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    Semiconductor memory device
    1.
    发明授权
    Semiconductor memory device 有权
    半导体存储器件

    公开(公告)号：US09183893B2

    公开(公告)日：2015-11-10

    申请号：US14037547

    申请日：2013-09-26

    申请人： Kohji Kanamori ,  Youngwoo Park ,  Jintaek Park ,  Kwang Soo Seol ,  Jaeduk Lee

    发明人： Kohji Kanamori ,  Youngwoo Park ,  Jintaek Park ,  Kwang Soo Seol ,  Jaeduk Lee

    IPC分类号： G11C5/06 ,  G11C13/00 ,  H01L45/00 ,  H01L27/22 ,  H01L27/24

    CPC分类号： G11C5/06 ,  G11C5/063 ,  G11C13/0002 ,  G11C13/0023 ,  G11C2213/73 ,  H01L27/222 ,  H01L27/249 ,  H01L45/04 ,  H01L45/06 ,  H01L45/1226 ,  H01L45/143 ,  H01L45/144 ,  H01L45/146 ,  H01L45/147

    摘要： According to example embodiments of inventive concepts, a semiconductor memory devices includes: a plurality of memory blocks that each include a plurality of stack structures, global bit lines connected in common to the plurality of memory blocks, block selection lines configured to control electrical connect between the global bit lines and one of the plurality of memory blocks, and vertical selection lines configured to control electrical connected between the global bit lines and one of the plurality of stack structures. Each of the plurality of stack structures includes a plurality of local bit lines, first vertical word lines and second vertical word lines crossing first sidewalls and second sidewalls respectfully of the plurality of stack structures, first variable resistive elements between the plurality of stack structures and the first vertical word lines, and second variable resistive elements between the plurality of stack structures and the second vertical word lines.

    摘要翻译： 根据本发明构思的示例性实施例，半导体存储器件包括：多个存储器块，每个存储块包括多个堆叠结构，共同连接到多个存储器块的全局位线，被配置为控制 全局位线和多个存储器块中的一个以及垂直选择线，其被配置为控制连接在全局位线和多个堆叠结构中的一个之间的电连接。 多个堆叠结构中的每一个包括多个局部位线，第一垂直字线和第二垂直字线，其横向于多个堆叠结构的第一侧壁和第二侧壁相交，多个堆叠结构之间的第一可变电阻元件和 第一垂直字线和第二可变电阻元件在多个堆叠结构和第二垂直字线之间。

    Three-dimensional semiconductor devices with current path selection structure
    2.
    发明授权
    Three-dimensional semiconductor devices with current path selection structure 有权
    具有电流路径选择结构的三维半导体器件

    公开(公告)号：US09299707B2

    公开(公告)日：2016-03-29

    申请号：US14150452

    申请日：2014-01-08

    申请人： Jaeduk Lee ,  Youngwoo Park ,  Jintaek Park ,  Dohyun Lee ,  Kohji Kanamori

    发明人： Jaeduk Lee ,  Youngwoo Park ,  Jintaek Park ,  Dohyun Lee ,  Kohji Kanamori

    IPC分类号： H01L27/108 ,  H01L27/105 ,  H01L27/115 ,  G11C16/10 ,  G11C16/14

    CPC分类号： H01L27/1052 ,  G11C16/10 ,  G11C16/14 ,  H01L27/11524 ,  H01L27/11556

    摘要： Provided are three-dimensional semiconductor devices and methods of operating the same. The three-dimensional semiconductor devices may include active patterns arranged on a substrate to have a multi-layered and multi-column structure and drain patterns connected to respective columns of the active patterns. The methods may include a layer-selection step connecting a selected one of layers of the active patterns selectively to the drain patterns. For example, the layer-selection step may be performed in such a way that widths of depletion regions to be formed in end-portions of the active patterns are differently controlled depending on to a height from the substrate.

    摘要翻译： 提供三维半导体器件及其操作方法。 三维半导体器件可以包括布置在衬底上的有源图案，以具有连接到有源图案的相应列的多层和多列结构以及漏极图案。 所述方法可以包括选择性地将有源图案的层中所选择的一个层连接到漏极图案的层选择步骤。 例如，层选择步骤可以以这样的方式执行，使得在有源图案的端部中形成的耗尽区的宽度根据与基板的高度不同地被控制。

    Three-dimensional semiconductor devices and methods of fabricating the same
    4.
    发明授权
    Three-dimensional semiconductor devices and methods of fabricating the same 有权
    三维半导体器件及其制造方法

    公开(公告)号：US09019739B2

    公开(公告)日：2015-04-28

    申请号：US14152440

    申请日：2014-01-10

    申请人： Jintaek Park ,  Kohji Kanamori ,  Youngwoo Park ,  Jaeduk Lee

    发明人： Jintaek Park ,  Kohji Kanamori ,  Youngwoo Park ,  Jaeduk Lee

    IPC分类号： G11C5/02 ,  H01L27/115 ,  G11C7/02 ,  G11C7/18 ,  G11C7/10

    CPC分类号： G11C5/025 ,  G11C7/02 ,  G11C7/1039 ,  G11C7/18 ,  H01L27/11573 ,  H01L27/11582

    摘要： According to example embodiments of inventive concepts, a three-dimensional semiconductor device may include: a memory cell array including memory cells that may be arranged three-dimensionally, the memory cell array including a left side opposite a right side, and a top side opposite a bottom side in a plan view; at least one word line decoder adjacent to at least one of the left and right sides of the memory cell array; a page buffer adjacent to the bottom side of the memory cell array; and a string selection line decoder adjacent to one of the top and bottom sides of the memory cell array.

    摘要翻译： 根据本发明构思的示例性实施例，三维半导体器件可以包括：存储单元阵列，其包括可以三维布置的存储器单元，所述存储单元阵列包括与右侧相对的左侧， 平面图的底面; 与存储单元阵列的左侧和右侧中的至少一个相邻的至少一个字线解码器; 邻近存储单元阵列的底侧的页缓冲器; 以及与存储单元阵列的顶侧和底侧之一相邻的串选择线解码器。

    THREE-DIMENSIONAL SEMICONDUCTOR DEVICES WITH CURRENT PATH SELECTION STRUCTURE AND METHODS OF OPERATING THE SAME
    5.
    发明申请
    THREE-DIMENSIONAL SEMICONDUCTOR DEVICES WITH CURRENT PATH SELECTION STRUCTURE AND METHODS OF OPERATING THE SAME 有权
    具有电流路径选择结构的三维半导体器件及其操作方法

    公开(公告)号：US20140197469A1

    公开(公告)日：2014-07-17

    申请号：US14150452

    申请日：2014-01-08

    申请人： Jaeduk Lee ,  Youngwoo Park ,  Jintaek Park ,  Dohyun Lee ,  Kohji Kanamori

    发明人： Jaeduk Lee ,  Youngwoo Park ,  Jintaek Park ,  Dohyun Lee ,  Kohji Kanamori

    IPC分类号： H01L27/105

    CPC分类号： H01L27/1052 ,  G11C16/10 ,  G11C16/14 ,  H01L27/11524 ,  H01L27/11556

    摘要： Provided are three-dimensional semiconductor devices and methods of operating the same. The three-dimensional semiconductor devices may include active patterns arranged on a substrate to have a multi-layered and multi-column structure and drain patterns connected to respective columns of the active patterns. The methods may include a layer-selection step connecting a selected one of layers of the active patterns selectively to the drain patterns. For example, the layer-selection step may be performed in such a way that widths of depletion regions to be formed in end-portions of the active patterns are differently controlled depending on to a height from the substrate.

    摘要翻译： 提供三维半导体器件及其操作方法。 三维半导体器件可以包括布置在衬底上的有源图案，以具有连接到有源图案的相应列的多层和多列结构以及漏极图案。 所述方法可以包括选择性地将有源图案的层中所选择的一个层连接到漏极图案的层选择步骤。 例如，层选择步骤可以以这样的方式执行，使得在有源图案的端部中形成的耗尽区的宽度根据与基板的高度不同地被控制。

    SEMICONDUCTOR DEVICES INCLUDING WORD LINE INTERCONNECTING STRUCTURES
    6.
    发明申请
    SEMICONDUCTOR DEVICES INCLUDING WORD LINE INTERCONNECTING STRUCTURES 有权
    包括字线互连结构的半导体器件

    公开(公告)号：US20140306279A1

    公开(公告)日：2014-10-16

    申请号：US14191542

    申请日：2014-02-27

    申请人： Jintaek Park ,  Youngwoo Park ,  Jaeduk Lee

    发明人： Jintaek Park ,  Youngwoo Park ,  Jaeduk Lee

    IPC分类号： H01L23/00 ,  H01L27/115

    CPC分类号： H01L27/11556 ,  H01L27/11582 ,  H01L29/7889 ,  H01L29/7926

    摘要： A semiconductor memory device includes a substrate including a cell region and an interconnection region, adjacent first and second rows of vertical channels extending vertically from the substrate in the cell region, and layers of word lines stacked on the substrate. Each layer includes a first word line through which the first row of vertical channels passes and a second word line through which the second row of vertical channels passes, and the word lines include respective word line pads extending into the interconnection region. An isolation pattern separates the first and second word lines in the cell region and the interconnection region. First and second pluralities of contact plugs are disposed on opposite sides of the isolation pattern in the interconnection region and contact the word line pads.

    摘要翻译： 半导体存储器件包括：衬底，其包括单元区域和互连区域;相邻的从单元区域中的衬底垂直延伸的第一和第二排垂直沟道以及堆叠在衬底上的字线层。 每层包括第一行垂直通道通过的第一字线和第二行垂直通道通过的第二字线，并且字线包括延伸到互连区域中的相应字线焊盘。 隔离图案分离单元区域和互连区域中的第一和第二字线。 第一和第二多个接触插塞设置在互连区域中的隔离图案的相对侧上，并与字线焊盘接触。

    Semiconductor devices including word line interconnecting structures
    8.
    发明授权
    Semiconductor devices including word line interconnecting structures 有权
    半导体器件包括字线互连结构

    公开(公告)号：US09337207B2

    公开(公告)日：2016-05-10

    申请号：US14191542

    申请日：2014-02-27

    申请人： Jintaek Park ,  Youngwoo Park ,  Jaeduk Lee

    发明人： Jintaek Park ,  Youngwoo Park ,  Jaeduk Lee

    IPC分类号： H01L29/76 ,  H01L27/115 ,  H01L29/788 ,  H01L29/792

    CPC分类号： H01L27/11556 ,  H01L27/11582 ,  H01L29/7889 ,  H01L29/7926

    摘要： A semiconductor memory device includes a substrate including a cell region and an interconnection region, adjacent first and second rows of vertical channels extending vertically from the substrate in the cell region, and layers of word lines stacked on the substrate. Each layer includes a first word line through which the first row of vertical channels passes and a second word line through which the second row of vertical channels passes, and the word lines include respective word line pads extending into the interconnection region. An isolation pattern separates the first and second word lines in the cell region and the interconnection region. First and second pluralities of contact plugs are disposed on opposite sides of the isolation pattern in the interconnection region and contact the word line pads.

    摘要翻译： 半导体存储器件包括：衬底，其包括单元区域和互连区域;相邻的从单元区域中的衬底垂直延伸的第一和第二排垂直沟道以及堆叠在衬底上的字线层。 每层包括第一行垂直通道通过的第一字线和第二行垂直通道通过的第二字线，并且字线包括延伸到互连区域中的相应字线焊盘。 隔离图案分离单元区域和互连区域中的第一和第二字线。 第一和第二多个接触插塞设置在互连区域中的隔离图案的相对侧上，并与字线焊盘接触。

    NONVOLATILE MEMORY INCLUDING MEMORY CELL ARRAY HAVING THREE-DIMENSIONAL STRUCTURE
    9.
    发明申请
    NONVOLATILE MEMORY INCLUDING MEMORY CELL ARRAY HAVING THREE-DIMENSIONAL STRUCTURE 有权
    非易失性存储器，包括具有三维结构的存储器单元阵列

    公开(公告)号：US20140151783A1

    公开(公告)日：2014-06-05

    申请号：US14080823

    申请日：2013-11-15

    申请人： Jintaek Park ,  Youngwoo Park

    发明人： Jintaek Park ,  Youngwoo Park

    IPC分类号： H01L27/115

    CPC分类号： H01L27/11578 ,  H01L27/11551 ,  H01L27/2481 ,  H01L29/4234 ,  H01L29/792

    摘要： A nonvolatile memory is provided which includes a plurality of channel layers and a plurality of insulation layers alternately stacked on a substrate in a direction perpendicular to the substrate, each of the plurality of channel layers including a plurality of channel films extending along a first direction on a plane parallel with the substrate; a plurality of conductive materials extending from a top of the channel layers and the insulation layers up to a portion adjacent to the substrate in a direction perpendicular to the substrate through areas among channel films of each channel layer; a plurality of information storage films provided between the channel films of the channel layers and the conductive materials; and a plurality of bit lines connected to the channel layers, respectively, wherein the conductive materials, the information storage films, and the channel films of the channel layers form a three-dimensional memory cell array, wherein the conductive materials form a plurality of groups, and wherein a distance between the groups is longer than a distance between conductive materials in each other.

    摘要翻译： 提供了一种非易失性存储器，其包括多个通道层和多个绝缘层，所述多个绝缘层沿垂直于所述衬底的方向交替堆叠在衬底上，所述多个沟道层中的每一个包括沿着第一方向延伸的多个沟道膜 与基板平行的平面; 多个导电材料，其从沟道层的顶部和绝缘层延伸到与基板垂直的方向上的与衬底相邻的部分，通过每个沟道层的沟道膜之间的区域; 设置在沟道层的沟道膜和导电材料之间的多个信息存储膜; 以及分别连接到沟道层的多个位线，其中沟道层的导电材料，信息存储膜和沟道膜形成三维存储单元阵列，其中导电材料形成多个组 并且其中所述组之间的距离长于彼此之间的导电材料之间的距离。