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公开(公告)号：US09033248B2
公开(公告)日：2015-05-19
申请号：US13553997
申请日：2012-07-20
申请人： Hidetoshi Suzuki , Yuichi Hotta , Yuji Shimoda , Yuuji Ogawa , Taku Nishiyama , Tadanobu Okubo , Junichi Onodera , Takeshi Ikuta , Naohisa Okumura , Katsuyoshi Watanabe , Kazuhide Doi
发明人： Hidetoshi Suzuki , Yuichi Hotta , Yuji Shimoda , Yuuji Ogawa , Taku Nishiyama , Tadanobu Okubo , Junichi Onodera , Takeshi Ikuta , Naohisa Okumura , Katsuyoshi Watanabe , Kazuhide Doi
IPC分类号： G06K19/06 , H01L23/28 , G06K19/077 , H01L23/00 , H01L23/31 , H01L23/544 , H01L25/065 , H01L25/18 , H01L25/16 , H01L23/498
CPC分类号： G06K19/07732 , H01L23/3107 , H01L23/49838 , H01L23/49855 , H01L23/544 , H01L24/45 , H01L24/48 , H01L24/49 , H01L25/0655 , H01L25/165 , H01L25/18 , H01L2223/54406 , H01L2223/54433 , H01L2223/54486 , H01L2224/45144 , H01L2224/4809 , H01L2224/49113 , H01L2224/49171 , H01L2224/73265 , H01L2924/00014 , H01L2924/12042 , H01L2924/181 , H01L2924/19107 , H05K1/0259 , H05K1/0269 , H05K1/113 , H05K1/117 , H05K3/284 , H05K3/321 , H05K2201/09563 , H05K2201/0979 , H05K2201/09936 , H05K2201/10287 , H05K2203/1327 , H01L2224/05599 , H01L2924/00 , H01L2924/00012
摘要： According to one embodiment, a semiconductor storage device is provided with a memory chip including a storage circuit, a controller chip that controls a memory chip, and a substrate having a first surface and a second surface opposing one another, on the first surface of which the controller chip is mounted. Further, the semiconductor storage device is provided with an external connection terminal formed on the second surface of the substrate, and resin that encapsulates the memory chip, the controller chip, and the substrate, includes a third surface and a fourth surface opposing one another, and has a predetermined mark directly printed only on the fourth surface that is adjacent to the second surface of the substrate.
摘要翻译： 根据一个实施例，半导体存储装置设置有存储芯片，存储芯片包括存储电路，控制存储芯片的控制器芯片和具有第一表面和第二表面的基板，第一表面和第二表面在其第一表面上 安装控制器芯片。 此外，半导体存储装置设置有形成在基板的第二表面上的外部连接端子，并且封装存储芯片，控制器芯片和基板的树脂包括彼此相对的第三表面和第四表面， 并且具有仅在与基板的第二表面相邻的第四表面上直接印刷的预定标记。
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公开(公告)号：US08575738B2
公开(公告)日：2013-11-05
申请号：US13408392
申请日：2012-02-29
IPC分类号： H01L23/495
CPC分类号： H01L23/49558 , H01L23/3107 , H01L23/49541 , H01L23/49575 , H01L23/49589 , H01L24/48 , H01L25/16 , H01L25/18 , H01L2224/451 , H01L2224/48137 , H01L2224/48145 , H01L2224/48247 , H01L2225/06506 , H01L2924/00014 , H01L2924/01021 , H01L2924/181 , H01L2924/1815 , H01L2924/19105 , H01L2924/19107 , H01L2924/00 , H01L2224/05599 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： In an embodiment, a semiconductor memory card includes a lead frame including external connection terminals, a lead portion, a chip component mounting portion and a semiconductor chip mounting portion, a chip component mounted on the chip component mounting portion, a memory chip disposed on the semiconductor chip mounting portion, and a controller chip. A rewiring layer is formed on a surface of the memory chip. The lead frame is resin-sealed. An electric circuit of the controller chip and the memory chip on the lead frame is formed by the lead portion, the rewiring layer and a metal wire connected to electrode pad of the chips, the lead portion, and the rewiring layer.
摘要翻译： 在一个实施例中，半导体存储卡包括引线框架，该引线框架包括外部连接端子，引线部分，芯片部件安装部分和半导体芯片安装部分，安装在芯片部件安装部分上的芯片部件， 半导体芯片安装部分和控制器芯片。 在存储芯片的表面上形成再布线层。 引线框架是树脂密封的。 引线框架上的控制器芯片和存储芯片的电路由引线部分，重新布线层和连接到芯片，引线部分和重新布线层的电极焊盘的金属线形成。
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公开(公告)号：US20130186960A1
公开(公告)日：2013-07-25
申请号：US13553997
申请日：2012-07-20
申请人： Hidetoshi SUZUKI , Yuichi Hotta , Yuji Shimoda , Yuuji Ogawa , Taku Nishiyama , Tadanobu Okubo , Junichi Onodera , Takeshi Ikuta , Naohisa Okumura , Katsuyoshi Watanabe , Kazuhide Doi
发明人： Hidetoshi SUZUKI , Yuichi Hotta , Yuji Shimoda , Yuuji Ogawa , Taku Nishiyama , Tadanobu Okubo , Junichi Onodera , Takeshi Ikuta , Naohisa Okumura , Katsuyoshi Watanabe , Kazuhide Doi
IPC分类号： G06K19/077
CPC分类号： G06K19/07732 , H01L23/3107 , H01L23/49838 , H01L23/49855 , H01L23/544 , H01L24/45 , H01L24/48 , H01L24/49 , H01L25/0655 , H01L25/165 , H01L25/18 , H01L2223/54406 , H01L2223/54433 , H01L2223/54486 , H01L2224/45144 , H01L2224/4809 , H01L2224/49113 , H01L2224/49171 , H01L2224/73265 , H01L2924/00014 , H01L2924/12042 , H01L2924/181 , H01L2924/19107 , H05K1/0259 , H05K1/0269 , H05K1/113 , H05K1/117 , H05K3/284 , H05K3/321 , H05K2201/09563 , H05K2201/0979 , H05K2201/09936 , H05K2201/10287 , H05K2203/1327 , H01L2224/05599 , H01L2924/00 , H01L2924/00012
摘要： According to one embodiment, a semiconductor storage device is provided with a memory chip including a storage circuit, a controller chip that controls a memory chip, and a substrate having a first surface and a second surface opposing one another, on the first surface of which the controller chip is mounted. Further, the semiconductor storage device is provided with an external connection terminal formed on the second surface of the substrate, and resin that encapsulates the memory chip, the controller chip, and the substrate, includes a third surface and a fourth surface opposing one another, and has a predetermined mark directly printed only on the fourth surface that is adjacent to the second surface of the substrate.
摘要翻译： 根据一个实施例，半导体存储装置设置有存储芯片，存储芯片包括存储电路，控制存储芯片的控制器芯片和具有第一表面和第二表面的基板，第一表面和第二表面在其第一表面上 安装控制器芯片。 此外，半导体存储装置设置有形成在基板的第二表面上的外部连接端子，并且封装存储芯片，控制器芯片和基板的树脂包括彼此相对的第三表面和第四表面， 并且具有仅在与基板的第二表面相邻的第四表面上直接印刷的预定标记。
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公开(公告)号：US20120241933A1
公开(公告)日：2012-09-27
申请号：US13408392
申请日：2012-02-29
IPC分类号： H01L23/495
CPC分类号： H01L23/49558 , H01L23/3107 , H01L23/49541 , H01L23/49575 , H01L23/49589 , H01L24/48 , H01L25/16 , H01L25/18 , H01L2224/451 , H01L2224/48137 , H01L2224/48145 , H01L2224/48247 , H01L2225/06506 , H01L2924/00014 , H01L2924/01021 , H01L2924/181 , H01L2924/1815 , H01L2924/19105 , H01L2924/19107 , H01L2924/00 , H01L2224/05599 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： In an embodiment, a semiconductor memory card includes a lead frame including external connection terminals, a lead portion, a chip component mounting portion and a semiconductor chip mounting portion, a chip component mounted on the chip component mounting portion, a memory chip disposed on the semiconductor chip mounting portion, and a controller chip. A rewiring layer is formed on a surface of the memory chip. The lead frame is resin-sealed. An electric circuit of the controller chip and the memory chip on the lead frame is formed by the lead portion, the rewiring layer and a metal wire connected to electrode pad of the chips, the lead portion, and the rewiring layer.
摘要翻译： 在一个实施例中，半导体存储卡包括引线框架，该引线框架包括外部连接端子，引线部分，芯片部件安装部分和半导体芯片安装部分，安装在芯片部件安装部分上的芯片部件， 半导体芯片安装部分和控制器芯片。 在存储芯片的表面上形成再布线层。 引线框架是树脂密封的。 引线框架上的控制器芯片和存储芯片的电路由引线部分，重新布线层和连接到芯片，引线部分和重新布线层的电极焊盘的金属线形成。
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公开(公告)号：US08967075B2
公开(公告)日：2015-03-03
申请号：US12914031
申请日：2010-10-28
申请人： Yoshitsugu Miyamoto , Toshiharu Kishimura , Hitoshi Manabe , Katsuyoshi Watanabe , Naoki Watase , Hideo Nakamura
发明人： Yoshitsugu Miyamoto , Toshiharu Kishimura , Hitoshi Manabe , Katsuyoshi Watanabe , Naoki Watase , Hideo Nakamura
CPC分类号： B41J11/0015 , B05C5/02 , B05C5/027 , B41J11/0005 , B41J11/0085 , B41J11/06 , B41M5/0011
摘要： When the coating object area is positioned on the suction table, the film is stopped and is mounted on the suction table, and is further provided with tension in the longitudinal direction to eliminate slacks or the like, but, curl is caused in the both side end regions in the coating object area. Therefore, the coating object area is mounted on the suction table, and at the same time, the curl correction bars disposed on the both sides of the suction table are moved to the curled portions of the coating object area, and then the curled portions are pressed against the suction surface of the suction table to thereby perform the curl correction. Further, in the coating process with the UV-curing coating material, the UV light from the UV light source formed integrally with the coating head is applied to cure the material. In the vacuum suction section, as the destination, the bubbles or the like in the coating head are sucked. When the suction of the coating head is not performed, the UV shutter is moved by the suction section air cylinder to block the suction port of the vacuum suction section. Thus, the inside of the vacuum suction section is shielded from the UV light.
摘要翻译： 当涂布对象区域位于吸盘上时，膜停止并安装在吸盘上，并且在纵向方向上进一步具有张力以消除松弛等，但是在两侧产生卷曲 涂层物体区域中的末端区域。 因此，涂布对象区域安装在吸台上，同时将设置在吸台两侧的卷曲校正杆移动到涂装对象区域的卷曲部分，然后卷曲部分 压靠在吸盘的吸引面上，由此进行卷曲校正。 此外，在具有UV固化涂层材料的涂布工艺中，施加与涂覆头一体形成的UV光源的UV光以固化材料。 在真空抽吸部中，作为目的地，涂布头中的气泡等被吸入。 当不执行涂覆头的抽吸时，UV挡板被抽吸部气缸移动以阻挡真空抽吸部分的吸入口。 因此，真空抽吸部分的内部被遮蔽了紫外线。
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公开(公告)号：US08022515B2
公开(公告)日：2011-09-20
申请号：US12106511
申请日：2008-04-21
IPC分类号： H01L23/495
CPC分类号： H01L23/49575 , H01L23/3107 , H01L23/3128 , H01L23/4951 , H01L23/49558 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/83 , H01L24/85 , H01L25/0657 , H01L2224/05554 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48137 , H01L2224/48145 , H01L2224/48147 , H01L2224/48227 , H01L2224/48471 , H01L2224/48475 , H01L2224/4911 , H01L2224/49171 , H01L2224/83855 , H01L2224/85051 , H01L2225/06506 , H01L2225/0651 , H01L2225/06575 , H01L2924/00014 , H01L2924/01006 , H01L2924/01014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/15311 , H01L2924/181 , H01L2224/78 , H01L2924/00 , H01L2924/3512 , H01L2924/00012
摘要： A semiconductor device includes a lead frame having an element support and a lead portion. The lead frame has an area from the element support to inner leads of the lead portion, which is formed flat. First and second semiconductor elements are stacked in order on a lower surface of the lead frame. Electrode pads of the first semiconductor element are connected to the inner leads via first metal wires. Ends of the first metal wires, which are connected to the first semiconductor element, are embedded in the second adhesive layer of the second semiconductor element.
摘要翻译： 半导体器件包括具有元件支撑件和引线部分的引线框架。 引线框架具有从元件支撑到引线部分的内引线的区域，其形成为平坦的。 第一和第二半导体元件依次层叠在引线框架的下表面上。 第一半导体元件的电极焊盘通过第一金属线连接到内引线。 连接到第一半导体元件的第一金属线的端部嵌入第二半导体元件的第二粘合层中。
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公开(公告)号：US20110181651A1
公开(公告)日：2011-07-28
申请号：US13008129
申请日：2011-01-18
IPC分类号： B41J29/393
CPC分类号： B41J29/38 , B41J11/0015 , B41J11/008 , B41J11/0085
摘要： A film paid out from a feed side film roll is conveyed so that an application target area of the film is located on a suction table in an application portion. Image-capturing cameras are disposed so as to be adjacent to ink-jet application heads so that one application head and one image-capturing camera are integrated with each other in terms of position of installation to form one application head unit portion. Each application head unit portion is moved above the suction table by a three-dimensionally movable XYZ-direction driving unit. A position where application will be performed next is image-captured by each of the image-capturing cameras in advance during the applying operation due to each of the application heads. A result of image capturing by each of the image-capturing cameras is processed by an image processing unit.
摘要翻译： 输送从进料侧薄膜卷出来的薄膜，使得胶片的涂布目标区域位于涂布部分的吸盘上。 图像捕获摄像机设置成与喷墨应用头相邻，使得一个应用头和一个图像捕获相机在安装位置方面彼此集成以形成一个应用头单元部分。 每个应用头单元部分通过三维可移动的XYZ方向驱动单元在吸力台上方移动。 由于每个应用头，在施加操作期间，预先执行下一个应用的位置将由每个摄像摄像机进行图像拍摄。 通过图像处理单元处理每个图像拍摄相机的图像拍摄的结果。
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8.发明申请公开(公告)号：US20080119579A1
公开(公告)日：2008-05-22
申请号：US11791995
申请日：2005-11-22
申请人： Yoshiaki Ito , Katsuyoshi Watanabe
发明人： Yoshiaki Ito , Katsuyoshi Watanabe
IPC分类号： C08L75/00
CPC分类号： C08J9/26 , C08J2201/044 , C08J2375/04 , F26B5/16
摘要： A continuous pore elastomer featured by being made of a polyurethane, having a three dimensional network pore structure of which skeletons have an average thickness of 20 μm or less and 80% or more of the skeletons have a thickness within the range of 2 to 20 μm, having an apparent density of 0.2 to 0.4 g/cm3, containing a surfactant with a HLB value of 8 or more, and being capable of absorbing water instantly;a process for producing the continuous pore elastomer, comprising a step of extracting out the pore generation agent from the molding with water; anda water-absorbing roller and a swab obtained by using the continuous pore elastomer.
摘要翻译： 由具有三维网状孔结构的聚氨酯制成的连续孔弹性体，其骨架的平均厚度为20μm以下，骨架的80％以上的厚度为2〜20μm的范围 ，表观密度为0.2〜0.4g / cm 3，含有HLB值为8以上的表面活性剂，并且能够瞬间吸收水分; 一种连续孔弹性体的制造方法，其特征在于，包括用水从成型体中提取孔产生剂的工序; 以及通过使用连续孔弹性体获得的吸水辊和棉签。
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公开(公告)号：US5150639A
公开(公告)日：1992-09-29
申请号：US772301
申请日：1991-10-07
CPC分类号： B26F1/3813 , B32B38/0004 , B32B38/185 , B29L2031/3425 , Y10S83/914 , Y10S83/94 , Y10T156/108 , Y10T83/0524 , Y10T83/8736
摘要： A method in which a thin continuous film for conveying a base plate put on the film and another thin continuous film stuck to the main surface of the plate are automatically cut out along the contour of the plate, wherein a cutter is moved to one end of each edge of the plate from an optional position distant from the edge and is thereafter moved to the other end of the edge from another optional position distant from the edge, and movement of the cutter is performed with regard to all the edges of the plate sequentially.
摘要翻译： 沿着板的轮廓自动地切割用于输送放置在薄膜上的基板的薄的连续薄膜和粘附在板的主表面上的另一薄的连续薄膜的方法，其中切割器移动到 板的每个边缘从远离边缘的可选位置移动，然后从远离边缘的另一个可选位置移动到边缘的另一端，并且相对于板的所有边缘执行切割器的移动 。
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公开(公告)号：USD654935S1
公开(公告)日：2012-02-28
申请号：US29347768
申请日：2010-05-25
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