公开(公告)号：US5153705A

公开(公告)日：1992-10-06

申请号：US665154

申请日：1991-03-06

申请人： Kazuhiko Fukuta ,  Naoyuki Tajima ,  Yasunori Chikawa ,  Takaski Tsuda ,  Takamichi Maeda

发明人： Kazuhiko Fukuta ,  Naoyuki Tajima ,  Yasunori Chikawa ,  Takaski Tsuda ,  Takamichi Maeda

IPC分类号： H01L21/60 ,  G02F1/13 ,  H01L23/498 ,  H05K1/00

CPC分类号： H05K1/028 ,  H01L23/4985 ,  H01L24/50 ,  G02F1/13452 ,  H01L2924/07811 ,  H01L2924/14 ,  H05K2201/09036 ,  H05K2201/09063 ,  H05K2201/10136 ,  H05K2201/10681

摘要： A TAB package for packaging a semiconductor chip includes a flexible base plate having a first surface and a second surface opposite to the first surface, an input and output leads being formed on the second surface of the flexible base plate and capable of being connected to the semiconductor chip, and a plurality of slits being formed on the first surface of the flexible base plate. Accordingly, the TAB package is allowed to be easily bent and kept in the bending state. The slits are formed in a manner to correspond to the intervals between the adjacent input and output leads so that the input and output leads can be reliably supported by the flexible base plate.

公开(公告)号：US5506444A

公开(公告)日：1996-04-09

申请号：US212786

申请日：1994-03-15

申请人： Yasunori Chikawa ,  Yoshiaki Honda ,  Katsunobu Mori ,  Naoyuki Tajima ,  Takaaki Tsuda ,  Takamichi Maeda ,  Mitsuaki Osono

发明人： Yasunori Chikawa ,  Yoshiaki Honda ,  Katsunobu Mori ,  Naoyuki Tajima ,  Takaaki Tsuda ,  Takamichi Maeda ,  Mitsuaki Osono

IPC分类号： H01L21/56 ,  H01L23/29 ,  H01L23/31 ,  H01L23/495 ,  H01L23/28

CPC分类号： H01L21/56 ,  H01L23/293 ,  H01L23/3121 ,  H01L2924/0002

摘要： In a semiconductor device of a tape carrier package type, the gap width between inner leads connected with a first edge side of a semiconductor chip set within a device mounting hole provided in the tape carrier is larger than the gap width between leads connected with a second edge side opposite to the first edge side of the semiconductor chip, and the gap length of device mounting hole between the first edge of the semiconductor chip and the first edge of the device mounting hole corresponding to the first edge of the semiconductor chip is smaller than the gap length between the second edge of the semiconductor chip and the second edge of the device mounting hole corresponding to the second edge of the semiconductor chip. Such structure enables an encapsulation resin to fill uniformly the device mounting hole, and the encapsulation resin after encapsulation has a shape of a designed dimension.

摘要翻译： 在载带封装型的半导体器件中，与设置在带载体中的器件安装孔内的半导体芯片的与第一边缘侧连接的内部引线之间的间隙宽度大于与第二引线连接的引线之间的间隙宽度 边缘侧与半导体芯片的第一边缘侧相对，并且半导体芯片的第一边缘与对应于半导体芯片的第一边缘的器件安装孔的第一边缘之间的器件安装孔的间隙长度小于 半导体芯片的第二边缘与器件安装孔的与半导体芯片的第二边缘对应的第二边缘之间的间隙长度。 这样的结构能够使封装树脂均匀地填充装置安装孔，并且封装后的封装树脂具有设计尺寸的形状。

公开(公告)号：US5336650A

公开(公告)日：1994-08-09

申请号：US112315

申请日：1993-08-27

申请人： Yasunori Chikawa ,  Yoshiaki Honda ,  Katsunobu Mori ,  Naoyuki Tajima ,  Takaaki Tsuda ,  Takamichi Maeda

发明人： Yasunori Chikawa ,  Yoshiaki Honda ,  Katsunobu Mori ,  Naoyuki Tajima ,  Takaaki Tsuda ,  Takamichi Maeda

IPC分类号： H01L21/60 ,  H01L21/56 ,  H01L23/29 ,  H01L23/31

CPC分类号： H01L21/56 ,  H01L23/293 ,  H01L23/3121 ,  H01L2924/0002 ,  Y10T29/49121

摘要： A tape carrier semiconductor device has a resin sealed area not so larger than the size of the semiconductor chip, e.g. substantially not exceeding 2 mm to the outside. A device hole is not larger than an area formed by extending the outer periphery of the semiconductor chip to the outside by 0.3 mm and an epoxy resin of 500-1200 ps in viscosity is used for sealing the chip.

摘要翻译： 带载半导体器件具有树脂密封区域不大于半导体芯片的尺寸，例如， 基本上不超过2mm。 器件孔不大于通过将半导体芯片的外周向外延伸0.3mm而形成的区域，并且使用粘度为500-1200ps的环氧树脂来密封芯片。

公开(公告)号：US5281848A

公开(公告)日：1994-01-25

申请号：US796431

申请日：1991-11-22

申请人： Yasunori Chikawa ,  Yoshiaki Honda ,  Katsunobu Mori ,  Naoyuki Tajima ,  Takaaki Tsuda ,  Takamichi Maeda

发明人： Yasunori Chikawa ,  Yoshiaki Honda ,  Katsunobu Mori ,  Naoyuki Tajima ,  Takaaki Tsuda ,  Takamichi Maeda

IPC分类号： H01L21/60 ,  H01L21/56 ,  H01L23/29 ,  H01L23/31 ,  H01L23/28

CPC分类号： H01L21/56 ,  H01L23/293 ,  H01L23/3121 ,  H01L2924/0002 ,  Y10T29/49121

摘要： A tape carrier semiconductor device has a resin sealed area not much larger than the size of the semiconductor chip, e.g. substantially not exceeding 2 mm to the outside. A device hole is not larger than an area formed by extending the outer periphery of the semiconductor chip to the outside by 0.3 mm and an epoxy resin of 500-1200 ps in viscosity is used for sealing the chip.

摘要翻译： 带载半导体器件具有不比半导体芯片的尺寸大得多的树脂密封区域，例如， 基本上不超过2mm。 器件孔不大于通过将半导体芯片的外周向外延伸0.3mm而形成的区域，并且使用粘度为500-1200ps的环氧树脂来密封芯片。

公开(公告)号：US4247590A

公开(公告)日：1981-01-27

申请号：US858636

申请日：1977-12-08

申请人： Masao Hayakawa ,  Takamichi Maeda ,  Teruo Horii ,  Masao Kumura ,  Yasunori Chikawa

发明人： Masao Hayakawa ,  Takamichi Maeda ,  Teruo Horii ,  Masao Kumura ,  Yasunori Chikawa

IPC分类号： H01L21/683 ,  H01L21/60 ,  H05K1/03 ,  B32B3/00 ,  B32B3/26

CPC分类号： H01L24/83 ,  H01L24/29 ,  H01L2224/2919 ,  H01L2224/8319 ,  H01L2224/83801 ,  H01L2924/01014 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/09701 ,  H05K1/0306 ,  Y10T428/24926 ,  Y10T428/249994

摘要： A semiconductor wafer is supported by a supporting plate via adhesive in some steps of fabricating a semiconductor device. The supporting plate is a porous ceramic plate impregnated with or painted with resin such as epoxy resin, silicone resin and polyimide varnish. The porous ceramic supporting plate has a low thermal conductivity to ensure stable bonding operation.

摘要翻译： 半导体晶片在制造半导体器件的一些步骤中通过粘合剂由支撑板支撑。 支撑板是浸渍或用树脂涂覆的多孔陶瓷板，例如环氧树脂，硅树脂和聚酰亚胺清漆。 多孔陶瓷支撑板具有低导热性，以确保稳定的接合操作。

公开(公告)号：US5310699A

公开(公告)日：1994-05-10

申请号：US905683

申请日：1992-06-29

申请人： Yasunori Chikawa ,  Shigeyuki Sasaki ,  Katsunobu Mori ,  Takamichi Maeda ,  Masao Hayakawa

发明人： Yasunori Chikawa ,  Shigeyuki Sasaki ,  Katsunobu Mori ,  Takamichi Maeda ,  Masao Hayakawa

IPC分类号： H01L21/60 ,  H01L23/485 ,  H01L23/532 ,  H01L21/28 ,  H01L21/447 ,  H01L21/92

CPC分类号： H01L24/11 ,  H01L23/53242 ,  H01L23/53252 ,  H01L24/13 ,  H01L2224/1147 ,  H01L2224/13007 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2924/0001 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/04941

摘要： A method of manufacturing a semiconductor device with a bump-electrode of gold crystal is disclosed. The method includes providing a semiconductor substrate, an insulative layer, an electrode section, passivation layer on the edge portion of the electrode section, a multi-layer film, and a bump electrode of gold crystal. The method further includes heat treatment of the bump electrode to form an anticorrosive layer between the electrode section and the lower layer of the multi-layer film. Removing the unnecessary multi-layer film, the anticorrosive layer is used as a mask for etching to simplify the process of manufacturing the semiconductor device.

摘要翻译： 公开了一种制造具有金晶体凸块电极的半导体器件的方法。 该方法包括在电极部分的边缘部分上提供半导体衬底，绝缘层，电极部分，钝化层，多层膜和金晶体的凸块电极。 该方法还包括对凸块电极进行热处理，以在多层膜的电极部分和下层之间形成防腐蚀层。 为了简化半导体器件的制造工序，除去不需要的多层膜，将防腐蚀层用作蚀刻掩模。

公开(公告)号：US4926239A

公开(公告)日：1990-05-15

申请号：US390448

申请日：1989-08-02

申请人： Kazuya Fujita ,  Takamichi Maeda ,  Masao Hayakawa

发明人： Kazuya Fujita ,  Takamichi Maeda ,  Masao Hayakawa

IPC分类号： H01L23/29

CPC分类号： H01L23/293 ,  H01L24/50 ,  H01L2924/13091 ,  H01L2924/14 ,  Y10T428/239

摘要： A plastic encapsulant for a semiconductor chip comprises an epoxy resin, an organosilicon compound, a hardener, a pigment, and an organic solvent. The epoxy resin is an epichlorohydrin-bisphenol A type epoxy resin, and the organosilicon compound is an organosilicon compound with a methoxy group, preferably, three methoxy groups. The hardener is a resol type phenol resin hardener. The organic solvent is a mixture of ketones, alcohols, and aromatic hydrocarbons.

摘要翻译： 用于半导体芯片的塑料密封剂包括环氧树脂，有机硅化合物，硬化剂，颜料和有机溶剂。 环氧树脂是表氯醇 - 双酚A型环氧树脂，有机硅化合物是具有甲氧基的有机硅化合物，优选三个甲氧基。 固化剂是甲阶型酚醛树脂固化剂。 有机溶剂是酮，醇和芳烃的混合物。

公开(公告)号：US4536786A

公开(公告)日：1985-08-20

申请号：US39820

申请日：1979-05-17

申请人： Masao Hayakawa ,  Takamichi Maeda ,  Masao Kumura

发明人： Masao Hayakawa ,  Takamichi Maeda ,  Masao Kumura

IPC分类号： H01L21/603 ,  H01L21/60 ,  H01L23/48 ,  H01L29/44 ,  H01L29/52

CPC分类号： H01L24/50 ,  H01L24/79 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/15787

摘要： Raised contacts included within a semiconductor chip are bonded to respective external leads through the use of a bonding tool. The raised contacts and/or the external leads are varied in a fashion depending on their locations on a semiconductor substrate so as to compensate for lack of uniformity of the surface temperature of the bonding tool.

摘要翻译： 包含在半导体芯片内的升高的触点通过使用接合工具被接合到相应的外部引线。 升高的触点和/或外部引线以取决于它们在半导体衬底上的位置的方式变化，以便补偿焊接工具的表面温度的不均匀性。

公开(公告)号：US4300153A

公开(公告)日：1981-11-10

申请号：US190744

申请日：1980-09-25

申请人： Masao Hayakawa ,  Takamichi Maeda ,  Masao Kumura

发明人： Masao Hayakawa ,  Takamichi Maeda ,  Masao Kumura

IPC分类号： H01L21/56 ,  H01L23/31 ,  H01L23/28 ,  H01L23/02 ,  H01L39/02

CPC分类号： H01L23/3121 ,  H01L21/56 ,  H01L2224/16

摘要： Electrodes are formed on one major surface of a semiconductor chip and electrically connected to lead electrodes carried by a support substrate. A cover plate is fixed to the opposing major surface of the semiconductor chip to determine one major surface of semiconductor device. Remaining surfaces of the semiconductor chip are encapsulated by a resin mold. The cover plate comprises a flexible glass cloth impregnated with half cured epoxy resin.

摘要翻译： 电极形成在半导体芯片的一个主表面上并电连接到由支撑衬底承载的引线电极。 盖板固定到半导体芯片的相对主表面以确定半导体器件的一个主表面。 半导体芯片的剩余表面被树脂模具封装。 盖板包括浸渍有半固化环氧树脂的柔性玻璃布。

公开(公告)号：US5523608A

公开(公告)日：1996-06-04

申请号：US316813

申请日：1994-10-03

申请人： Kouki Kitaoka ,  Takamichi Maeda ,  Shozo Minamide

发明人： Kouki Kitaoka ,  Takamichi Maeda ,  Shozo Minamide

IPC分类号： H01L23/02 ,  H01L25/16 ,  H01L27/14 ,  H01L31/0203 ,  H01L31/0232 ,  H01L23/28 ,  H01L23/495

CPC分类号： H01L25/16 ,  H01L31/0203 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L24/45 ,  H01L2924/01013 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/16195 ,  H01L2924/181

摘要： A peripheral IC 6 for a solid state imaging device is mounted on an island 7 of a lead frame and thereafter covered and sealed by a molding resin, thus forming a premolded package 2. Subsequently, a solid state image sensor 1 is mounted on the island 7 on one side thereof facing an opening. Thereafter, for protection of the solid state image sensor 1, a transparent lid 11 is attached to the premolded package 2 by adhesive. As a result, packaging area can be reduced in mounting the solid state image sensor on a packaging substrate, allowing video equipment such as video cameras to be miniaturized.

摘要翻译： 用于固态成像装置的外围IC6安装在引线框架的岛7上，然后被模制树脂覆盖和密封，从而形成预成型封装2.随后，固态图像传感器1安装在岛上 7，其一侧面向开口。 此后，为了保护固态图像传感器1，透明盖11通过粘合剂附接到预成型包装2。 结果，在将固态图像传感器安装在包装基板上的情况下，可以减少封装面积，从而允许诸如摄像机的视频设备小型化。