摘要:
A system and corresponding methods are disclosed for applying a dampening fluid to a reimageable surface of an imaging member in a variable data lithography system, without a form roller. In one embodiment, the system includes subsystems for converting a dampening fluid from a liquid phase to a dispersed fluid phase, and for directing flow of a dispersed fluid comprising the dampening fluid in dispersed fluid phase to the reimageable surface. The dampening fluid reverts to the liquid phase directly on the reimageable surface. In another embodiment a continuous ribbon of dampening fluid may be applied directly to the reimageable surface. This embodiment includes a body structure having a port for delivering dampening fluid in a continuous fluid ribbon directly to the reimageable surface, and a mechanism, associated with the body structure, for stripping an entrained air layer over the reimageable surface when the reimageable surface is in motion.
摘要:
A system and corresponding methods are disclosed for applying a dampening fluid to a reimageable surface of an imaging member in a variable data lithography system, without a form roller. In one embodiment, the system includes subsystems for converting a dampening fluid from a liquid phase to a dispersed fluid phase, and for directing flow of a dispersed fluid comprising the dampening fluid in dispersed fluid phase to the reimageable surface. The dampening fluid reverts to the liquid phase directly on the reimageable surface. In another embodiment a continuous ribbon of dampening fluid may be applied directly to the reimageable surface. This embodiment includes a body structure having a port for delivering dampening fluid in a continuous fluid ribbon directly to the reimageable surface, and a mechanism, associated with the body structure, for stripping an entrained air layer over the reimageable surface when the reimageable surface is in motion.
摘要:
Methods are disclosed for applying a dampening fluid to a reimageable surface of an imaging member in a variable data lithography system without a form roller. Dampening fluid in liquid form is converted to vapor phase, and directed to the reimageable surface. The dampening fluid reverts to the liquid phase directly on the reimageable surface. Controlling the temperatures of elements of the delivery subsystem prevents unwanted condensation of the dampening fluid vapor on those elements. Generation and delivery of the vapor can be controlled in a feedback arrangement as a function of measured layer thickness formed on the reimageable surface to obtain a desired dampening fluid layer thickness formed on the reimageable surface.
摘要:
A system and corresponding methods are disclosed for applying a dampening fluid to a reimageable surface of an imaging member in a variable data lithography system, without a form roller. In one embodiment, the system includes subsystems for converting a dampening fluid from a liquid phase to a dispersed fluid phase, and for directing flow of a dispersed fluid comprising the dampening fluid in dispersed fluid phase to the reimageable surface. The dampening fluid reverts to the liquid phase directly on the reimageable surface. In another embodiment a continuous ribbon of dampening fluid may be applied directly to the reimageable surface. This embodiment includes a body structure having a port for delivering dampening fluid in a continuous fluid ribbon directly to the reimageable surface, and a mechanism, associated with the body structure, for stripping an entrained air layer over the reimageable surface when the reimageable surface is in motion.
摘要:
Systems and methods for aligning substrates that include microstructures. The microstructures may be electronic or micromechanical components. The system includes a first substrate having a first alignment structure and a second substrate having a second alignment structure. The substrates are positioned so that the first alignment structure contacts the second alignment structure without the substrates directly contacting each other, and one of the substrates is adjusted in relation to the other substrate until the first and second alignment structures lock into place. After alignment, the microstructures on the first substrate and the second substrate may establish a connection with or be positioned in near proximity to each other.
摘要:
Various structures, such as microstructures and wall-like structures, can include parts or surfaces that are oblique. In some implementations, a cantilevered element includes a spring-like portion with a uniformly oblique surface or with another artifact of an oblique radiation technique. In some implementations, when a deflecting force is applied, a spring-like portion can provide deflection and spring force within required ranges. Various oblique radiation techniques can be used, such as radiation of a layer through a prism, and structures having spring-like portions with oblique radiation artifacts can be used in various applications, such as with downward or upward deflecting forces.
摘要:
Various traveling wave grids and related systems are disclosed that are particularly beneficial for the separation, transport, and focusing of biomolecules or other charged species. An implementation of a vertically integrated traveling wave module is described which allows for scalability to arbitrary gel dimensions through tiling. In addition, several unique traveling wave algorithms are also described which when used in conjunction with the traveling wave grids, impart selective motion to biomolecules or other charged species.
摘要:
Several traveling wave grid systems are disclosed that may be used to concentrate and form highly localized regions of bio-agents or other charged species. In addition, specific detection systems are described that enable currently available detectors and sensors, including those to be developed in the future, to be used for measuring the presence and concentration of certain bio-agents or charged particles, which otherwise are present at concentrations too low to readily detect or measure.
摘要:
Various fluidic techniques can employ ducting structures, such as microstructures, that extend between other components, such as plate-like structures. A ducting structure can, for example, include an inlet opening toward or near one plate-like structure, an outlet opening toward or near another plate-like structure, and a duct in which fluid flows after being received through the inlet opening and before being provided through the outlet opening. In some implementations, a ducting structure is photo-defined, such as by exposing a photoimageable structure and then removing either exposed or unexposed regions. In some implementations, a ducting structure is a freestanding polymer microstructure. In some implementations, ducting structures are microstructures that extend approximately the same length between first and second plate-like structures, and have a ratio of length to maximum cavity diameter of approximately two or more. A printhead implementation includes an array of such microstructures supported between drive side and drop side assemblies.
摘要:
A socket for solderless connection between a stud-bumped IC chip and a host PCB. The socket includes a three-dimensional (e.g., cylindrical or cubical) hollow metal frame that is either free-standing or supported by an underlying patterned template structure. The metal frame includes side walls that extend away from the host PCB, and a contact structure located at the upper (i.e., free) end of the side walls. The contact structure defines an opening through which a stud bump can be inserted into a central chamber of the metal frame. The side walls and/or the contact structure are formed such that when the tip end of the stud bump is inserted into the central chamber, at least one of the base structure and the sidewall of the stud bump abuts the contact structure at two or more contact points.