公开(公告)号：US06568385B2

公开(公告)日：2003-05-27

申请号：US09933945

申请日：2001-08-22

申请人： Kazuma Sekiya ,  Naoki Omiya ,  Yohei Kanno

发明人： Kazuma Sekiya ,  Naoki Omiya ,  Yohei Kanno

IPC分类号： B28D102

CPC分类号： B23Q11/0841 ,  B23Q11/0816 ,  B28D5/0076 ,  B28D5/024

摘要： A cutting machine of a type having bellows means disposed at least on one side of a chuck table to be reciprocated. A protective sheet covering the upper surface of the bellows means is disposed. One end of the protective sheet is reciprocated in accordance with the reciprocation of the chuck table, while the other end of the protective sheet is connected to winding means. When the chuck table is moved forward or backward, the protective sheet is gradually wound up by the winding means. When the chuck table is moved backward or forward, the protective sheet is gradually wound off from the winding means.

公开(公告)号：US09013303B2

公开(公告)日：2015-04-21

申请号：US13555519

申请日：2012-07-23

申请人： Yasuyuki Arai ,  Mai Akiba ,  Yuko Tachimura ,  Yohei Kanno

发明人： Yasuyuki Arai ,  Mai Akiba ,  Yuko Tachimura ,  Yohei Kanno

IPC分类号： G08B1/08 ,  H04B5/00 ,  G06K7/10 ,  G06K17/00 ,  G06K19/077 ,  H04Q5/22 ,  G08B13/14 ,  H01L21/336

CPC分类号： H04B5/0012 ,  G06K7/10178 ,  G06K17/00 ,  G06K19/07758 ,  G06K2017/0051 ,  H04B5/0056 ,  H04B5/0081

摘要： One feature of the present invention is a product management system that includes a package body for packing a product attached with an ID tag, and a reader/writer. The ID tag includes a thin film integrated circuit portion and an antenna, the package body includes a resonance circuit portion having an antenna coil and a capacitor, and the resonance circuit portion can communicate with the reader/writer and the ID tag. Accordingly, the stability of communication between an ID tag attached to a product and an R/W can be secured, and management of products can be conducted simply and efficiently, even if a product is packed by a package body.

摘要翻译： 本发明的一个特征是产品管理系统，其包括用于打包附有ID标签的产品的包装体和读取器/写入器。 ID标签包括薄膜集成电路部分和天线，封装主体包括具有天线线圈和电容器的谐振电路部分，并且谐振电路部分可以与读取器/写入器和ID标签通信。 因此，即使产品被包装体包装，也可以确保附着在产品上的ID标签与R / W之间的通信的稳定性，并且可以简单有效地进行产品的管理。

公开(公告)号：US07994617B2

公开(公告)日：2011-08-09

申请号：US10587237

申请日：2005-02-01

申请人： Yasuyuki Arai ,  Yuko Tachimura ,  Yohei Kanno ,  Mai Akiba

发明人： Yasuyuki Arai ,  Yuko Tachimura ,  Yohei Kanno ,  Mai Akiba

IPC分类号： H01L23/02

CPC分类号： H01L27/1266 ,  G06K19/025 ,  G06K19/07728 ,  G06K19/07749 ,  H01L27/1214 ,  H01L27/13 ,  H01L2221/6835 ,  H01L2224/73204

摘要： An object of the present invention is providing a semiconductor device that is capable of improving the reliability of a semiconductor element and enhancing the mechanical strength without suppressing the scale of a circuit. The semiconductor device includes an integrated circuit sandwiched between first and second sealing films, an antenna electrically connected to the integrated circuit, the first sealing film sandwiched between a substrate and the integrated circuit, which includes a plurality of first insulating films and at least one second insulating film sandwiched therebetween, the second sealing film including a plurality of third insulating films and at least one fourth insulating film sandwiched therebetween. The second insulating film has lower stress than the first insulting film and the fourth insulating film has lower stress than the third insulating film. The first and third insulating films are inorganic insulating films.

摘要翻译： 本发明的目的在于提供一种能够提高半导体元件的可靠性并提高机械强度而不抑制电路规模的半导体装置。 半导体器件包括夹在第一和第二密封膜之间的集成电路，与集成电路电连接的天线，夹在基板和集成电路之间的第一密封膜，其包括多个第一绝缘膜和至少一个第二绝缘膜 夹在其间的绝缘膜，所述第二密封膜包括多个第三绝缘膜和夹在其间的至少一个第四绝缘膜。 第二绝缘膜具有比第一绝缘膜低的应力，并且第四绝缘膜具有比第三绝缘膜更低的应力。 第一和第三绝缘膜是无机绝缘膜。

公开(公告)号：US07465647B2

公开(公告)日：2008-12-16

申请号：US11896509

申请日：2007-09-04

申请人： Shunpei Yamazaki ,  Toru Takayama ,  Yohei Kanno

发明人： Shunpei Yamazaki ,  Toru Takayama ,  Yohei Kanno

IPC分类号： H01L21/46 ,  H01L21/30 ,  H01L21/762

CPC分类号： H01L21/6835 ,  G06K19/0704 ,  G06K19/0723 ,  G06K19/07703 ,  G06K19/07718 ,  G06K19/07745 ,  G06K19/07749 ,  G06K19/0775 ,  G06K19/07758 ,  G06K19/07779 ,  G06K19/07781 ,  G06K19/07783 ,  H01L23/49855 ,  H01L2221/68318 ,  H01L2221/68359 ,  H01L2221/68368 ,  H01L2224/45147 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01015 ,  H01L2924/01047 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2924/00011

摘要： With non-contact and contact IC chips becoming common, it is necessary to mass-produce enormous amount of IC chips, which are utilizable for human beings, animals and plants, commercial products, banknotes, and the like, at low cost. For example, it is necessary to manufacture IC chips to be applied to commercial products, banknotes, and the like at a cost of 1 to several yen per IC chip, preferably, at a cost less than 1 yen, and it is desired to realize a structure of an IC chip that can be mass-produced at low cost and a manufacturing process of the IC chip.A method of manufacturing a thin film integrated circuit device according to the present invention includes steps of forming a peel-off layer over a thermally oxidized silicon substrate, forming a plurality of thin film integrated circuit devices over the peel-off layer with a base film interposed therebetween, forming a groove between the plurality of thin film integrated circuit devices, and separating the plurality of thin film integrated circuit devices by introducing one of a gas and a liquid including halogen fluoride into the groove to remove the peel-off layer.

公开(公告)号：US08322847B2

公开(公告)日：2012-12-04

申请号：US13049078

申请日：2011-03-16

申请人： Shunpei Yamazaki ,  Jun Koyama ,  Yasuyuki Arai ,  Shinji Maekawa ,  Yohei Kanno

发明人： Shunpei Yamazaki ,  Jun Koyama ,  Yasuyuki Arai ,  Shinji Maekawa ,  Yohei Kanno

IPC分类号： B41J2/01 ,  B05B7/06 ,  H01L21/36

CPC分类号： H01L51/0004 ,  H01L51/56 ,  H05K1/0269 ,  H05K3/0008 ,  H05K3/1241

摘要： When using a liquid droplet ejection method, a conventional photomask is not required, however, it is required instead that a moving path of a nozzle or a substrate is controlled with accuracy at least in ejecting liquid droplets. According to the characteristics of compositions to be ejected or their pattern, such ejection conditions are desirably set as the moving rate of a nozzle or a substrate, ejection quantity, ejection distance and ejection rate of compositions, atmosphere of the space that the compositions are ejected, the temperature and moisture of the space, and heating temperature of the substrate. A liquid droplet ejection system in accordance with the invention comprises an input means for inputting data of a thin film pattern, a set means for setting a nozzle for a ejecting a composition containing a material for forming the thin film or setting a moving path of the substrate to which the composition is ejected, an image pick-up means for detecting an alignment marker formed on a substrate and a control means for controlling the moving path of the nozzle or the substrate.

摘要翻译： 当使用液滴喷射方法时，不需要常规的光掩模，然而，需要至少在喷射液滴时精确地控制喷嘴或基板的移动路径。 根据要喷射的组合物或其图案的特征，这种喷射条件期望设置为喷嘴或基底的移动速率，喷射量，喷射距离和组合物的喷射速率，组合物喷出的空间的气氛 ，空间的温度和湿度，以及基板的加热温度。 根据本发明的液滴喷射系统包括用于输入薄膜图案的数据的输入装置，用于设置用于喷射包含用于形成薄膜的材料的组合物的喷嘴的设定装置或设置该薄膜图案的移动路径 用于检测形成在基板上的取向标记的图像拾取装置和用于控制喷嘴或基板的移动路径的控制装置。

公开(公告)号：US08237569B2

公开(公告)日：2012-08-07

申请号：US10594308

申请日：2005-04-06

申请人： Yasuyuki Arai ,  Mai Akiba ,  Yuko Tachimura ,  Yohei Kanno

发明人： Yasuyuki Arai ,  Mai Akiba ,  Yuko Tachimura ,  Yohei Kanno

IPC分类号： G08B13/14 ,  G08B13/00 ,  H04Q5/22 ,  G06Q30/00 ,  G06Q20/00

CPC分类号： H04B5/0012 ,  G06K7/10178 ,  G06K17/00 ,  G06K19/07758 ,  G06K2017/0051 ,  H04B5/0056 ,  H04B5/0081

摘要： When a product attached with an ID tag is placed inside a package body, there is a risk that communication with an ID tag using a reader/writer is blocked. Then, it is difficult to manage products in a distribution process of products, which leads to lose convenience of ID tags. One feature of the present invention is a product management system that includes a package body for packing a product attached with an ID tag, and a reader/writer. The ID tag includes a thin film integrated circuit portion and an antenna, the package body includes a resonance circuit portion having an antenna coil and a capacitor, and the resonance circuit portion can communicate with the reader/writer and the ID tag. Accordingly, the stability of communication between an ID tag attached to a product and an R/W can be secured, and management of products can be conducted simply and efficiently, even if a product is packed by a package body.

摘要翻译： 当附有ID标签的产品放置在包装体内时，存在与使用读写器的ID标签进行通信的风险。 然后，在产品分销过程中难以管理产品，导致ID标签的便利性不足。 本发明的一个特征是产品管理系统，其包括用于打包附有ID标签的产品的包装体和读取器/写入器。 ID标签包括薄膜集成电路部分和天线，封装主体包括具有天线线圈和电容器的谐振电路部分，并且谐振电路部分可以与读取器/写入器和ID标签通信。 因此，即使产品被包装体包装，也可以确保附着在产品上的ID标签与R / W之间的通信的稳定性，并且可以简单有效地进行产品的管理。

公开(公告)号：US08228453B2

公开(公告)日：2012-07-24

申请号：US12984627

申请日：2011-01-05

申请人： Shunpei Yamazaki ,  Shinji Maekawa ,  Yohei Kanno

发明人： Shunpei Yamazaki ,  Shinji Maekawa ,  Yohei Kanno

IPC分类号： G02F1/1368

CPC分类号： H01L21/288 ,  H01L21/28008 ,  H01L21/76838 ,  H01L27/1292 ,  H01L29/66765 ,  H01L29/78669 ,  H01L29/78678 ,  H01L2224/73265

摘要： As a wiring becomes thicker, discontinuity of an insulating film covering the wiring has become a problem. It is difficult to form a wiring with width thin enough for a thin film transistor used for a current high definition display device. As a wiring is made thinner, signal delay due to wiring resistance has become a problem. In view of the above problems, the invention provides a structure in which a conductive film is formed in a hole of an insulating film, and the surfaces of the conductive film and the insulating film are flat. As a result, discontinuity of thin films covering a conductive film and an insulating film can be prevented. A wiring can be made thinner by controlling the width of the hole. Further, a wiring can be made thicker by controlling the depth of the hole.

摘要翻译： 随着布线变厚，覆盖布线的绝缘膜的不连续性成为问题。 对于用于当前的高分辨率显示装置的薄膜晶体管，难以形成宽度足够薄的布线。 由于布线变薄，由于布线电阻引起的信号延迟已经成为问题。 鉴于上述问题，本发明提供一种在绝缘膜的孔中形成导电膜，并且导电膜和绝缘膜的表面平坦的结构。 结果，可以防止覆盖导电膜和绝缘膜的薄膜的不连续性。 通过控制孔的宽度可以使布线更薄。 此外，通过控制孔的深度，可以使布线变厚。

公开(公告)号：US20110097830A1

公开(公告)日：2011-04-28

申请号：US12983336

申请日：2011-01-03

申请人： Yohei Kanno ,  Gen Fujii

发明人： Yohei Kanno ,  Gen Fujii

IPC分类号： H01L33/00 ,  H01L21/336

CPC分类号： H01L29/66765 ,  H01L27/12 ,  H01L27/1285 ,  H01L27/1292 ,  H01L29/42384 ,  H01L29/78603 ,  H01L29/78696

摘要： In case that a conventional TFT is formed to have an inversely staggered type, a resist mask is required to be formed by an exposing, developing, and droplet discharging in forming an island-like semiconductor region. It resulted in the increase in the number of processes and the number of materials. According to the present invention, a process can be simplified since after forming a source region and a drain region, a portion serving as a channel region is covered by an insulating film serving as a channel protecting film to form an island-like semiconductor film, and so a semiconductor element can be manufactured by using only metal mask without using a resist mask.

摘要翻译： 在常规TFT形成为具有反交错型的情况下，需要通过在形成岛状半导体区域中的曝光，显影和液滴放电来形成抗蚀剂掩模。 这导致过程数量和材料数量的增加。 根据本发明，由于在形成源极区域和漏极区域之后，由于作为沟道区域的部分被用作沟道保护膜的绝缘膜覆盖以形成岛状半导体膜，因此可以简化工艺， 因此可以仅使用金属掩模而不使用抗蚀剂掩模来制造半导体元件。

公开(公告)号：US20080149731A1

公开(公告)日：2008-06-26

申请号：US10586156

申请日：2005-01-20

申请人： Yasuyuki Arai ,  Mai Akiba ,  Yuko Tachimura ,  Yohei Kanno

发明人： Yasuyuki Arai ,  Mai Akiba ,  Yuko Tachimura ,  Yohei Kanno

IPC分类号： G06K19/06

CPC分类号： H01L27/1266 ,  G06K19/07718 ,  G06K19/07749 ,  G06K19/0775 ,  G06K19/07779 ,  G06K19/07783 ,  H01L27/1203 ,  H01L27/1214 ,  H01L27/13 ,  H01L29/78603 ,  H01L2224/83192 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01021 ,  H01L2924/01025 ,  H01L2924/01046 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079

摘要： As a non-contact ID label, ID tag and the like being widespread, it is required to manufacture a considerable quantity of ID labels at quite a low cost. An ID label attached to a product is, for example, required to be manufactured at 1 to several yens each, or preferably less than one yen. Thus, such a structure and a process are demanded that an ID label can be manufactured in a large quantity at a low cost. A thin film integrated circuit device included in the ID label, the ID card, and the ID tag of the invention each includes a thin film active element such as a thin film transistor (TFT). Therefore, by peeling a substrate on which TFTs are formed for separating elements, the ID label and the like can be manufactured in a large quantity at a low cost.

摘要翻译： 作为非接触式ID标签，ID标签等广泛使用，需要以相当低的成本制造大量的ID标签。 例如，附着在产品上的ID标签需要以1至几个日元制造，或优选小于1日元。 因此，要求能够以低成本大量制造ID标签的结构和工序。 包括在本发明的ID标签，ID卡和ID标签中的薄膜集成电路器件各自包括诸如薄膜晶体管（TFT）的薄膜有源元件。 因此，通过剥离其上形成有用于分离元件的TFT的基板，可以以低成本大量地制造ID标签等。

公开(公告)号：US20050168339A1

公开(公告)日：2005-08-04

申请号：US11044609

申请日：2005-01-28

申请人： Yasuyuki Arai ,  Mai Akiba ,  Yuko Tachimura ,  Yohei Kanno

发明人： Yasuyuki Arai ,  Mai Akiba ,  Yuko Tachimura ,  Yohei Kanno

IPC分类号： G06K19/077 ,  G08B13/14

CPC分类号： G06K19/07722 ,  G06K19/07749 ,  G08B13/2417 ,  G08B13/2437

摘要： In commercial products to which a non-contact type or contact type ID label or ID tag is attached and ID cards, there is fear that, due to a difference between coefficients of thermal expansion between an antenna for communication and a resin provided around the antenna, stress is applied to the resin with the larger coefficient of thermal expansion to break the resin. This contributes to decrease in manufacturing yield, lifetime, and reliability of an ID label or the like. In an article such as an ID label, an ID tag, and an ID card according to the present invention, a filler is included in a filling layer provided around an antenna forming an ID label, an ID tag, and an ID card so that the difference in coefficient of thermal expansion between the antenna and the filling layer can be reduced. This makes it possible to ease generation of stress due to the difference in coefficient of thermal expansion and prevent peeling and cracks of the filling layer.

摘要翻译： 在与非接触型或接触型ID标签或ID标签相连的商业产品中，ID卡有恐惧，由于通信用天线与设置在天线周围的树脂之间的热膨胀系数之间的差异 对具有较大的热膨胀系数的树脂施加应力以破坏树脂。 这导致ID标签等的制造产量，寿命和可靠性的降低。 在根据本发明的诸如ID标签，ID标签和ID卡的物品中，在形成ID标签，ID标签和ID卡的天线周围的填充层中包括填充物，使得 可以降低天线与填充层之间的热膨胀系数的差异。 这使得可以缓解由于热膨胀系数的差异导致的应力的产生，并且防止填充层的剥离和裂纹。