 ,  H01L2224/29147 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/83193 ,  H01L2224/83805 ,  H01L2224/92 ,  H01L2224/9202 ,  H01L2224/94 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/351 ,  H01L2224/0231 ,  H01L2224/83 ,  H01L21/78 ,  H01L2924/00014 ,  H01L2924/01032 ,  H01L2924/00

摘要： A method for manufacturing a component having an electrical through-connection is described. The method includes the following steps: providing a semiconductor substrate having a front side and a back side opposite from the front side, producing an insulating trench, which annularly surrounds a contact area, on the front side of the semiconductor substrate, filling the insulating trench with an insulating material, producing an electrical contact structure on the front side of the semiconductor substrate by depositing an electrically conductive material in the contact area, removing the semiconductor material remaining in the contact area on the back side of the semiconductor substrate in order to produce a contact hole which opens up the bottom side of the contact structure, and depositing a metallic material in the contact hole in order to electrically connect the electrical contact structure to the back side of the semiconductor substrate.

摘要翻译： 描述了一种用于制造具有电穿通连接的部件的方法。 该方法包括以下步骤：提供具有与前侧相反的前侧和后侧的半导体衬底，在半导体衬底的正面上产生环形地包围接触区域的绝缘沟槽，填充绝缘沟槽 具有绝缘材料，通过在接触区域中沉积导电材料，在半导体衬底的正面上产生电接触结构，去除残留在半导体衬底背面接触区域中的半导体材料，以便产生 接触孔，其向开放接触结构的底侧开口，并且在接触孔中沉积金属材料，以将电接触结构电连接到半导体衬底的背面。

公开(公告)号：US20120032283A1

公开(公告)日：2012-02-09

申请号：US13206024

申请日：2011-08-09

申请人： Jens FREY ,  Heribert WEBER ,  Eckhard GRAF

发明人： Jens FREY ,  Heribert WEBER ,  Eckhard GRAF

IPC分类号： H01L29/84 ,  H01L21/02 ,  H01L31/09 ,  H01L29/82 ,  H01L29/66

CPC分类号： G01P15/125 ,  B81B7/02 ,  B81B2207/07 ,  B81B2207/095 ,  B81B2207/096 ,  B81B2207/097 ,  B81C2203/0118 ,  B81C2203/035 ,  G01L9/0048 ,  G01L9/0052 ,  G01L9/0073 ,  G01L19/0076 ,  G01L19/0092 ,  G01P15/0802 ,  G01R33/0286

摘要： A sensor module includes a substrate system which has multiple substrates situated one on top of the other and connected in each case via a wafer bond connection. The substrate system includes at least one first sensor substrate and at least one second sensor substrate, the first sensor substrate having a first sensor structure and the second sensor substrate having a second sensor structure. The first and second sensor structures are designed for detecting different characteristics. At least the first sensor structure includes a micromechanical functional structure. Moreover, a method for manufacturing such a sensor module is disclosed.

摘要翻译： 传感器模块包括具有多个基板的基板系统，该基板一个在另一个之上并且通过晶片接合连接在每种情况下连接。 衬底系统包括至少一个第一传感器衬底和至少一个第二传感器衬底，第一传感器衬底具有第一传感器结构，第二传感器衬底具有第二传感器结构。 第一和第二传感器结构被设计用于检测不同的特性。 至少第一传感器结构包括微机械功能结构。 此外，公开了一种用于制造这种传感器模块的方法。

公开(公告)号：US20140374853A1

公开(公告)日：2014-12-25

申请号：US14307662

申请日：2014-06-18

申请人： Heribert WEBER ,  Hartmut KUEPPERS ,  Jens FREY ,  Jochen REINMUTH ,  Neil DAVIES

发明人： Heribert WEBER ,  Hartmut KUEPPERS ,  Jens FREY ,  Jochen REINMUTH ,  Neil DAVIES

IPC分类号： B81C1/00 ,  B81B3/00

CPC分类号： B81B7/0048 ,  H01L2224/16225

摘要： Measures are provided for stress decoupling between a semiconductor component and its mounting support, these measures being implementable very easily, inexpensively and in a space-saving manner, regardless of the substrate thickness of the component, and not being limited to soldered connections but instead also being usable in conjunction with other mounting and joining techniques. These measures relate to components, which include at least one electrical and/or micromechanical functionality and at least one wiring level, which is formed in a layer structure on a main surface of the component substrate, at least one mounting surface being implemented in the wiring level to establish a mechanical and/or electrical connection of the component to a support. The at least one mounting surface is spring mounted and is separated from the layer structure in at least some areas for this purpose.

摘要翻译： 提供了用于半导体部件与其安装支撑件之间的应力解耦的措施，这些措施可以非常容易地，低成本地且以节省空间的方式实现，而不管部件的基板厚度如何，而不仅限于焊接连接，而且还包括 可与其他安装和连接技术结合使用。 这些措施涉及组件，其包括至少一个电和/或微机械功能和至少一个布线层，其形成在部件基板的主表面上的层结构中，至少一个安装表面被实施在布线 以建立部件与支撑件的机械和/或电连接。 为此，至少一个安装表面是弹簧安装的，并且在至少一些区域中与层结构分离。

公开(公告)号：US20150053001A1

公开(公告)日：2015-02-26

申请号：US14468214

申请日：2014-08-25

申请人： Jens FREY ,  Jochen REINMUTH

发明人： Jens FREY ,  Jochen REINMUTH

IPC分类号： B81B3/00 ,  G01P3/14 ,  G01P3/44

CPC分类号： B81B3/0027 ,  B81B3/0086 ,  B81B2203/04 ,  G01C19/574 ,  G01C19/5755 ,  G01P3/14 ,  G01P3/44

摘要： A micromechanical component is provided having a substrate having a main plane of extension, a first electrode extending mainly along a first plane in planar fashion, a second electrode extending mainly along a second plane in planar fashion, and a third electrode extending mainly along a third plane in planar fashion, the first, second, and third plane being oriented essentially parallel to the main plane of extension and being situated one over the other at a distance from one another along a normal direction that is essentially perpendicular to the main plane of extension, the micromechanical component having a deflectable mass element, the mass element being capable of being deflected both essentially parallel and also essentially perpendicular to the main plane of extension, the second electrode being connected immovably to the mass element, the second electrode having, in a rest position, a first region of overlap with the first electrode along a projection direction essentially parallel to the normal direction, and having a second region of overlap with the third electrode along a projection direction parallel to the projection direction, the mass element extending in planar fashion mainly along the third plane, the mass element having a recess that extends completely through the mass element, extending in planar fashion along the third plane and parallel to the normal direction, the third electrode being situated at least partly in the recess.

摘要翻译： 提供一种微机械部件，其具有主平面延伸的基板，主要以平面方式沿着第一平面延伸的第一电极，主要沿平面方向延伸的第二平面延伸的第二电极和主要沿第三平面延伸的第三电极 平面，平面的第一，第二和第三平面被定向成基本上平行于延伸的主平面，并且沿着基本垂直于延伸的主平面的法线方向彼此间隔一定距离 所述微机械部件具有可偏转的质量元件，所述质量元件能够基本上平行且基本上垂直于所述主平面延伸，所述第二电极不可移动地连接到所述质量元件，所述第二电极具有 静止位置，基本上沿着投影方向与第一电极重叠的第一区域 平行于法线方向，并且沿平行于投射方向的投影方向具有与第三电极重叠的第二区域，质量元件主要沿第三平面延伸，质量元件具有完全延伸穿过的凹部 所述质量元件沿着所述第三平面以平面方式延伸并且平行于所述法线方向，所述第三电极至少部分地位于所述凹部中。

公开(公告)号：US20130341738A1

公开(公告)日：2013-12-26

申请号：US13921419

申请日：2013-06-19

申请人： Jochen REINMUTH ,  Jens FREY ,  Yvonne BERGMANN

发明人： Jochen REINMUTH ,  Jens FREY ,  Yvonne BERGMANN

IPC分类号： B81C1/00 ,  B81B3/00

CPC分类号： B81C1/00134 ,  B81B3/0018 ,  B81B7/007 ,  B81B2207/095

摘要： A method for manufacturing a component having an electrical through-connection includes: providing a semiconductor substrate having a front side and a back side opposite from the front side; producing, on the front side of the semiconductor substrate, an insulating trench which annularly surrounds a contact area; introducing an insulating material into the insulating trench; producing a contact hole on the front side of the semiconductor substrate by removing the semiconductor material surrounded by the insulating trench in the contact area; and depositing a metallic material in the contact hole.

摘要翻译： 一种用于制造具有电穿通连接的部件的方法包括：提供具有前侧和与前侧相对的后侧的半导体衬底; 在所述半导体衬底的前侧产生环形地围绕接触区域的绝缘沟槽; 将绝缘材料引入绝缘沟槽中; 通过去除由接触区域中的绝缘沟槽围绕的半导体材料，在半导体衬底的正面上产生接触孔; 以及在所述接触孔中沉积金属材料。

公开(公告)号：US20130307096A1

公开(公告)日：2013-11-21

申请号：US13891796

申请日：2013-05-10

申请人： Johannes CLASSEN ,  Jens FREY

发明人： Johannes CLASSEN ,  Jens FREY

IPC分类号： B81B7/00

CPC分类号： B81B7/008 ,  B81C1/0023 ,  B81C1/00238 ,  B81C2203/0792

摘要： A hybrid integrated component including an MEMS element and an ASIC element is refined to improve the capacitive signal detection or activation. The MEMS element is implemented in a layered structure on a semiconductor substrate. The layered structure of the MEMS element includes at least one printed conductor level and at least one functional layer, in which the micromechanical structure of the MEMS element having at least one deflectable structural element is implemented. The ASIC element is mounted face down on the layered structure and functions as a cap for the micromechanical structure. The deflectable structural element of the MEMS element is equipped with at least one electrode of a capacitor system. At least one stationary counter electrode of the capacitor system is implemented in the printed conductor level of the MEMS element, and the ASIC element includes at least one further counter electrode of the capacitor system.

摘要翻译： 改进了包括MEMS元件和ASIC元件的混合集成元件以改善电容信号检测或激活。 MEMS元件以半导体衬底上的分层结构实现。 MEMS元件的分层结构包括至少一个印刷导体水平和至少一个功能层，其中具有至少一个可偏转结构元件的MEMS元件的微机械结构被实现。 ASIC元件面朝下地安装在分层结构上，并且用作微机械结构的盖。 MEMS元件的可偏转结构元件配备有电容器系统的至少一个电极。 电容器系统的至少一个固定对电极在MEMS元件的印刷导体电平中实现，并且ASIC元件包括电容器系统的至少一个另外的对置电极。