公开(公告)号：US20050183800A1

公开(公告)日：2005-08-25

申请号：US11001586

申请日：2004-12-01

申请人： Ji Yoo ,  Doo Lee

发明人： Ji Yoo ,  Doo Lee

IPC分类号： F16D13/60 ,  C21D1/42 ,  C21D1/60 ,  C21D6/00 ,  C21D9/00 ,  C21D9/08 ,  C21D9/32 ,  C22C38/00 ,  C22C38/18

CPC分类号： C22C38/02 ,  C21D1/42 ,  C21D9/085 ,  C21D9/32 ,  C21D2211/003 ,  C21D2211/005 ,  C22C38/04 ,  Y02P10/253 ,  Y10T477/60

摘要： Disclosed is a material of a kick-down drum comprising fine ferrite and microdispersion spheroidized cementite for an automobile. also disclosed is a method for manufacturing the kick-down drum material. The kick-down drum of this invention can greatly improve hardenability and durability of the spline member and also has advantages of reducing production costs due to a simplified process of adding only a heating process.

摘要翻译： 公开了一种包括用于汽车的细铁氧体和微分散球状渗碳体的降压鼓的材料。 还公开了一种用于制造降压鼓材料的方法。 本发明的冲压滚筒可以大大提高花键部件的淬透性和耐久性，并且还具有由于仅加入加热工艺的简化过程而降低生产成本的优点。

公开(公告)号：US20060145331A1

公开(公告)日：2006-07-06

申请号：US11179864

申请日：2005-07-11

申请人： Suk Cho ,  Chang Ryu ,  Doo Lee

发明人： Suk Cho ,  Chang Ryu ,  Doo Lee

IPC分类号： H01L21/4763 ,  H01L23/12

CPC分类号： H05K1/185 ,  H01L21/4857 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3025 ,  H05K3/4623 ,  H05K3/4652 ,  H05K2201/09509 ,  H05K2201/10636 ,  H05K2201/10674 ,  Y02P70/611

摘要： A method of fabricating a printed circuit board (PCB) including embedded chips, composed of forming a hollow portion for chip insertion through a substrate, inserting the chip into the hollow portion, fixing the chip to the substrate by use of a plating process to form a central layer having an embedded chip, and then laminating a non-cured resin layer and a circuit layer having a circuit pattern on the central layer. Also, a PCB including embedded chips fabricated using the above method is provided.

摘要翻译： 一种制造包括嵌入式芯片的印刷电路板（PCB）的方法，所述印刷电路板（PCB）由形成用于通过基板进行芯片插入的中空部分，将所述芯片插入所述中空部分中，通过电镀工艺将所述芯片固定到所述基板 具有嵌入式芯片的中心层，然后在中心层上层叠未固化树脂层和具有电路图案的电路层。 此外，提供了包括使用上述方法制造的嵌入式芯片的PCB。

公开(公告)号：US20060157832A1

公开(公告)日：2006-07-20

申请号：US11137345

申请日：2005-05-24

申请人： Chang Ryu ,  Doo Lee ,  Jin Ahn ,  Myung Kang ,  Suk Cho

发明人： Chang Ryu ,  Doo Lee ,  Jin Ahn ,  Myung Kang ,  Suk Cho

IPC分类号： H01L23/02

CPC分类号： H01L23/5389 ,  H01L25/0655 ,  H01L25/16 ,  H01L2224/82039 ,  H01L2924/01078 ,  H01L2924/01087 ,  H05K1/186 ,  H05K3/4069 ,  H05K3/4602 ,  H05K3/4614 ,  H05K3/4652 ,  H05K2201/09563 ,  H05K2201/10674 ,  H05K2203/0191

摘要： A printed circuit board having embedded chips, composed of a central layer having an embedded chip, an insulating layer formed on one surface or both surfaces of the central layer and having a via hole filled with conductive ink, and a circuit layer formed on the insulating layer and having a via hole and a circuit pattern electrically connected to the chip of the central layer through the via hole of the insulating layer. In addition, a method of fabricating a printed circuit board including embedded chips is provided.

公开(公告)号：US20070244259A1

公开(公告)日：2007-10-18

申请号：US10590959

申请日：2005-01-26

申请人： Doo Lee ,  Woo Shim ,  You Bae ,  Je You ,  Min Kim ,  Huynh Phu

发明人： Doo Lee ,  Woo Shim ,  You Bae ,  Je You ,  Min Kim ,  Huynh Phu

IPC分类号： C08G81/00 ,  A61K9/00 ,  C08F265/10 ,  C08G63/66

CPC分类号： A61L27/50 ,  A61L27/26 ,  A61L27/52 ,  C08F265/10 ,  C08F290/06 ,  C08F293/005 ,  C08G63/664 ,  C08G63/6852 ,  C08G63/6882 ,  C08G63/912 ,  C08G75/30 ,  C08G81/00 ,  C08G2261/126 ,  C08J3/075 ,  C08J2300/16 ,  C08J2367/04 ,  C08L53/00 ,  C08L67/00 ,  Y10S524/916 ,  C08L71/02 ,  C08L81/10 ,  C08L2666/02

摘要： The present invention relates to a block copolymer formed by coupling the following components with each other, as well as a hydrogel composition comprising the block copolymer and a hydrogel formed from the composition: (a) a copolymer of a polyethylene glycol (PEG)-based compound with a biodegradable polymer; and (b) a sulfonamide-based oligomer. The inventive block copolymer shows the sol-gel transition behavior sensitive to changes in not only temperature but also pH. Thus, the inventive block copolymer overcomes the shortcomings of temperature-sensitive copolymers, form a more strong and stable hydrogel, and is stable in vivo. Accordingly, the inventive block copolymer can be used in various applications in the medical and drug delivery fields.

摘要翻译： 本发明涉及通过将以下组分彼此偶联而形成的嵌段共聚物，以及包含嵌段共聚物和由以下组合物形成的水凝胶的水凝胶组合物：（a）基于聚乙二醇（PEG） 与生物降解聚合物的化合物; 和（b）磺酰胺类低聚物。 本发明的嵌段共聚物显示溶胶 - 凝胶转变行为不仅对温度而且pH的变化敏感。 因此，本发明的嵌段共聚物克服了温度敏感性共聚物的缺点，形成了更强和稳定的水凝胶，并且在体内是稳定的。 因此，本发明的嵌段共聚物可用于医药和药物输送领域的各种应用。

公开(公告)号：US20060258053A1

公开(公告)日：2006-11-16

申请号：US11431742

申请日：2006-05-09

申请人： Doo Lee ,  Chang Ryu ,  Han Cho ,  Byoung Min

发明人： Doo Lee ,  Chang Ryu ,  Han Cho ,  Byoung Min

IPC分类号： H01L21/00

CPC分类号： H01L24/18 ,  H01L24/82 ,  H01L2224/16225 ,  H01L2224/18 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3025 ,  H05K1/188 ,  H05K3/429 ,  H05K3/4602 ,  H05K2201/0355 ,  H05K2201/09536 ,  H05K2201/0959 ,  H01L2924/00 ,  H01L2224/0401

摘要： Disclosed herein is a method for manufacturing a component-embedded printed circuit board that is economically advantageous and simple. The method is characterized by stacking boards in which a high density of electronic components are mounted to form a core layer in which the electronic components are embedded, and by subsequently building up additional circuit layers.

摘要翻译： 本文公开了一种经济有利且简单的组件嵌入式印刷电路板的制造方法。 该方法的特征在于堆叠板，其中安装高密度的电子部件以形成其中嵌入电子部件的芯层，以及随后构建附加的电路层。

公开(公告)号：US20080106879A1

公开(公告)日：2008-05-08

申请号：US11931771

申请日：2007-10-31

申请人： Chang Ryu ,  Doo Lee ,  Jin Ahn ,  Myung Kang ,  Suk Cho

发明人： Chang Ryu ,  Doo Lee ,  Jin Ahn ,  Myung Kang ,  Suk Cho

IPC分类号： H05K7/00

CPC分类号： H01L23/5389 ,  H01L25/0655 ,  H01L25/16 ,  H01L2224/82039 ,  H01L2924/01078 ,  H01L2924/01087 ,  H05K1/186 ,  H05K3/4069 ,  H05K3/4602 ,  H05K3/4614 ,  H05K3/4652 ,  H05K2201/09563 ,  H05K2201/10674 ,  H05K2203/0191

摘要： A printed circuit board having embedded chips, composed of a central layer having an embedded chip, an insulating layer formed on one surface or both surfaces of the central layer and having a via hole filled with conductive ink, and a circuit layer formed on the insulating layer and having a via hole and a circuit pattern electrically connected to the chip of the central layer through the via hole of the insulating layer. In addition, a method of fabricating a printed circuit board including embedded chips is provided.

摘要翻译： 一种具有嵌入式芯片的印刷电路板，由具有嵌入式芯片的中心层，形成在中心层的一个表面或两个表面上的绝缘层，并且具有填充有导电油墨的通孔，以及形成在绝缘体上的电路层 并且具有通孔和通过绝缘层的通孔与中心层的芯片电连接的电路图案。 此外，提供了一种制造包括嵌入式芯片的印刷电路板的方法。

公开(公告)号：US20070006456A1

公开(公告)日：2007-01-11

申请号：US11453790

申请日：2006-06-15

申请人： Seung Kim ,  Chang Ryu ,  Han Cho ,  Doo Lee ,  Hwa Park

发明人： Seung Kim ,  Chang Ryu ,  Han Cho ,  Doo Lee ,  Hwa Park

IPC分类号： H01K3/10 ,  H05K1/00

CPC分类号： H05K1/188 ,  H05K1/185 ,  H05K2201/0355 ,  H05K2201/10674 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49165

摘要： Disclosed is a method for manufacturing a circuit board, comprising step for preparing an insulating member and an electronic component having position-setting means on the lower surface thereof (S110), step for forming mounting holes in the insulating member (S120), step for mounting the electronic component on the insulating member to meet the position-setting means and the mounting holes (S130), step for forming copper cladding coated with an adhesive on the insulating member (S140), step for applying heat and/or pressure to the copper cladding (S150), and step for forming a via-hole in the copper cladding to be electrically connected to the electronic component, and step for forming a circuit pattern in the copper cladding (S160). The step (S150) can comprise a step (S240) for applying inter-adhesive on respective surfaces of the insulating member, and a step (S250) for applying copper cladding on respective surfaces of the inter-adhesive.

摘要翻译： 公开了一种制造电路板的方法，包括在其下表面上制备绝缘构件和具有位置设定装置的电子部件的步骤（S110），用于在绝缘构件中形成安装孔的步骤（S120）， 步骤，用于将所述电子部件安装在所述绝缘部件上以满足所述位置设定装置和所述安装孔（S130），用于在所述绝缘部件上形成涂覆有粘合剂的铜包层的步骤（S140），用于施加热和/ 或对铜包层的压力（S150），以及用于在铜包层中形成电气连接到电子部件的通孔的步骤，以及用于在铜包层中形成电路图案的步骤（S160）。 步骤（S150）可以包括用于在绝缘构件的相应表面上施加粘合剂的步骤（S 240），以及用于在粘合剂的各个表面上施加铜包层的台阶（S 250）。