摘要:
The present invention relates to compositions of first agents of a permanent hair waving agent and a hair straightener for self-diagnosis with a reducing catalyst, respectively, and their manufacturing methods thereof. More specifically, the present invention relates to compositions of first agents a permanent hair waving agent and a hair straightener for self-diagnosis with a reducing catalyst, respectively, and their manufacturing methods thereof, wherein each of the first agents is a reducing agent prepared in two different solutions of A and B and mixed in a predetermined ratio immediately prior to use. Upon mixing, the first agent gives rise to a peculiar color thus enabling to identify both active ingredients and the properties of the solutions being used well in advance of hair styling performance -+y assisting proper selection of a permanent hair waving agent and a hair ,˜ner most suitable for each hair kind thus securing safe performance of hair a also preventing hair damage.
摘要:
Provided are a semiconductor device and a method of fabricating the semiconductor device. The semiconductor device using a DMOS device includes: a semiconductor substrate, in which a first conductive type well is formed; a first conductive type gate electrode formed on the semiconductor substrate with a gate insulating layer intervening between the gate electrode and the semiconductor substrate; a second conductive type body electrode formed on the semiconductor substrate and separated from the gate electrode; a first conductive type drain electrode formed on the semiconductor substrate and separated from the gate electrode and the body electrode; a second conductive type first body region formed in the well under the body electrode; a second conductive type second body region extending from the first body region to the gate insulating layer and formed in the well; a first conductive type source region formed in the second body region and extending from the first body region to the gate insulating layer; and a first conductive type source electrode extending from the source region to surround the gate electrode on the semiconductor substrate with an insulating layer intervening between the source electrode and gate electrode.
摘要:
A driving method and apparatus for a light source element of an optical pickup for reading and writing data from and to an optical data includes generating an error signal when a tracking error signal is higher than a first level or is lower than a second level and, if the error signal is active, supplying the light source element with a driving signal suitable for data read operations independent of whether the user selects read mode or write mode. As a result, when there is a tracking error the power of the device signal corresponds to that normally presented during a read mode, and this power is insufficient to write data onto the disc. Thus, data is not written over other desired data when an abnormal tracking error occurs.
摘要:
A method for manufacturing a capacitor of a semiconductor memory device. A conductive layer is formed on the semiconductor substrate and a photoresist pattern is formed on the conductive layer. The conductive layer is etched, using the photoresist pattern as a mask to form a first step-portion in the conductive layer. A first spacer is formed on a sidewall of the photoresist pattern, which may be formed by flowing the photoresist pattern. The conductive layer is etched, using the first spacer as a mask, to form a second step-portion in the conductive layer. The photoresist pattern and the first spacer is removed. A first material layer is formed on the entire surface of the resultant structure and etched to form a second spacer on the sidewalls of the first and second step-portions. The conductive layer is etched, using the second spacer as a mask, to form a storage electrode of a capacitor. Cell capacitance may be increased by a simple process, and the heat cycle may be reduced.
摘要:
A cyclic A/D converter which can reduce the number of reference voltages for D/A conversion is provided. The cyclic A/D converter (11) comprises a gain stage (15), an A/D converter circuit (17), a logic circuit (19), and a D/A converter circuit (21). In an operational action of the gain stage (15), an operational value (VOP) is generated by the use of an operational amplifier circuit (23) and capacitors (25, 27, 29). The gain stage (15) operates as receiving three kinds of voltage signal from the D/A converter circuit (21) by the switching of two kinds of voltage signal (VDA1, VDA2) to be applied to the capacitors (25, 27) in a switching circuit (31). That is, the D/A converter circuit (21) provides a voltage signal (VRH) to the capacitors (25, 27), in response to a value (D=2) of a digital signal (B0, B1), provides voltage signals (VRH, VRL) to the capacitors (25, 27), respectively, in response to a value (D=1) of the signal (B0, B1), and provides the voltage signal (VRL) to the capacitors (25, 27), in response to a value (D=0) of the signal (B0, B1).
摘要:
Provided are a semiconductor device and a method of fabricating the semiconductor device. The semiconductor device using a DMOS device includes: a semiconductor substrate, in which a first conductive type well is formed; a first conductive type gate electrode formed on the semiconductor substrate with a gate insulating layer intervening between the gate electrode and the semiconductor substrate; a second conductive type body electrode formed on the semiconductor substrate and separated from the gate electrode; a first conductive type drain electrode formed on the semiconductor substrate and separated from the gate electrode and the body electrode; a second conductive type first body region formed in the well under the body electrode; a second conductive type second body region extending from the first body region to the gate insulating layer and formed in the well; a first conductive type source region formed in the second body region and extending from the first body region to the gate insulating layer; and a first conductive type source electrode extending from the source region to surround the gate electrode on the semiconductor substrate with an insulating layer intervening between the source electrode and gate electrode.
摘要:
A wiring layer of a semiconductor device having a novel contact structure is disclosed. The semiconductor device includes a semiconductor substrate, an insulating layer having an opening (contact hole or via) and a first conductive layer formed on the insulating layer which completely fills the opening. The first conductive layer does not produce any Si precipitates in a subsequent heat-treating step for filling the opening with the first conductive layer material. The semiconductor device may further include a second conductive layer having a planarized surface on the first conductive layer. This improves subsequent photolithography. An anti-reflective layer may be formed on the second conductive layer for preventing an unwanted reflection during a photo lithography process. The semiconductor device preferably includes a diffusion barrier layer under the first conductive layer and on the semiconductor substrate, on the insulating layer, and on the inner surface of the opening which prevents a reaction between the first conductive layer and the semiconductor substrate or the insulating layer. A method for forming the wiring layer is also disclosed. Providing a semiconductor device with the wiring layer reduces the leakage current by preventing an Al spiking. Since the first conductive layer undergoes a heat-treatment step at a temperature below the melting point, while flowing into the opening and completely filling it with the first conductive layer material, no void is formed in the opening. Good semiconductor device reliability is ensured in spite of the contact hole being less than 1 .mu.m in size and having an aspect ratio greater than 1.0.
摘要:
A cyclic A/D converter which can reduce the number of reference voltages for D/A conversion is provided. The cyclic A/D converter (11) comprises a gain stage (15), an A/D converter circuit (17), a logic circuit (19), and a D/A converter circuit (21). In an operational action of the gain stage (15), an operational value (VOP) is generated by the use of an operational amplifier circuit (23) and capacitors (25, 27, 29). The gain stage (15) operates as receiving three kinds of voltage signal from the D/A converter circuit (21) by the switching of two kinds of voltage signal (VDA1, VDA2) to be applied to the capacitors (25, 27) in a switching circuit (31). That is, the D/A converter circuit (21) provides a voltage signal (VRH) to the capacitors (25, 27), in response to a value (D=2) of a digital signal (B0, B1), provides voltage signals (VRH, VRL) to the capacitors (25, 27), respectively, in response to a value (D=1) of the signal (B0, B1), and provides the voltage signal (VRL) to the capacitors (25, 27), in response to a value (D=0) of the signal (B0, B1).
摘要:
Provided are a semiconductor device including a source/drain and a gate formed using a doped polysilicon process, and a method of fabricating the semiconductor device. The method comprises: forming a gate insulating layer on a part of an active region on a first conductivity type epitaxial layer; forming a conductive layer on the epitaxial layer; implanting high concentration impurities of a second conductivity type a first portion of the conductive layer on the gate insulating layer and second portions of the conductive layer on both sides of the first insulating layer; patterning the conductive layer; forming a second insulating layer on the epitaxial layer and high concentration impurity regions of the second conductivity type below the second conductive pattern; and implanting low-concentration impurities of the second conductivity type into the epitaxial layer between a gate structure and the high concentration impurity regions.
摘要:
A backlighting device for producing a uniform luminance throughout a screen for use in LCD devices includes a semicylindrical concave surface on a light-transmitting top face of a light-guiding plate, lamps installed near two opposed edges of the light-guiding plate, a light-diffusing plate on the top side of the light-guiding plate, a light-reflecting plate attached to the bottom face of the light-guiding plate, and reflecting film patterns between the light-guiding plate and the reflecting plate. The present invention provides for a simpler manufacture of the backlighting devices producing a high and uniform luminance.