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    Flexible circuitry with heat and pressure spreading layers
    1.
    发明授权
    Flexible circuitry with heat and pressure spreading layers 有权
    具有热和压力扩展层的柔性电路

    公开(公告)号：US08946561B2

    公开(公告)日：2015-02-03

    申请号：US13353203

    申请日：2012-01-18

    申请人： Joshua G. Wurzel ,  Casey J. Feinstein

    发明人： Joshua G. Wurzel ,  Casey J. Feinstein

    IPC分类号： H05K1/00 ,  H05K3/36

    CPC分类号： H05K1/02 ,  H05K3/361 ,  H05K2201/015 ,  H05K2201/0162 ,  H05K2201/2009 ,  Y10T29/49126

    摘要： A flexible printed circuit may be provided with an integrated heat and pressure spreading layer. The heat and pressure spreading layer may be configured to uniformly spread heat and pressure from a bonding tool across a portion of the flexible printed circuit during bonding of the flexible printed circuit to additional circuitry. During manufacturing of the flexible printed circuit, a sheet of heat and pressure spreading material may be attached to a sheet of flexible printed circuitry and the heat and pressure spreading material and the sheet of flexible printed circuitry may be die cut to form multiple flexible printed circuits each with a heat and pressure spreading layer. An electronic device may be provided with a flexible printed circuit with a heat and pressure spreading layer coupled to a component such as a display.

    摘要翻译： 柔性印刷电路可以设置有集成的热和压扩散层。 热和压扩散层可以被配置为在将柔性印刷电路连接到附加电路的过程中，均匀地将粘合工具的热量和压力传播到柔性印刷电路的一部分上。 在柔性印刷电路的制造期间，一片热和压力扩展材料可以附接到柔性印刷电路板上，并且热和压力扩展材料和柔性印刷电路板可以被模切以形成多个柔性印刷电路 每个具有热和压力扩散层。 电子设备可以设置有柔性印刷电路，其具有耦合到诸如显示器的部件的热和压力扩展层。

    Flexible Circuitry with Heat and Pressure Spreading Layers
    2.
    发明申请
    Flexible Circuitry with Heat and Pressure Spreading Layers 有权
    具有热和压力扩展层的灵活电路

    公开(公告)号：US20130180764A1

    公开(公告)日：2013-07-18

    申请号：US13353203

    申请日：2012-01-18

    申请人： Joshua G. Wurzel ,  Casey J. Feinstein

    发明人： Joshua G. Wurzel ,  Casey J. Feinstein

    IPC分类号： H05K1/00 ,  H05K3/36

    CPC分类号： H05K1/02 ,  H05K3/361 ,  H05K2201/015 ,  H05K2201/0162 ,  H05K2201/2009 ,  Y10T29/49126

    摘要： A flexible printed circuit may be provided with an integrated heat and pressure spreading layer. The heat and pressure spreading layer may be configured to uniformly spread heat and pressure from a bonding tool across a portion of the flexible printed circuit during bonding of the flexible printed circuit to additional circuitry. During manufacturing of the flexible printed circuit, a sheet of heat and pressure spreading material may be attached to a sheet of flexible printed circuitry and the heat and pressure spreading material and the sheet of flexible printed circuitry may be die cut to form multiple flexible printed circuits each with a heat and pressure spreading layer. An electronic device may be provided with a flexible printed circuit with a heat and pressure spreading layer coupled to a component such as a display.

    摘要翻译： 柔性印刷电路可以设置有集成的热和压扩散层。 热和压扩散层可以被配置为在将柔性印刷电路连接到附加电路的过程中，均匀地将粘合工具的热量和压力传播到柔性印刷电路的一部分上。 在柔性印刷电路的制造期间，一片热和压力扩展材料可以附接到柔性印刷电路板上，并且热和压力扩展材料和柔性印刷电路板可以被模切以形成多个柔性印刷电路 每个具有热和压力扩散层。 电子设备可以设置有柔性印刷电路，其具有耦合到诸如显示器的部件的热和压力扩展层。

    Methods For Assembling Electronic Devices Using Embedded Light Guide Structures
    3.
    发明申请
    Methods For Assembling Electronic Devices Using Embedded Light Guide Structures 有权
    使用嵌入式光导体结构组装电子设备的方法

    公开(公告)号：US20130215638A1

    公开(公告)日：2013-08-22

    申请号：US13401692

    申请日：2012-02-21

    申请人： Teodor Dabov ,  Casey J. Feinstein ,  David A. Pakula ,  Stephen Brian Lynch

    发明人： Teodor Dabov ,  Casey J. Feinstein ,  David A. Pakula ,  Stephen Brian Lynch

    IPC分类号： F21V8/00 ,  B32B38/10 ,  B32B37/12

    CPC分类号： G02B6/0081 ,  C09J5/00 ,  C09J2203/318 ,  C09J2205/31 ,  G02B6/001 ,  G02B6/0086 ,  G02B6/102

    摘要： Electronic devices may include assemblies of structures such as electronic device assemblies connected using light-cured liquid adhesive such as ultraviolet-light-cured adhesive. Light guide structures may be mounted in the assemblies. During manufacture of an electronic device, ultraviolet light may be injected into a light guide structure to cure the light-cured liquid adhesive. A light guide structure may include portions that prevent escape of ultraviolet light and portions that allow ultraviolet light to escape into the light-cured liquid adhesive. Light guide structures may include masked portions, rigid support members, and one or more openings. Openings in a light guide structure may allow the light-cured liquid adhesive to be injected into an assembly through the openings. An adhesive applicator may be used to apply the adhesive to portions of the assembly. An external light source may be used to inject light that cures the adhesive into the light guide structures.

    摘要翻译： 电子设备可以包括诸如使用诸如紫外光固化粘合剂的光固化液体粘合剂连接的电子设备组件的结构的组件。 导光结构可以安装在组件中。 在制造电子装置时，可以将紫外光注入导光结构中以固化光固化液体粘合剂。 光导结构可以包括防止紫外线逸出的部分和允许紫外线逸出到光固化液体粘合剂中的部分。 导光结构可以包括掩模部分，刚性支撑构件和一个或多个开口。 在导光结构中的开口可允许光固化的液体粘合剂通过开口注入到组件中。 可以使用粘合剂施加器将粘合剂施加到组件的部分。 外部光源可以用于将固化粘合剂的光注入光导结构中。

    Method of making a curved touch panel
    7.
    发明授权
    Method of making a curved touch panel 有权
    制作弯曲触摸屏的方法

    公开(公告)号：US08808483B2

    公开(公告)日：2014-08-19

    申请号：US12940500

    申请日：2010-11-05

    申请人： Kuo-Hua Sung ,  Casey J. Feinstein ,  Silvio Grespan

    发明人： Kuo-Hua Sung ,  Casey J. Feinstein ,  Silvio Grespan

    IPC分类号： B32B37/18

    CPC分类号： B32B38/1866 ,  B32B17/10036 ,  B32B17/10146 ,  B32B17/10174 ,  B32B17/10211 ,  B32B2457/208

    摘要： A method of forming a curved touch surface is disclosed. According to an embodiment, the method includes depositing a touch sensor pattern on a flexible substrate; and curving the flexible substrate, using a chuck surface supporting the flexible substrate, to conform to a shape of a curved cover surface. Then, the curved flexible substrate can be laminated or otherwise adhered to the cover surface. The flexible substrate can be a glass substrate greater than 200 μm in thickness, and can be reduced to a desired thickness below 200 μm after the touch sensor pattern is deposited thereon. The flexible substrate can be curved by supporting the flexible substrate on the chuck surface such that the flexible substrate conforms to a shape of the chuck surface, or forcing the flexible substrate against the cover surface, such that the flexible substrate conforms to the shape of the curved cover surface.

    摘要翻译： 公开了一种形成弯曲的触摸表面的方法。 根据实施例，该方法包括将触摸传感器图案沉积在柔性基板上; 并且使用支撑柔性基板的卡盘表面弯曲柔性基板，以符合弯曲盖表面的形状。 然后，弯曲的柔性基板可以层压或以其他方式粘附到盖表面。 柔性基板可以是厚度大于200μm的玻璃基板，并且可以在其上沉积触摸传感器图案之后将其减小到低于200μm的期望厚度。 柔性基板可以通过将柔性基板支撑在卡盘表面上而弯曲，使得柔性基板符合卡盘表面的形状，或者将柔性基板强制抵靠盖表面，使得柔性基板符合 弯曲的盖面。

    Full perimeter chemical strengthening of substrates
    8.
    发明授权
    Full perimeter chemical strengthening of substrates 有权
    全周边化学强化基材

    公开(公告)号：US09405388B2

    公开(公告)日：2016-08-02

    申请号：US12885376

    申请日：2010-09-17

    申请人： Casey J. Feinstein ,  John Z. Zhong

    发明人： Casey J. Feinstein ,  John Z. Zhong

    IPC分类号： B32B17/06 ,  B32B38/10 ,  G06F3/041 ,  C03C15/00 ,  C03C21/00

    CPC分类号： G06F3/041 ,  C03C15/00 ,  C03C21/002 ,  Y10T156/10 ,  Y10T428/24802

    摘要： Methods and apparatus for protecting the thin films during chemical and/or thermal edge strengthening treatment. In one embodiment, a portion of each individual sheet is laminated. Pairs of sheets are then sealed together such that the thin film sides face inward to form a thin film sandwich. In some embodiments, the sandwich in then immersed in a chemical strengthener. In other embodiments, a localized treatment is applied to the unstrengthened edges.

    摘要翻译： 在化学和/或热边缘强化处理过程中保护薄膜的方法和装置。 在一个实施例中，每个单独片材的一部分被层压。 然后将一对片材密封在一起，使得薄膜侧面向内以形成薄膜夹心物。 在一些实施方案中，将夹层浸入化学加强剂中。 在其它实施例中，对未加强边缘施加局部处理。

    Methods for assembling electronic devices using embedded light guide structures
    9.
    发明授权
    Methods for assembling electronic devices using embedded light guide structures 有权
    使用嵌入式导光结构组装电子设备的方法

    公开(公告)号：US08944659B2

    公开(公告)日：2015-02-03

    申请号：US13401692

    申请日：2012-02-21

    申请人： Teodor Dabov ,  Casey J. Feinstein ,  David A. Pakula ,  Stephen Brian Lynch

    发明人： Teodor Dabov ,  Casey J. Feinstein ,  David A. Pakula ,  Stephen Brian Lynch

    IPC分类号： F21V8/00

    CPC分类号： G02B6/0081 ,  C09J5/00 ,  C09J2203/318 ,  C09J2205/31 ,  G02B6/001 ,  G02B6/0086 ,  G02B6/102

    摘要： Electronic devices may include assemblies of structures such as electronic device assemblies connected using light-cured liquid adhesive such as ultraviolet-light-cured adhesive. Light guide structures may be mounted in the assemblies. During manufacture of an electronic device, ultraviolet light may be injected into a light guide structure to cure the light-cured liquid adhesive. A light guide structure may include portions that prevent escape of ultraviolet light and portions that allow ultraviolet light to escape into the light-cured liquid adhesive. Light guide structures may include masked portions, rigid support members, and one or more openings. Openings in a light guide structure may allow the light-cured liquid adhesive to be injected into an assembly through the openings. An adhesive applicator may be used to apply the adhesive to portions of the assembly. An external light source may be used to inject light that cures the adhesive into the light guide structures.

    摘要翻译： 电子设备可以包括诸如使用诸如紫外光固化粘合剂的光固化液体粘合剂连接的电子设备组件的结构的组件。 导光结构可以安装在组件中。 在制造电子装置时，可以将紫外光注入导光结构中以固化光固化液体粘合剂。 光导结构可以包括防止紫外线逸出的部分和允许紫外线逸出到光固化液体粘合剂中的部分。 导光结构可以包括掩模部分，刚性支撑构件和一个或多个开口。 在导光结构中的开口可允许光固化的液体粘合剂通过开口注入到组件中。 可以使用粘合剂施加器将粘合剂施加到组件的部分。 外部光源可以用于将固化粘合剂的光注入光导结构中。

    Liquid adhesive lamination for precision adhesive control
    10.
    发明授权
    Liquid adhesive lamination for precision adhesive control 有权
    液体粘合剂层压用于精密粘合剂控制

    公开(公告)号：US08608896B2

    公开(公告)日：2013-12-17

    申请号：US13231818

    申请日：2011-09-13

    申请人： Ralf Horstkemper ,  Casey J. Feinstein ,  Kuo-Hua Sung

    发明人： Ralf Horstkemper ,  Casey J. Feinstein ,  Kuo-Hua Sung

    IPC分类号： B05D1/14

    CPC分类号： C09J5/00 ,  B29C65/4855 ,  B29C65/5021 ,  B29C65/5057 ,  B29C65/5064 ,  B29C65/524 ,  B29C66/342 ,  B29C66/3452 ,  B29C66/45 ,  C09J2201/36

    摘要： Methods for liquid adhesive lamination for precision adhesive control are provided. Precision liquid adhesive control can be obtained by first patterning liquid adhesive in a thin pre-coat layer on a substrate. A second adhesive layer can then be patterned on top of the pre-coat layer. When the second substrate is pressed onto the first substrate, the second substrate first comes into contact with the second adhesive layer. The adhesive can then be spread uniformly across the two substrates without forming voids. Alternatively, a single liquid adhesive layer can be formed in a three dimensional gradient pattern.

    摘要翻译： 提供了用于精密粘合剂控制的液体粘合剂层压方法。 通过首先在基材上的薄预涂层中图案化液体粘合剂可以获得精密的液体粘合剂控制。 然后可以在预涂层的顶部上构图第二粘合剂层。 当第二基板被按压到第一基板上时，第二基板首先与第二粘合剂层接触。 然后可以将粘合剂均匀地铺展在两个基材上而不形成空隙。 或者，可以以三维梯度图案形成单个液体粘合剂层。