公开(公告)号：US09064862B2

公开(公告)日：2015-06-23

申请号：US13564431

申请日：2012-08-01

Applicant: In Chul Hwang ,  Jae Myun Kim ,  Seung Jee Kim ,  Jin Su Lee

Inventor： In Chul Hwang ,  Jae Myun Kim ,  Seung Jee Kim ,  Jin Su Lee

IPC: H01L21/50 ,  H01L25/00 ,  H01L21/768 ,  H01L25/065 ,  H01L23/00

CPC classification number: H01L25/50 ,  H01L21/76898 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/80 ,  H01L24/81 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/08145 ,  H01L2224/13025 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/17181 ,  H01L2224/48227 ,  H01L2224/80006 ,  H01L2224/80896 ,  H01L2224/81191 ,  H01L2224/9202 ,  H01L2224/9222 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06558 ,  H01L2225/06565 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/00 ,  H01L2224/80 ,  H01L2224/11 ,  H01L2224/81

Abstract: Dual-layered structural semiconductor chips are provided. The semiconductor chip includes a first semiconductor chip and a second semiconductor chip bonded to the first semiconductor chip. The first semiconductor chip includes a first substrate having a first bottom surface. The second semiconductor chip includes a second substrate having a second bottom surface. The first bottom surface directly contacts the second bottom surface. The related packages and the related methods are also provided.

Abstract translation: 提供双层结构半导体芯片。 半导体芯片包括接合到第一半导体芯片的第一半导体芯片和第二半导体芯片。 第一半导体芯片包括具有第一底表面的第一基板。 第二半导体芯片包括具有第二底面的第二基板。 第一底面直接接触第二底面。 还提供了相关包和相关方法。

公开(公告)号：US09371583B2

公开(公告)日：2016-06-21

申请号：US12577885

申请日：2009-10-13

Applicant: Ki Jong Kim ,  Hyun Kyu Cho ,  Jin Su Lee ,  Se Yong Kim

Inventor： Ki Jong Kim ,  Hyun Kyu Cho ,  Jin Su Lee ,  Se Yong Kim

IPC: C23C16/00 ,  C23C16/455 ,  C23C16/509 ,  H01J37/32

CPC classification number: C23C16/45542 ,  C23C16/45551 ,  C23C16/5096 ,  H01J37/32009 ,  H01J37/32091 ,  H01J37/32146 ,  H01J37/3244 ,  H01J37/32568 ,  H01J37/32733 ,  H01J2237/332

Abstract: A deposition apparatus according to an exemplary embodiment of the present invention includes a plurality of reaction spaces, a plurality of plasma electrodes respectively disposed in the reaction spaces, a first plasma processor connected to at least two plasma electrodes, and a first plasma power source connected to the first plasma processor. The first plasma processor may include a plasma distributor or a plasma splitter.

Abstract translation: 根据本发明的示例性实施例的沉积设备包括多个反应空间，分别设置在反应空间中的多个等离子体电极，连接到至少两个等离子体电极的第一等离子体处理器和连接到第一等离子体电源的第一等离子体电源 到第一等离子体处理器。 第一等离子体处理器可以包括等离子体分配器或等离子体分离器。

公开(公告)号：US07731315B2

公开(公告)日：2010-06-08

申请号：US11946379

申请日：2007-11-28

Applicant: Byung Kil Lee ,  Geun Ho Her ,  Chun Young Oh ,  Jin Su Lee ,  Min Jung Kim

Inventor： Byung Kil Lee ,  Geun Ho Her ,  Chun Young Oh ,  Jin Su Lee ,  Min Jung Kim

IPC: A47B96/04

CPC classification number: F25D23/064 ,  F25D23/067 ,  Y10T292/68

Abstract: A refrigerator having a mounting structure capable of easily and conveniently achieving the mounting process for elements to be installed in an inner case. The refrigerator includes a first body including an inner case, an outer case, and a urethane foam filled between the inner case and the outer case, a coupling hole formed through the inner case, a mounting member coupled to the coupling hole at a first outside of the inner case by a first end of the mounting member and provided with a fastening hole, the mounting member being fixed between the inner case and the outer case by the urethane foam when the urethane foam is filled, and a fastening member fastened to the fastening hole at a first inside of the inner case.

Abstract translation: 一种具有安装结构的冰箱，其能够容易且方便地实现用于安装在内壳中的元件的安装过程。 冰箱包括：第一主体，包括内壳体，外壳体和填充在内壳体和外壳体之间的聚氨酯泡沫;第一壳体，通过内壳形成的联接孔;安装构件，其在第一外部联接到联接孔 所述内壳由所述安装构件的第一端设置并具有紧固孔，所述安装构件在聚氨酯泡沫填充时由所述聚氨酯泡沫固定在所述内壳体和所述外壳体之间，并且紧固构件 在内壳的第一内侧的紧固孔。

公开(公告)号：US11259512B2

公开(公告)日：2022-03-01

申请号：US17255543

申请日：2019-09-06

Applicant: Jin Su Lee

Inventor： Jin Su Lee

IPC: A01K89/01 ,  A01K89/012 ,  A01K89/00

Abstract: A dual-driving one-way rotational device includes: a body part; a clutch bearing part configured to guide the rotation of the body part in one direction; a knob part configured to be rotated in one direction in the state of being connected to an object to be rotated or to prevent the body part from being rotated together when the object to be rotated and the clutch bearing part are rotated in the same direction; a manual rotation lever installed on the body part; and a power transmission shaft coupled to the knob part, and configured to transfer the power of a power source. The knob part includes a rotation portion and a head portion. A spiral is formed on the inner circumferences of the rotation portion and the head portion. The power transmission shaft has the outer circumference on which a spiral is formed.

公开(公告)号：US20100089320A1

公开(公告)日：2010-04-15

申请号：US12577885

申请日：2009-10-13

Applicant: Ki Jong KIM ,  Hyun Kyu Cho ,  Jin Su Lee ,  Se Yong Kim

Inventor： Ki Jong KIM ,  Hyun Kyu Cho ,  Jin Su Lee ,  Se Yong Kim

IPC: C23C16/513

CPC classification number: C23C16/45542 ,  C23C16/45551 ,  C23C16/5096 ,  H01J37/32009 ,  H01J37/32091 ,  H01J37/32146 ,  H01J37/3244 ,  H01J37/32568 ,  H01J37/32733 ,  H01J2237/332

Abstract: A deposition apparatus according to an exemplary embodiment of the present invention includes a plurality of reaction spaces, a plurality of plasma electrodes respectively disposed in the reaction spaces, a first plasma processor connected to at least two plasma electrodes, and a first plasma power source connected to the first plasma processor. The first plasma processor may include a plasma distributor or a plasma splitter.

Abstract translation: 根据本发明的示例性实施例的沉积设备包括多个反应空间，分别设置在反应空间中的多个等离子体电极，连接到至少两个等离子体电极的第一等离子体处理器和连接到第一等离子体电源的第一等离子体电源 到第一等离子体处理器。 第一等离子体处理器可以包括等离子体分配器或等离子体分离器。