公开(公告)号：US20080310487A1

公开(公告)日：2008-12-18

申请号：US12004406

申请日：2007-12-21

申请人： Joachim S. Hammerschmidt ,  Arya Reza Behzad ,  Keith Andrews Carter ,  Simeon Furrer ,  Rohit Vijay Gaikwad ,  Jason Alexander Trachewsky ,  Amit Bagchi ,  Rajendra Tushar Moorti ,  Venkateswara Rao Kodavati

发明人： Joachim S. Hammerschmidt ,  Arya Reza Behzad ,  Keith Andrews Carter ,  Simeon Furrer ,  Rohit Vijay Gaikwad ,  Jason Alexander Trachewsky ,  Amit Bagchi ,  Rajendra Tushar Moorti ,  Venkateswara Rao Kodavati

IPC分类号： H04B1/44

CPC分类号： H04B7/0413 ,  H01L2924/0002 ,  H01L2924/00

摘要： Embodiments of a wireless transceiver are provided. Embodiments can be used in multiple-input-multiple-output (MIMO) wireless transceivers. In an embodiment, radio control signal bundles are provided as direct parallel interconnects between digital signal processing modules and the radio module of the wireless transceiver to enable a precise low-latency control of radio functions. In another embodiment, a separate physical line is provided to control each radio setting of the radio module, thereby enabling simultaneous real-time control of any number of radio settings. In a further embodiment, the various digital and analog components of the wireless transceiver are integrated within a single chip of the same process technology.

摘要翻译： 提供了无线收发器的实施例。 实施例可以用于多输入多输出（MIMO）无线收发器。 在一个实施例中，无线电控制信号束被提供为数字信号处理模块和无线收发器的无线电模块之间的直接并行互连，以实现无线电功能的精确的低延迟控制。 在另一个实施例中，提供单独的物理线路以控制无线电模块的每个无线电设置，从而实现对任意数量的无线电设置的同时实时控制。 在另一个实施例中，无线收发器的各种数字和模拟组件被集成在相同处理技术的单个芯片内。

公开(公告)号：US08369388B2

公开(公告)日：2013-02-05

申请号：US12004406

申请日：2007-12-21

申请人： Joachim S. Hammerschmidt ,  Arya Reza Behzad ,  Keith Andrews Carter ,  Simeon Furrer ,  Rohit Vijay Gaikwad ,  Jason Alexander Trachewsky ,  Amit Bagchi ,  Rajendra Tushar Moorti ,  Venkateswara Rao Kodavati

发明人： Joachim S. Hammerschmidt ,  Arya Reza Behzad ,  Keith Andrews Carter ,  Simeon Furrer ,  Rohit Vijay Gaikwad ,  Jason Alexander Trachewsky ,  Amit Bagchi ,  Rajendra Tushar Moorti ,  Venkateswara Rao Kodavati

IPC分类号： H04B1/44

CPC分类号： H04B7/0413 ,  H01L2924/0002 ,  H01L2924/00

摘要： Embodiments of a wireless transceiver are provided. Embodiments can be used in multiple-input-multiple-output (MIMO) wireless transceivers. In an embodiment, radio control signal bundles are provided as direct parallel interconnects between digital signal processing modules and the radio module of the wireless transceiver to enable a precise low-latency control of radio functions. In another embodiment, a separate physical line is provided to control each radio setting of the radio module, thereby enabling simultaneous real-time control of any number of radio settings. In a further embodiment, the various digital and analog components of the wireless transceiver are integrated within a single chip of the same process technology.

摘要翻译： 提供了无线收发器的实施例。 实施例可以用于多输入多输出（MIMO）无线收发器。 在一个实施例中，无线电控制信号束被提供为数字信号处理模块和无线收发器的无线电模块之间的直接并行互连，以实现无线电功能的精确的低延迟控制。 在另一个实施例中，提供单独的物理线路以控制无线电模块的每个无线电设置，从而实现对任意数量的无线电设置的同时实时控制。 在另一个实施例中，无线收发器的各种数字和模拟组件被集成在相同处理技术的单个芯片内。

公开(公告)号：US10013285B2

公开(公告)日：2018-07-03

申请号：US12877941

申请日：2010-09-08

申请人： Arya Reza Behzad ,  Michael Boers ,  Jesus Alfonso Castaneda ,  Ahmadreza Reza Rofougaran ,  Sam Zhao

发明人： Arya Reza Behzad ,  Michael Boers ,  Jesus Alfonso Castaneda ,  Ahmadreza Reza Rofougaran ,  Sam Zhao

IPC分类号： G06F9/50 ,  H04W4/80 ,  H04B7/10 ,  H04B5/00 ,  H04W4/00 ,  H04W84/18 ,  H04B7/26

CPC分类号： G06F9/50 ,  H04B5/0037 ,  H04B7/10 ,  H04B7/26 ,  H04W4/80 ,  H04W84/18 ,  Y10T307/492

摘要： Disclosed herein are systems, apparatuses, and methods for locating wireless-enabled components, and applications thereof. Such an apparatus includes a wireless-enabled component (WEC), which may be a functional block of an integrated circuit (IC), an IC, or a device that includes an IC. The WEC includes a functional module (e.g., a processing resource or a memory resource) and an antenna element coupled to the functional module. The antenna element is configured to (i) transmit a search signal to locate a proximally situated WEC and (ii) transmit a communication signal to communicate with the proximally situated WEC. The antenna element may be a phased array, an electrically steered phased array, a mechanically steered phased array, a directional antenna, a mechanically steered directional antenna, an RF antenna, an optical antenna, and/or any combination thereof.

公开(公告)号：US09570420B2

公开(公告)日：2017-02-14

申请号：US13248745

申请日：2011-09-29

申请人： Jesus Alfonso Castaneda ,  Arya Reza Behzad ,  Ahmadreza Rofougaran ,  Sam Ziqun Zhao ,  Michael Boers

发明人： Jesus Alfonso Castaneda ,  Arya Reza Behzad ,  Ahmadreza Rofougaran ,  Sam Ziqun Zhao ,  Michael Boers

IPC分类号： H01L23/02 ,  H01L25/065 ,  H01P3/12 ,  H01L25/10 ,  G02B6/43 ,  G02B6/12 ,  H01L23/66 ,  H01L23/522 ,  H04L7/00 ,  H01P3/00

CPC分类号： H01L25/0657 ,  G02B6/12002 ,  G02B6/43 ,  H01L23/5222 ,  H01L23/66 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/105 ,  H01L2223/6627 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2225/06517 ,  H01L2225/06531 ,  H01L2225/06572 ,  H01L2225/1005 ,  H01L2924/1461 ,  H01P3/00 ,  H01P3/12 ,  H01P3/121 ,  H04L7/0091 ,  H01L2924/00

摘要： Methods and apparatus are disclosed for wirelessly communicating among integrated circuits and/or functional modules within the integrated circuits. A semiconductor device fabrication operation uses a predetermined sequence of photographic and/or chemical processing steps to form one or more functional modules onto a semiconductor substrate. The functional modules are coupled to an integrated waveguide that is formed onto the semiconductor substrate and/or attached thereto to form an integrated circuit. The functional modules communicate with each other as well as to other integrated circuits using a multiple access transmission scheme via the integrated waveguide. One or more integrated circuits may be coupled to an integrated circuit carrier to form Multichip Module. The Multichip Module may be coupled to a semiconductor package to form a packaged integrated circuit.

摘要翻译： 公开了用于在集成电路内的集成电路和/或功能模块之间进行无线通信的方法和装置。 半导体器件制造操作使用预定的照相和/或化学处理步骤顺序在半导体衬底上形成一个或多个功能模块。 功能模块耦合到形成在半导体衬底上和/或连接到其上以形成集成电路的集成波导。 功能模块通过集成波导使用多址传输方案彼此通信以及其他集成电路。 一个或多个集成电路可以耦合到集成电路载体以形成多芯片模块。 多芯片模块可以耦合到半导体封装以形成封装的集成电路。

公开(公告)号：US09008589B2

公开(公告)日：2015-04-14

申请号：US12877706

申请日：2010-09-08

申请人： Ahmadreza (Reza) Rofougaran ,  Arya Reza Behzad ,  Sam Ziqun Zhao ,  Jesus Alfonso Castaneda ,  Michael Boers

发明人： Ahmadreza (Reza) Rofougaran ,  Arya Reza Behzad ,  Sam Ziqun Zhao ,  Jesus Alfonso Castaneda ,  Michael Boers

IPC分类号： H04B1/38 ,  G06F13/42 ,  H04B7/10 ,  G06F13/364 ,  H04W84/18

CPC分类号： G06F9/50 ,  H04B5/0037 ,  H04B7/10 ,  H04B7/26 ,  H04W4/80 ,  H04W84/18 ,  Y10T307/492

摘要： Embodiments of the present invention are directed to a wireless-enabled component (WEC) for enabling a wireless bus for intra-chip and inter-chip communication. A WEC encompasses a functional block of an IC (such as, for example, a processing core of a processing unit), an entire IC (such as, for example, a processing unit), or a device that includes a plurality of ICs (such as, for example, a handheld device). According to embodiments, a WEC may be associated with one or more sub-blocks of an IC, a single IC, or a plurality of ICs.

摘要翻译： 本发明的实施例涉及一种能够使无线总线进行片内和芯片间通信的无线使能分量（WEC）。 WEC包括IC（例如处理单元的处理核心）的功能块，整个IC（例如，处理单元）或包括多个IC的设备（ 例如手持设备）。 根据实施例，WEC可以与IC，单个IC或多个IC的一个或多个子块相关联。

公开(公告)号：US09002673B2

公开(公告)日：2015-04-07

申请号：US13025657

申请日：2011-02-11

申请人： Arya Reza Behzad ,  Ahmadreza Rofougaran ,  Sam Ziqun Zhao ,  Jesus Alfonso Castaneda ,  Michael Boers

发明人： Arya Reza Behzad ,  Ahmadreza Rofougaran ,  Sam Ziqun Zhao ,  Jesus Alfonso Castaneda ,  Michael Boers

IPC分类号： G01R31/14 ,  G01R31/28 ,  G01R31/302 ,  G01R31/311

CPC分类号： G01R31/2834 ,  G01R31/3025 ,  G01R31/311

摘要： Methods and apparatus are disclosed to simultaneously, wirelessly test semiconductor components formed on a semiconductor wafer. The semiconductor components transmit respective outcomes of a self-contained testing operation to wireless automatic test equipment via a common communication channel. Multiple receiving antennas observe the outcomes from multiple directions in three dimensional space. The wireless automatic test equipment determines whether one or more of the semiconductor components operate as expected and, optionally, may use properties of the three dimensional space to determine a location of one or more of the semiconductor components. The wireless testing equipment may additionally determine performance of the semiconductor components by detecting infrared energy emitted, transmitted, and/or reflected by the semiconductor wafer before, during, and/or after a self-contained testing operation.

摘要翻译： 公开了同时无线地测试形成在半导体晶片上的半导体元件的方法和装置。 半导体部件通过公共通信信道将各自的测试结果传送到无线自动测试设备。 多个接收天线在三维空间中观察多个方向的结果。 无线自动测试设备确定一个或多个半导体组件是否按预期运行，并且可选地，可以使用三维空间的属性来确定一个或多个半导体组件的位置。 无线测试设备还可以通过检测在独立测试操作之前，期间和/或之后由半导体晶片发射，传输和/或反射的红外能量来确定半导体组件的性能。

公开(公告)号：US08923765B2

公开(公告)日：2014-12-30

申请号：US12877868

申请日：2010-09-08

申请人： Arya Reza Behzad ,  Michael Boers ,  Jesus Alfonso Castaneda ,  Ahmadreza (Reza) Rofougaran ,  Sam Ziqun Zhao

发明人： Arya Reza Behzad ,  Michael Boers ,  Jesus Alfonso Castaneda ,  Ahmadreza (Reza) Rofougaran ,  Sam Ziqun Zhao

IPC分类号： H04B7/00 ,  H01L23/48 ,  H01L23/66 ,  H04L12/40 ,  H04W84/18 ,  H04W8/00

CPC分类号： H04W84/18 ,  H01L23/48 ,  H01L23/66 ,  H01L2223/6677 ,  H01L2924/0002 ,  H04L12/4011 ,  H04W8/005 ,  H01L2924/00

摘要： Disclosed herein are systems, apparatuses, and methods for establishing wireless communications among a plurality of wireless-enabled components (WECs), and applications thereof. Such a system includes a plurality of WECs, each configured to transmit and receive over a wireless bus. The wireless bus includes (i) a first channel to identify proximally located WECs and (ii) a second channel to support communications among the proximally located WECs. The plurality of WECs may be located on a single chip, on multiple chips of a single device, or on multiple chips across multiple devices.

摘要翻译： 这里公开的是用于在多个启用无线组件（WEC）之间建立无线通信的系统，装置和方法及其应用。 这样的系统包括多个WEC，每个WEC被配置为通过无线总线进行发送和接收。 无线总线包括（i）识别近端位置的WEC的第一信道和（ii）支持在近端位置的WEC之间的通信的第二信道。 多个WEC可以位于单个芯片上，在单个设备的多个芯片上，或者位于跨多个设备的多个芯片上。

公开(公告)号：US08884417B2

公开(公告)日：2014-11-11

申请号：US13248745

申请日：2011-09-29

申请人： Jesus Alfonso Castaneda ,  Arya Reza Behzad ,  Ahmadreza Rofougaran ,  Sam Ziqun Zhao ,  Michael Boers

发明人： Jesus Alfonso Castaneda ,  Arya Reza Behzad ,  Ahmadreza Rofougaran ,  Sam Ziqun Zhao ,  Michael Boers

IPC分类号： H01L23/02 ,  G02B6/43 ,  H01L25/065 ,  H01L25/10 ,  H01L23/522 ,  H01L23/66 ,  G02B6/12

摘要： Methods and apparatus are disclosed for wirelessly communicating among integrated circuits and/or functional modules within the integrated circuits. A semiconductor device fabrication operation uses a predetermined sequence of photographic and/or chemical processing steps to form one or more functional modules onto a semiconductor substrate. The functional modules are coupled to an integrated waveguide that is formed onto the semiconductor substrate and/or attached thereto to form an integrated circuit. The functional modules communicate with each other as well as to other integrated circuits using a multiple access transmission scheme via the integrated waveguide. One or more integrated circuits may be coupled to an integrated circuit carrier to form Multichip Module. The Multichip Module may be coupled to a semiconductor package to form a packaged integrated circuit.

公开(公告)号：US08866502B2

公开(公告)日：2014-10-21

申请号：US13029653

申请日：2011-02-17

申请人： Arya Reza Behzad ,  Ahmadreza Rofougaran ,  Sam Ziqun Zhao ,  Jesus Alfonso Castaneda ,  Michael Boers

发明人： Arya Reza Behzad ,  Ahmadreza Rofougaran ,  Sam Ziqun Zhao ,  Jesus Alfonso Castaneda ,  Michael Boers

IPC分类号： G01R31/36 ,  G01R31/319 ,  G01R31/302 ,  G01R31/311 ,  G01R31/28

CPC分类号： G01R31/319 ,  G01R31/2834 ,  G01R31/3025 ,  G01R31/311 ,  H01L23/544 ,  H01L2223/54433 ,  H01L2924/0002 ,  Y10T29/49121 ,  H01L2924/00

摘要： Methods and apparatus are disclosed to simultaneously, wirelessly test semiconductor components formed on a semiconductor wafer. The semiconductor components transmit respective outcomes of a self-contained testing operation to wireless automatic test equipment via a common communication channel. Multiple receiving antennas observe the outcomes from multiple directions in three dimensional space. The wireless automatic test equipment determines whether one or more of the semiconductor components operate as expected and, optionally, may use properties of the three dimensional space to determine a location of one or more of the semiconductor components. The wireless testing equipment may additionally determine performance of the semiconductor components by detecting infrared energy emitted, transmitted, and/or reflected by the semiconductor wafer before, during, and/or after a self-contained testing operation.

摘要翻译： 公开了同时无线地测试形成在半导体晶片上的半导体元件的方法和装置。 半导体部件通过公共通信信道将各自的测试结果传送到无线自动测试设备。 多个接收天线在三维空间中观察多个方向的结果。 无线自动测试设备确定一个或多个半导体组件是否按预期运行，并且可选地，可以使用三维空间的属性来确定一个或多个半导体组件的位置。 无线测试设备还可以通过检测在独立测试操作之前，期间和/或之后由半导体晶片发射，传输和/或反射的红外能量来确定半导体组件的性能。

公开(公告)号：US08508029B2

公开(公告)日：2013-08-13

申请号：US13248673

申请日：2011-09-29

申请人： Michael Boers ,  Arya Reza Behzad ,  Ahmadreza Rofougaran ,  Sam Ziqun Zhao ,  Jesus Alfonso Castaneda

发明人： Michael Boers ,  Arya Reza Behzad ,  Ahmadreza Rofougaran ,  Sam Ziqun Zhao ,  Jesus Alfonso Castaneda

IPC分类号： H01L23/02

CPC分类号： H01L23/49811 ,  H01L23/5222 ,  H01L23/66 ,  H01L24/16 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/0657 ,  H01L2223/6627 ,  H01L2223/6677 ,  H01L2223/6683 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/05647 ,  H01L2224/131 ,  H01L2224/14181 ,  H01L2224/16225 ,  H01L2224/17181 ,  H01L2224/81815 ,  H01L2225/06531 ,  H01L2225/06572 ,  H01L2924/00014 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01P1/182 ,  H01P3/023 ,  H01P3/12 ,  H01P3/121 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/05552

摘要： Methods and apparatus are disclosed for wirelessly communicating among integrated circuits and/or functional modules within the integrated circuits. A semiconductor device fabrication operation uses a predetermined sequence of photographic and/or chemical processing steps to form one or more functional modules onto a semiconductor substrate. The functional modules are coupled to an integrated waveguide that is formed onto the semiconductor substrate and/or attached thereto to form an integrated circuit. The functional modules communicate with each other as well as to other integrated circuits using a multiple access transmission scheme via the integrated waveguide. One or more integrated circuits may be coupled to an integrated circuit carrier to form Multichip Module. The Multichip Module may be coupled to a semiconductor package to form a packaged integrated circuit.

摘要翻译： 公开了用于在集成电路内的集成电路和/或功能模块之间进行无线通信的方法和装置。 半导体器件制造操作使用预定的照相和/或化学处理步骤顺序在半导体衬底上形成一个或多个功能模块。 功能模块耦合到形成在半导体衬底上和/或连接到其上以形成集成电路的集成波导。 功能模块通过集成波导使用多址传输方案彼此通信以及其他集成电路。 一个或多个集成电路可以耦合到集成电路载体以形成多芯片模块。 多芯片模块可以耦合到半导体封装以形成封装的集成电路。