摘要:
In accordance with the present invention, it has now been found that glycidyl epoxy resins containing substitution on the epoxide ring can be used with conventional epoxy curing agents and fluxing agents to produce underfill adhesives that are suitable for use with silver-based alloys. Owing to the structural similarity of the new materials to conventional epoxy resins, physical and material properties of the invention formulations are altered little, if at all, relative to products currently in use, and so are highly compatible with existing processes.
摘要:
In accordance with the present invention, it has now been found that glycidyl epoxy resins containing substitution on the epoxide ring can be used with conventional epoxy curing agents and fluxing agents to produce underfill adhesives that are suitable for use with silver-based alloys. Owing to the structural similarity of the new materials to conventional epoxy resins, physical and material properties of the invention formulations are altered little, if at all, relative to products currently in use, and so are highly compatible with existing processes.
摘要:
In accordance with the present invention, there are provided toughening agents which are useful for improving the performance properties of epoxy-based adhesive formulations. For example, epoxidized polysulfides have been found to be useful toughening agents of component level underfill adhesive compositions. Invention materials are liquid rubbers which provide improved fracture toughness while maintaining satisfactory capillary flow properties. Invention materials can be synthesized in neat (solventless) reactions from readily available low-cost raw materials and isolated in high yields. They have linear and branched telechelic structures with terminal epoxide functional groups, and are prepared without substantially increasing the molecular weight of the starting polysulfide materials. Invention materials are compatible with common epoxy formulations and may be used without purification. At low levels of incorporation, they provide adhesives that meet the minimum fracture toughness (Gq>2.0 lb/in) and capillary flow specifications (flow time
摘要:
In accordance with the present invention, there are provided toughening agents which are useful for improving the performance properties of epoxy-based adhesive formulations. For example, epoxidized polybutylacrylates have been found to be useful toughening agents of component level underfill adhesive compositions. Invention materials are generally liquid rubbers which provided improved fracture toughness while maintaining satisfactory capillary flow properties. Invention materials can be synthesized in neat (solventless) reactions from readily available low-cost raw materials and isolated in high yields. They have a branched telechelic structure with terminal epoxide functional groups. The polyacrylate is typically obtained as a mixture of epoxidized polymer, chain extended polyoligomer and unreacted monomer. Invention materials are compatible with common epoxy formulations and may be used without purification. At low levels of incorporation, they provide adhesives that meet the minimum fracture toughness (Gq>2.0 lb/in) and capillary flow specifications (flow time
摘要:
A latent fluxing agent comprising a material which liberates phenol or a carboxylic acid containing compound when heated above 140° C. The latent fluxing agent may be incorporated into a thermoset resin, which includes an epoxy resin. The uncured epoxy resin, which includes the epoxy resin, the latent fluxing agent and an epoxy curing agent are useful as an underfill composition in a method for applying a chip die, having one or more solder balls, to a substrate. The method is used to produce an integrated circuit chip that includes a chip die having electrical contacts arranged in a predetermined pattern and capable of providing electrical engagement with a carrier substrate.
摘要:
A latent fluxing agent comprising a material which liberates phenol or a carboxylic acid containing compound when heated above 140° C. The latent fluxing agent may be incorporated into a thermoset resin, which includes an epoxy resin. The uncured epoxy resin, which includes the epoxy resin, the latent fluxing agent and an epoxy curing agent are useful as an underfill composition in a method for applying a chip die, having one or more solder balls, to a substrate. The method is used to produce an integrated circuit chip that includes a chip die having electrical contacts arranged in a predetermined pattern and capable of providing electrical engagement with a carrier substrate.
摘要:
The present invention concerns improved polymerizable anaerobic compositions which contain (meth)acrylic ester monomers, peroxy polymerization initiators, saccharin a saccharin derivative or a related sulfimide derivative and an activator containing a ferrocene moiety.
摘要:
The present invention is directed to reaction products prepared from at least one Michael addition donor material including two or more active methylene hydrogens; and at least one material capable of reacting with a Michael addition donor, the material having one Michael addition acceptor and at least one functional group selected from the group consisting of hydroxy, hydroxyalkyl, vinyl ether, amino, aminoalkyl, carboxy, carboxyalkyl, cyano, and cyanoalkyl groups; or reaction products prepared from (a) at least one Michael addition donor material comprising at least one Michael Addition donor group selected from the group consisting of cyano functional groups and phosphono functional groups; and (b) at least one material capable of reacting with the at least one Michael addition donor group, the material having at least one Michael addition acceptor, wherein the above reaction products are capable of forming free radicals upon exposure to actinic radiation; as well as compositions, and processes for making and using the same.
摘要:
The present invention is directed to reaction products prepared from at least one Michael addition donor material including two or more active methylene hydrogens; and at least one material capable of reacting with a Michael addition donor, the material having one Michael addition acceptor and at least one functional group selected from the group consisting of hydroxy, hydroxyalkyl, vinyl ether, amino, aminoalkyl, carboxy, carboxyalkyl, cyano, and cyanoalkyl groups; or reaction products prepared from (a) at least one Michael addition donor material comprising at least one Michael Addition donor group selected from the group consisting of cyano functional groups and phosphono functional groups; and (b) at least one material capable of reacting with the at least one Michael addition donor group, the material having at least one Michael addition acceptor, wherein the above reaction products are capable of forming free radicals upon exposure to actinic radiation; as well as compositions, and processes for making and using the same.
摘要:
The present invention concerns improved polymerizable anaerobic compositions which contain (meth)acrylic ester monomers, peroxy polymerization initiators, saccharin a saccharin derivative or a related sulfimide derivative and an activator containing a ferrocene moiety.