Semi-trailer support loading nut
    5.
    发明授权
    Semi-trailer support loading nut 失效
    半挂车支撑装载螺母

    公开(公告)号:US08622677B2

    公开(公告)日:2014-01-07

    申请号:US12744153

    申请日:2008-05-23

    IPC分类号: F16B37/00

    CPC分类号: B60S9/08

    摘要: A semi-trailer leg loading nut includes a screwed hole provided on a nut column and connecting two ends of the nut. Said nut is a two-layered structure formed of a top layer and an under layer or a three-layered structure formed of a top layer, an intermediate layer and an under layer. The outer outline of at least two layers of the nut is a square with the same cutting angle. The side length of the two layers of squares is equal. The outer outline projection of the two layers of squares overlap with each other along the column axis direction. The outer outline projection of the other layer is within the overlapped projection of the two layers along the column axis direction. A funneled oil cup or an oil groove is provided on the top layer of the nut and communicates with the screwed hole. A bottom of the under layer of the nut is plane and is pressed on a loading plate in a quadrate pipe to transfer load.

    摘要翻译: 半挂车小腿装载螺母包括设在螺母柱上并连接螺母两端的螺纹孔。 所述螺母是由顶层和下层或由顶层,中间层和下层形成的三层结构形成的两层结构。 螺母的至少两层的外轮廓是具有相同切割角度的正方形。 两层正方形的边长相等。 两层正方形的外轮廓投影沿柱轴方向相互重叠。 另一层的外轮廓投影在两列沿着列轴方向的重叠投影内。 漏斗油杯或油槽设置在螺母的顶层上,并与螺纹孔连通。 螺母底层的底部是平面的,并被压在方管中的装载板上以传递负载。

    FinFET method and structure with embedded underlying anti-punch through layer
    6.
    发明授权
    FinFET method and structure with embedded underlying anti-punch through layer 有权
    FinFET方法和结构具有嵌入式底层抗穿透层

    公开(公告)号:US08497171B1

    公开(公告)日:2013-07-30

    申请号:US13541806

    申请日:2012-07-05

    IPC分类号: H01L21/8238

    CPC分类号: H01L21/823821

    摘要: Methods and structures for forming semiconductor FinFET devices with superior repeatability and reliability include providing APT (anti-punch through) layer accurately formed beneath a semiconductor fins, are provided. Both the n-type and p-type APT layers are formed prior to the formation of the material from which the semiconductor fin is formed. In some embodiments, barrier layers are added between the accurately positioned APT layer and the semiconductor fin. Ion implantation methods and epitaxial growth methods are used to form appropriately doped APT layers in a semiconductor substrate surface. The fin material is formed over the APT layers using epitaxial growth/deposition methods.

    摘要翻译: 用于形成具有优异重复性和可靠性的半导体FinFET器件的方法和结构包括提供准确地形成在半导体鳍片之下的APT(抗穿通)层。 在形成半导体翅片的材料形成之前,形成n型和p型APT层。 在一些实施例中,在精确定位的APT层和半导体鳍片之间添加阻挡层。 使用离子注入方法和外延生长方法在半导体衬底表面中形成适当掺杂的APT层。 使用外延生长/沉积方法在APT层上形成翅片材料。

    SEMI-TRAILER AXLE AND SUSPENSION CONNECTING STRUCTURE
    7.
    发明申请
    SEMI-TRAILER AXLE AND SUSPENSION CONNECTING STRUCTURE 审中-公开
    半挂车轴和悬挂连接结构

    公开(公告)号:US20120056398A1

    公开(公告)日:2012-03-08

    申请号:US13320543

    申请日:2009-12-01

    申请人: Zhiqiang Wu

    发明人: Zhiqiang Wu

    IPC分类号: B60G11/27 B60G9/00

    摘要: A semi-trailer axle and suspension connecting structure includes an axle (5), a suspension system and a connecting member arranged on the axle (5) body and a suspension support plate (6) of the suspension system. A locating structure is arranged on the match surface of the axle (5) and the suspension support plate (6) to prevent the circumferentially and axially relative displacement between the axle (5) and the suspension support plate (6). The invention omits a welding process for the axle body and the suspension support plate (6). The axle body still keeps a good strength structure while the firm connection of the axle body and the suspension arrives, and the stress damage caused by welding is avoided.

    摘要翻译: 半挂车轴和悬挂连接结构包括轴(5),悬架系统和布置在轴(5)主体上的连接构件和悬架系统的悬架支撑板(6)。 定位结构布置在轴(5)和悬架支撑板(6)的匹配表面上,以防止轴(5)和悬架支撑板(6)之间的周向和轴向相对位移。 本发明省略了用于车轴和悬架支撑板(6)的焊接工艺。 轴体和悬架的牢固连接到达时,轴体仍保持良好的强度结构,避免了焊接引起的应力损伤。

    Disposable Spacer Integration with Stress Memorization Technique and Silicon-Germanium
    8.
    发明申请
    Disposable Spacer Integration with Stress Memorization Technique and Silicon-Germanium 有权
    一次性间隔与应力记忆技术和硅锗的整合

    公开(公告)号:US20110070703A1

    公开(公告)日:2011-03-24

    申请号:US12549862

    申请日:2009-08-28

    IPC分类号: H01L21/8238

    摘要: An integrated process flow for forming an NMOS transistor (104) and an embedded SiGe (eSiGe) PMOS transistor (102) using a stress memorization technique (SMT) layer (126). The SMT layer (126) is deposited over both the NMOS transistor (104) and PMOS transistor (102). The portion of SMT layer (126) over PMOS transistor (102) is anisotropically etched to form spacers (128) without etching the portion of SMT layer (126) over NMOS transistor (104). Spacers (128) are used to align the SiGe recess etch and growth to form SiGe source/drain regions (132). The source/drain anneals are performed after etching the SMT layer (126) such that SMT layer (126) provides the desired stress to the NMOS transistor (104) without degrading PMOS transistor (102).

    摘要翻译: 一种用于使用应力存储技术(SMT)层(126)形成NMOS晶体管(104)和嵌入式SiGe(eSiGe)PMOS晶体管(102)的集成工艺流程。 SMT层(126)沉积在NMOS晶体管(104)和PMOS晶体管(102)两者之上。 在PMOS晶体管(102)上方的SMT层(126)的部分被各向异性蚀刻以形成间隔物(128),而不通过NMOS晶体管(104)蚀刻SMT层(126)的部分。 间隔物(128)用于对准SiGe凹陷蚀刻和生长以形成SiGe源极/漏极区域(132)。 在蚀刻SMT层(126)之后执行源极/漏极退火,使得SMT层(126)在不降低PMOS晶体管(102)的情况下向NMOS晶体管(104)提供期望的应力。

    Method of manufacturing transistor having germanium implant region on the sidewalls of the polysilicon gate electrode
    10.
    发明授权
    Method of manufacturing transistor having germanium implant region on the sidewalls of the polysilicon gate electrode 有权
    在多晶硅栅电极的侧壁上制造具有锗注入区的晶体管的方法

    公开(公告)号:US07118979B2

    公开(公告)日:2006-10-10

    申请号:US10701818

    申请日:2003-11-05

    IPC分类号: H01L21/336 H01L29/78

    摘要: The present invention provides a transistor 100 having a germanium implant region 170 located therein, a method of manufacture therefor, and an integrated circuit including the aforementioned transistor. The transistor 100, in one embodiment, includes a polysilicon gate electrode 140 located over a semiconductor substrate 110, wherein a sidewall of the polysilicon gate electrode 140 has a germanium implanted region 170 located therein. The transistor 100 further includes source/drain regions 160 located within the semiconductor substrate 110 proximate the polysilicon gate electrode 140.

    摘要翻译: 本发明提供一种具有位于其中的锗注入区域170的晶体管100及其制造方法,以及包括上述晶体管的集成电路。 在一个实施例中,晶体管100包括位于半导体衬底110上方的多晶硅栅电极140,其中多晶硅栅电极140的侧壁上具有锗注入区170。 晶体管100还包括靠近多晶硅栅电极140位于半导体衬底110内的源/漏区160。