-
公开(公告)号：US07009009B1
公开(公告)日：2006-03-07
申请号：US10656120
申请日：2003-09-08
CPC分类号： H01L21/563 , H01L23/293 , H01L23/49816 , H01L24/29 , H01L24/81 , H01L2224/16225 , H01L2224/29 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/29386 , H01L2224/29486 , H01L2224/73104 , H01L2224/73203 , H01L2224/73204 , H01L2224/81024 , H01L2224/81191 , H01L2224/8121 , H01L2224/81815 , H01L2224/83101 , H01L2224/83191 , H01L2224/83192 , H01L2224/83855 , H01L2224/83856 , H01L2924/00011 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01027 , H01L2924/01032 , H01L2924/01033 , H01L2924/01044 , H01L2924/01049 , H01L2924/0105 , H01L2924/01075 , H01L2924/01077 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/0665 , H01L2924/09701 , H01L2924/12044 , H01L2924/14 , H01L2924/19042 , H01L2924/20106 , H01L2924/351 , H01L2924/00 , H01L2924/05442 , H01L2924/05432 , H01L2924/05042 , H01L2924/05032 , H01L2924/0503 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/0401
摘要： A latent fluxing agent comprising a material which liberates phenol or a carboxylic acid containing compound when heated above 140° C. The latent fluxing agent may be incorporated into a thermoset resin, which includes an epoxy resin. The uncured epoxy resin, which includes the epoxy resin, the latent fluxing agent and an epoxy curing agent are useful as an underfill composition in a method for applying a chip die, having one or more solder balls, to a substrate. The method is used to produce an integrated circuit chip that includes a chip die having electrical contacts arranged in a predetermined pattern and capable of providing electrical engagement with a carrier substrate.
摘要翻译： 包含在加热至140℃以上时释放苯酚或含羧酸化合物的材料的潜在助熔剂。潜溶剂可以并入包含环氧树脂的热固性树脂中。 包含环氧树脂，潜溶助熔剂和环氧固化剂的未固化环氧树脂在将具有一个或多个焊球的芯片裸片施加到基板的方法中可用作底部填充组合物。 该方法用于制造集成电路芯片，其包括具有以预定图案布置并且能够与载体基板电连接的电触头的芯片模具。
-
公开(公告)号：US06667194B1
公开(公告)日：2003-12-23
申请号：US10082278
申请日：2002-02-26
IPC分类号： C08L6302
CPC分类号： C07D303/22 , C07D303/24 , C07D303/44 , C08G59/12 , C08G59/42 , C08G59/5026 , C09J163/00 , H01L2224/27334 , H01L2224/29 , H01L2224/2919 , H01L2224/2929 , H01L2224/29386 , H01L2224/29486 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01322 , H01L2924/0665 , Y10T428/12528 , H01L2924/00 , H01L2924/00014 , H01L2924/05442 , H01L2924/05432 , H01L2924/05042 , H01L2924/05032 , H01L2924/0503 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
摘要： A latent fluxing agent comprising a material which liberates phenol or a carboxylic acid containing compound when heated above 140° C. The latent fluxing agent may be incorporated into a thermoset resin, which includes an epoxy resin. The uncured epoxy resin, which includes the epoxy resin, the latent fluxing agent and an epoxy curing agent are useful as an underfill composition in a method for applying a chip die, having one or more solder balls, to a substrate. The method is used to produce an integrated circuit chip that includes a chip die having electrical contacts arranged in a predetermined pattern and capable of providing electrical engagement with a carrier substrate.
摘要翻译： 包含在加热至140℃以上时释放苯酚或含羧酸化合物的材料的潜在助熔剂。潜溶剂可以并入包含环氧树脂的热固性树脂中。 包含环氧树脂，潜溶助熔剂和环氧固化剂的未固化环氧树脂在将具有一个或多个焊球的芯片裸片施加到基板的方法中可用作底部填充组合物。 该方法用于制造集成电路芯片，其包括具有以预定图案布置并且能够与载体基板电连接的电触头的芯片模具。
-
3.发明授权Adhesive of substituted oxirane or oxetane compound with silver-based, lead-free solder 有权取代环氧乙烷或氧杂环丁烷化合物与银基，无铅焊料的粘合剂公开(公告)号：US07671114B2
公开(公告)日：2010-03-02
申请号：US12176729
申请日：2008-07-21
CPC分类号： H01L21/563 , C08G59/1455 , C08G59/1494 , C08K5/5435 , C09J163/00 , H01L23/293 , H01L2224/73203 , H01L2924/01004 , H01L2924/01077 , H01L2924/01079
摘要： In accordance with the present invention, it has now been found that glycidyl epoxy resins containing substitution on the epoxide ring can be used with conventional epoxy curing agents and fluxing agents to produce underfill adhesives that are suitable for use with silver-based alloys. Owing to the structural similarity of the new materials to conventional epoxy resins, physical and material properties of the invention formulations are altered little, if at all, relative to products currently in use, and so are highly compatible with existing processes.
摘要翻译： 根据本发明，已经发现在环氧化物环上含有取代基的缩水甘油基环氧树脂可以与常规的环氧固化剂和助熔剂一起使用，以生产适用于银基合金的底部填充粘合剂。 由于新材料与常规环氧树脂的结构相似性，本发明制剂的物理和材料性能相对于目前使用的产品而言几乎没有改变，因此与现有方法高度兼容。
-
公开(公告)号：US20090018239A1
公开(公告)日：2009-01-15
申请号：US12176729
申请日：2008-07-21
IPC分类号： C08K5/00
CPC分类号： H01L21/563 , C08G59/1455 , C08G59/1494 , C08K5/5435 , C09J163/00 , H01L23/293 , H01L2224/73203 , H01L2924/01004 , H01L2924/01077 , H01L2924/01079
摘要： In accordance with the present invention, it has now been found that glycidyl epoxy resins containing substitution on the epoxide ring can be used with conventional epoxy curing agents and fluxing agents to produce underfill adhesives that are suitable for use with silver-based alloys. Owing to the structural similarity of the new materials to conventional epoxy resins, physical and material properties of the invention formulations are altered little, if at all, relative to products currently in use, and so are highly compatible with existing processes.
摘要翻译： 根据本发明，已经发现在环氧化物环上含有取代基的缩水甘油基环氧树脂可以与常规的环氧固化剂和助熔剂一起使用，以生产适用于银基合金的底部填充粘合剂。 由于新材料与常规环氧树脂的结构相似性，本发明制剂的物理和材料性能相对于目前使用的产品而言几乎没有改变，因此与现有方法高度兼容。
-
公开(公告)号：US08519023B2
公开(公告)日：2013-08-27
申请号：US13187299
申请日：2011-07-20
IPC分类号： C09J4/00
摘要： The present invention concerns improved polymerizable anaerobic compositions which contain (meth)acrylic ester monomers, peroxy polymerization initiators, saccharin a saccharin derivative or a related sulfimide derivative and an activator containing a ferrocene moiety.
摘要翻译： 本发明涉及含有（甲基）丙烯酸酯单体，过氧化聚合引发剂，糖精，糖精衍生物或相关的硫酰亚胺衍生物和含有二茂铁部分的活化剂的改进的可聚合厌氧组合物。
-
6.发明授权Photosensitive compounds, photopolymerizable compositions including the same, and methods of making and using the same 有权感光性化合物，包含其的光聚合性组合物及其制备和使用方法公开(公告)号：US07705064B2
公开(公告)日：2010-04-27
申请号：US11781317
申请日：2007-07-23
申请人： Anthony F. Jacobine , John G. Woods , Joel D. Schall , Steven T. Nakos , Andrew D. Messana , David M. Glaser
发明人： Anthony F. Jacobine , John G. Woods , Joel D. Schall , Steven T. Nakos , Andrew D. Messana , David M. Glaser
IPC分类号： C08F2/50 , C08F222/10 , C07C69/587 , C08G16/00
CPC分类号： C08F2/50 , C07C67/347 , C07C255/22 , C08G18/10 , C08G18/672 , C07C69/716 , C08G18/3206 , C08G18/3838 , C08G18/42
摘要： The present invention is directed to reaction products prepared from at least one Michael addition donor material including two or more active methylene hydrogens; and at least one material capable of reacting with a Michael addition donor, the material having one Michael addition acceptor and at least one functional group selected from the group consisting of hydroxy, hydroxyalkyl, vinyl ether, amino, aminoalkyl, carboxy, carboxyalkyl, cyano, and cyanoalkyl groups; or reaction products prepared from (a) at least one Michael addition donor material comprising at least one Michael Addition donor group selected from the group consisting of cyano functional groups and phosphono functional groups; and (b) at least one material capable of reacting with the at least one Michael addition donor group, the material having at least one Michael addition acceptor, wherein the above reaction products are capable of forming free radicals upon exposure to actinic radiation; as well as compositions, and processes for making and using the same.
摘要翻译： 本发明涉及由至少一种包含两种或更多种活性亚甲基氢的迈克尔加成供体材料制备的反应产物; 和至少一种能够与迈克尔加成供体反应的材料，所述材料具有一个迈克尔加成受体和至少一种选自羟基，羟基烷基，乙烯基醚，氨基，氨基烷基，羧基，羧基烷基，氰基， 和氰基烷基; 或由（a）包含至少一种选自氰基官能团和膦酰基官能团的迈克尔加成供体基团的至少一种迈克尔加成供体材料制备的反应产物; 和（b）至少一种能够与至少一种迈克尔加成供体基团反应的材料，该材料具有至少一种迈克尔加成受体，其中上述反应产物能够在暴露于光化辐射下形成自由基; 以及组合物和制备和使用它们的方法。
-
7.发明申请Photosensitive Compounds, Photopolymerizable Compositions Including the Same, and Methods of Making and Using the Same 有权光敏化合物，包括其的可光聚合组合物及其制备和使用方法公开(公告)号：US20090030106A1
公开(公告)日：2009-01-29
申请号：US11781317
申请日：2007-07-23
申请人： Anthony F. Jacobine , John G. Woods , Joel D. Schall , Steven T. Nakos , Andrew D. Messana , David M. Glaser
发明人： Anthony F. Jacobine , John G. Woods , Joel D. Schall , Steven T. Nakos , Andrew D. Messana , David M. Glaser
CPC分类号： C08F2/50 , C07C67/347 , C07C255/22 , C08G18/10 , C08G18/672 , C07C69/716 , C08G18/3206 , C08G18/3838 , C08G18/42
摘要： The present invention is directed to reaction products prepared from at least one Michael addition donor material including two or more active methylene hydrogens; and at least one material capable of reacting with a Michael addition donor, the material having one Michael addition acceptor and at least one functional group selected from the group consisting of hydroxy, hydroxyalkyl, vinyl ether, amino, aminoalkyl, carboxy, carboxyalkyl, cyano, and cyanoalkyl groups; or reaction products prepared from (a) at least one Michael addition donor material comprising at least one Michael Addition donor group selected from the group consisting of cyano functional groups and phosphono functional groups; and (b) at least one material capable of reacting with the at least one Michael addition donor group, the material having at least one Michael addition acceptor, wherein the above reaction products are capable of forming free radicals upon exposure to actinic radiation; as well as compositions, and processes for making and using the same.
摘要翻译： 本发明涉及由至少一种包含两种或更多种活性亚甲基氢的迈克尔加成供体材料制备的反应产物; 和至少一种能够与迈克尔加成供体反应的材料，所述材料具有一个迈克尔加成受体和至少一种选自羟基，羟基烷基，乙烯基醚，氨基，氨基烷基，羧基，羧基烷基，氰基， 和氰基烷基; 或由（a）包含至少一种选自氰基官能团和膦酰基官能团的迈克尔加成供体基团的至少一种迈克尔加成供体材料制备的反应产物; 和（b）至少一种能够与至少一种迈克尔加成供体基团反应的材料，该材料具有至少一种迈克尔加成受体，其中上述反应产物能够在暴露于光化辐射下形成自由基; 以及组合物和制备和使用它们的方法。
-
公开(公告)号：US20110272095A1
公开(公告)日：2011-11-10
申请号：US13187299
申请日：2011-07-20
IPC分类号： B32B37/12 , C09J133/08
摘要： The present invention concerns improved polymerizable anaerobic compositions which contain (meth)acrylic ester monomers, peroxy polymerization initiators, saccharin a saccharin derivative or a related sulfimide derivative and an activator containing a ferrocene moiety.
摘要翻译： 本发明涉及含有（甲基）丙烯酸酯单体，过氧化聚合引发剂，糖精，糖精衍生物或相关的硫酰亚胺衍生物和含有二茂铁部分的活化剂的改进的可聚合厌氧组合物。
-
公开(公告)号：US07193016B1
公开(公告)日：2007-03-20
申请号：US10692935
申请日：2003-10-27
申请人： John G. Woods , Mark M. Konarski , Kyra M. Kozak , Yuhshi Luh
发明人： John G. Woods , Mark M. Konarski , Kyra M. Kozak , Yuhshi Luh
CPC分类号： C09J163/00 , C08F8/14 , C08F2810/40 , C08F20/16
摘要： In accordance with the present invention, there are provided toughening agents which are useful for improving the performance properties of epoxy-based adhesive formulations. For example, epoxidized polybutylacrylates have been found to be useful toughening agents of component level underfill adhesive compositions. Invention materials are generally liquid rubbers which provided improved fracture toughness while maintaining satisfactory capillary flow properties. Invention materials can be synthesized in neat (solventless) reactions from readily available low-cost raw materials and isolated in high yields. They have a branched telechelic structure with terminal epoxide functional groups. The polyacrylate is typically obtained as a mixture of epoxidized polymer, chain extended polyoligomer and unreacted monomer. Invention materials are compatible with common epoxy formulations and may be used without purification. At low levels of incorporation, they provide adhesives that meet the minimum fracture toughness (Gq>2.0 lb/in) and capillary flow specifications (flow time
摘要翻译： 根据本发明，提供了可用于改善环氧基粘合剂制剂的性能的增韧剂。 例如，已经发现环氧化的聚丁基丙烯酸酯是组分级底部填充粘合剂组合物的有用的增韧剂。 发明材料通常是液体橡胶，其提供改善的断裂韧性同时保持令人满意的毛细管流动性能 本发明材料可以从易于获得的低成本原料的纯（无溶剂）反应中合成并以高收率分离。 它们具有末端环氧官能团的分子遥爪结构。 聚丙烯酸酯通常以环氧化聚合物，链延长多元寡聚物和未反应单体的混合物形式获得。 本发明材料与普通的环氧配方相容，可以不经纯化地使用。 在低掺量下，它们提供了许多商业底层填充应用的粘合剂，其满足最小断裂韧性（Gq> 2.0lb / in）和毛细管流动规格（流动时间<180秒）。 根据本发明的另一个实施方案，提供了包含本发明化合物的粘合剂组合物及其使用方法。 在本发明的另外的实施方案中，提供了制备本发明增韧剂的方法，用于将装置粘附到基底上的方法以及包括附着到第二制品上的第一制品的组件。
-
10.发明授权Polysulfide-based toughening agents, compositions containing same and methods for the use thereof 有权聚硫醚系增韧剂，含有它们的组合物及其使用方法公开(公告)号：US07087304B1
公开(公告)日：2006-08-08
申请号：US10367759
申请日：2003-02-19
申请人： John G. Woods , Yuhshi Luh , Mark M. Konarski
发明人： John G. Woods , Yuhshi Luh , Mark M. Konarski
IPC分类号： B32B27/38 , B32B7/12 , C08L63/00 , C09J163/00 , H01L21/56
CPC分类号： C08G59/302 , C08L63/00 , H01L23/293 , H01L2924/0002 , Y10T428/31511 , Y10T428/31515 , C08L81/00 , H01L2924/00
摘要： In accordance with the present invention, there are provided toughening agents which are useful for improving the performance properties of epoxy-based adhesive formulations. For example, epoxidized polysulfides have been found to be useful toughening agents of component level underfill adhesive compositions. Invention materials are liquid rubbers which provide improved fracture toughness while maintaining satisfactory capillary flow properties. Invention materials can be synthesized in neat (solventless) reactions from readily available low-cost raw materials and isolated in high yields. They have linear and branched telechelic structures with terminal epoxide functional groups, and are prepared without substantially increasing the molecular weight of the starting polysulfide materials. Invention materials are compatible with common epoxy formulations and may be used without purification. At low levels of incorporation, they provide adhesives that meet the minimum fracture toughness (Gq>2.0 lb/in) and capillary flow specifications (flow time
摘要翻译： 根据本发明，提供了可用于改善环氧基粘合剂制剂的性能的增韧剂。 例如，已经发现环氧化多硫化物是组分级底部填充粘合剂组合物的有用的增韧剂。 发明材料是提供改善的断裂韧性同时保持令人满意的毛细管流动特性的液体橡胶。 本发明材料可以从易于获得的低成本原料的纯（无溶剂）反应中合成并以高收率分离。 它们具有带末端环氧官能团的直链和支链遥爪结构，并且在不显着增加起始多硫化物材料的分子量的情况下制备。 本发明材料与普通的环氧配方相容，可以不经纯化地使用。 在低掺量下，它们提供了许多商业底层填充应用的粘合剂，其满足最小断裂韧性（Gq> 2.0lb / in）和毛细管流动规格（流动时间<180秒）。 根据本发明的另一个实施方案，提供了包含本发明化合物的粘合剂组合物及其使用方法。 在本发明的另外的实施方案中，提供了制备本发明增韧剂的方法，用于将装置粘附到基底上的方法以及包括附着到第二制品上的第一制品的组件。
-
-
-
-
-
-
-
-
-
搜索结果
57 条记录 (耗时 0.175 秒)
