公开(公告)号：US08232477B2

公开(公告)日：2012-07-31

申请号：US12494798

申请日：2009-06-30

申请人： Kazunori Kitamura ,  Yukihiro Koga ,  Kiyoshi Sato

发明人： Kazunori Kitamura ,  Yukihiro Koga ,  Kiyoshi Sato

IPC分类号： H05K1/03 ,  H01L23/053 ,  H01L23/12

CPC分类号： H05K3/0094 ,  C08K3/013 ,  C08K2201/003 ,  C08L63/00 ,  H05K3/4602 ,  H05K2201/0209 ,  H05K2201/0347 ,  H05K2201/068 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/096 ,  Y10T428/24917

摘要： In a curable resin composition containing an inorganic filler, the average particle diameter of the inorganic filler is 1 μm or less and the content of the inorganic filler is 50 wt % or less. The curable resin composition can be preferably used for a halogen-free resin substrate and the like having a small load on an environment as a hole-plugging curable resin composition as well as used to provide a hole-plugging build-up printed wiring board having a via-on-via structure (in particular, a stacked via structure) having an excellent crack-resistant property, an excellent insulation/connection reliability, and the like.

摘要翻译： 在含有无机填料的固化性树脂组合物中，无机填料的平均粒径为1μm以下，无机填料的含量为50重量％以下。 固化性树脂组合物可以优选用于作为空穴堵塞固化性树脂组合物的环境负荷小的无卤素树脂基材等，并且用于提供具有孔堵塞积聚印刷线路板，其具有 具有优异的抗裂性，优异的绝缘/连接可靠性等的通孔通孔结构（特别是堆叠通孔结构）。

公开(公告)号：US08758986B2

公开(公告)日：2014-06-24

申请号：US12874755

申请日：2010-09-02

申请人： Takeshi Saito ,  Kazunori Kitamura ,  Yukihiro Koga

发明人： Takeshi Saito ,  Kazunori Kitamura ,  Yukihiro Koga

IPC分类号： G03F7/26

CPC分类号： G03F7/168 ,  H05K3/28 ,  H05K3/3452 ,  H05K2203/0278

摘要： A method produces an undercoat-covered smoothed printed wiring board, requiring no step of polishing the surface of the printed wiring board. A method for producing a solder-resist-covered printed wiring board causes no depression in an area between circuit traces. A printed wiring board so produced is also described. The method for producing a printed wiring board includes applying a photo- and heat-curable resin composition onto at least a part of a surface of a printed wiring substrate; placing an optically transparent smoothing member on the resin layer; moving a hard roller on the smoothing member to thin the applied resin layer to a thickness of interest; placing a negative-image mask on the smoothing member; exposing the applied resin layer to light via the negative-image mask; removing the optically transparent smoothing member; removing a light-unexposed portion of the applied resin layer through development; and completely heat-curing the cured light-exposed portion.

摘要翻译： 一种方法产生底漆覆盖的平滑印刷线路板，不需要抛光印刷线路板的表面的步骤。 用于制造阻焊覆盖印刷线路板的方法不会在电路迹线之间的区域中产生凹陷。 还描述了如此制造的印刷线路板。 印刷电路板的制造方法包括将光固化树脂组合物和热固化性树脂组合物涂布在印刷布线基板的表面的至少一部分上; 将光学透明的平滑部件放置在树脂层上; 在平滑构件上移动硬辊以将所施加的树脂层稀薄至感兴趣的厚度; 在平滑构件上放置负像掩模; 将所施加的树脂层经由负像掩模曝光; 去除光学透明平滑件; 通过显影去除涂布的树脂层的未曝光部分; 并使固化的光照部分完全热固化。

公开(公告)号：US20050019582A1

公开(公告)日：2005-01-27

申请号：US10920809

申请日：2004-08-18

申请人： Kiyoshi Sato ,  Kazunori Kitamura

发明人： Kiyoshi Sato ,  Kazunori Kitamura

IPC分类号： C08F290/06 ,  C08F283/10 ,  C08G59/18 ,  C08G59/20 ,  C08L63/00 ,  C08L63/10 ,  H01L23/498 ,  H05K3/00 ,  H05K3/28 ,  H05K3/46 ,  B32B27/38 ,  B05D1/38

CPC分类号： H05K3/4626 ,  C08F283/10 ,  C08G59/18 ,  C08L63/10 ,  H01L23/49894 ,  H01L2924/0002 ,  H05K3/0094 ,  H05K3/28 ,  H05K3/4602 ,  H05K2201/0959 ,  H05K2201/09881 ,  Y10T428/31511 ,  Y10T428/31515 ,  C08L63/00 ,  H01L2924/00

摘要： The thermosetting resin composition which is valuable for an undercoat of a printed wiring board, and does not leave an air bubble in a cured film, and makes the surface polishing easy and can form a smooth printed wiring board comprises (I) an adduct of epoxy resin with unsaturated aliphatic acid, (II) a (meth) acrylate, (III) a radical polymerization initiator, (IV) a crystallizable epoxy resin, and (V) a latent curing agent.

摘要翻译： 对印刷电路板的底涂层有价值且不在固化膜中留下气泡并使表面抛光容易并且可以形成光滑的印刷电路板的热固性树脂组合物包括（I）环氧树脂的加合物 具有不饱和脂肪酸的树脂，（II）（甲基）丙烯酸酯，（III）自由基聚合引发剂，（IV）可结晶环氧树脂和（V）潜伏性固化剂。

公开(公告)号：US20060042832A1

公开(公告)日：2006-03-02

申请号：US10927931

申请日：2004-08-27

申请人： Kiyoshi Sato ,  Kazunori Kitamura

发明人： Kiyoshi Sato ,  Kazunori Kitamura

IPC分类号： H05K1/09 ,  H05K1/11

CPC分类号： H05K3/4614 ,  H05K3/205 ,  H05K3/328 ,  H05K3/423 ,  H05K2201/09881 ,  H05K2201/10378

摘要： A multilayer circuit board comprises a conductor wiring layer, and an insulation layer, wherein the conductor wiring layer and the insulation layer are laminated alternately, wherein the conductor wiring layer is electrically connected by a via through the insulation layer, wherein the via is filled with a conductor material, and wherein the conductor material is junctured to the conductor wiring layer with an alloy.

摘要翻译： 多层电路板包括导体布线层和绝缘层，其中导体布线层和绝缘层交替层叠，其中导体布线层通过绝缘层通孔电连接，其中通孔填充有 导体材料，并且其中导体材料用合金接合到导体布线层。

公开(公告)号：US07410673B2

公开(公告)日：2008-08-12

申请号：US10920809

申请日：2004-08-18

申请人： Kiyoshi Sato ,  Kazunori Kitamura

发明人： Kiyoshi Sato ,  Kazunori Kitamura

IPC分类号： B05D3/02 ,  B05D3/10 ,  B05D3/12 ,  C08L63/10

CPC分类号： H05K3/4626 ,  C08F283/10 ,  C08G59/18 ,  C08L63/10 ,  H01L23/49894 ,  H01L2924/0002 ,  H05K3/0094 ,  H05K3/28 ,  H05K3/4602 ,  H05K2201/0959 ,  H05K2201/09881 ,  Y10T428/31511 ,  Y10T428/31515 ,  C08L63/00 ,  H01L2924/00

摘要： The thermosetting resin composition which is valuable for an undercoat of a printed wiring board, and does not leave an air bubble in a cured film, and makes the surface polishing easy and can form a smooth printed wiring board comprises (I) an adduct of epoxy resin with unsaturated aliphatic acid, (II) a (meth) acrylate, (III) a radical polymerization initiator, (IV) a crystallizable epoxy resin, and (V) a latent curing agent.

摘要翻译： 对印刷电路板的底涂层有价值且不在固化膜中留下气泡并使表面抛光容易并且可以形成光滑的印刷电路板的热固性树脂组合物包括（I）环氧树脂的加合物 具有不饱和脂肪酸的树脂，（II）（甲基）丙烯酸酯，（III）自由基聚合引发剂，（IV）可结晶环氧树脂和（V）潜伏性固化剂。

公开(公告)号：US07396885B2

公开(公告)日：2008-07-08

申请号：US10241459

申请日：2002-09-12

申请人： Kiyoshi Sato ,  Kazunori Kitamura

发明人： Kiyoshi Sato ,  Kazunori Kitamura

IPC分类号： C08L63/10

CPC分类号： H05K3/0094 ,  C08F283/10 ,  C08F290/00 ,  C08F290/06 ,  C08F290/064 ,  C08L63/00 ,  C08L63/10 ,  G03F7/038 ,  H05K3/287 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/0347 ,  H05K2201/09536 ,  H05K2201/0959 ,  C08L2666/22

摘要： A photo-setting and thermosetting resin composition comprises (I) a partial adduct of epoxy resin with unsaturated aliphatic acid, (II) (meth)acrylates, (III) a photocrosslinking agent, (IV) liquid epoxy resin, and (V) a latent curing agent. The resin composition can be easily charged and plugged into a through-hole, does not drip down, and can be effectively photo-set and thermoset. A photo-set product prepared of the resin composition can be easily polished. A plugged-through-hole printed wiring (substrate) board prepared of the resin composition does not cause defects such as hollows, cracks, blisters, peelings and so on, is excellent in solder-resistance, does not corrode a metal part, and can produce an appliance of high reliability and long life which does not occur short circuit and poor electrical connection.

摘要翻译： 光固性和热固性树脂组合物包含（I）环氧树脂与不饱和脂肪酸的部分加合物，（II）（甲基）丙烯酸酯，（III）光交联剂，（IV）液体环氧树脂和（V） 潜在固化剂。 树脂组合物可以容易地充填并堵塞到通孔中，不会滴落，并且可以有效地进行光固化和热固化。 可以容易地研磨由树脂组合物制备的光固化剂产品。 通过树脂组合物制成的通孔印刷布线（基板）板不会引起中空，裂纹，起泡，剥离等缺陷，耐焊接性优异，不会腐蚀金属部，能够 生产高可靠性，长寿命的电器，不会发生短路和电连接不良。

公开(公告)号：US06812299B2

公开(公告)日：2004-11-02

申请号：US10191126

申请日：2002-07-08

申请人： Kiyoshi Sato ,  Kazunori Kitamura

发明人： Kiyoshi Sato ,  Kazunori Kitamura

IPC分类号： C08L6310

CPC分类号： H05K3/4626 ,  C08F283/10 ,  C08G59/18 ,  C08L63/10 ,  H01L23/49894 ,  H01L2924/0002 ,  H05K3/0094 ,  H05K3/28 ,  H05K3/4602 ,  H05K2201/0959 ,  H05K2201/09881 ,  Y10T428/31511 ,  Y10T428/31515 ,  C08L63/00 ,  H01L2924/00

摘要： The thermosetting resin composition which is valuable for an undercoat of a printed wiring board, and does not leave an air bubble in a cured film, and makes the surface polishing easy and can form a smooth printed wiring board comprises (I) an adduct of epoxy resin with unsaturated aliphatic acid, (II) a (meth) arcylate, (III) a radical polymerization initiator, (IV) a crystallizable epoxy resin, and (V) a latent curing agent.

摘要翻译： 对印刷电路板的底涂层有价值且不在固化膜中留下气泡并使表面抛光容易并且可以形成光滑的印刷电路板的热固性树脂组合物包括（I）环氧树脂的加合物 具有不饱和脂肪酸的树脂，（II）（甲基）丙烯酸酯，（III）自由基聚合引发剂，（IV）可结晶环氧树脂和（V）潜伏性固化剂。

公开(公告)号：US08551819B2

公开(公告)日：2013-10-08

申请号：US13335015

申请日：2011-12-22

申请人： Kazunori Kitamura ,  Yasuhiro Takase

发明人： Kazunori Kitamura ,  Yasuhiro Takase

IPC分类号： H01L21/58 ,  C08L63/00 ,  C09J163/00

CPC分类号： C08G59/628 ,  C08G59/4021 ,  H01L2224/73204 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/15311 ,  H01L2924/00

摘要： Activated resinous composition contains, on the basis of epoxy resin being solid at a room temperature of 100 parts by weight, carboxylic acid compound of 1 to 10 parts by weight, hardening agent of 1 to 30 parts by weight, a hardening reaction initiation temperature of said hardening agent being 150° C. or higher, and solvent of 10 to 300 parts by weight.

摘要翻译： 活性树脂组合物在室温为100重量份的固体的环氧树脂的基础上，含有1〜10重量份的羧酸化合物，1〜30重量份的固化剂，硬化反应开始温度 所述硬化剂为150℃以上，溶剂为10〜300重量份。

公开(公告)号：US20050218803A1

公开(公告)日：2005-10-06

申请号：US11055311

申请日：2005-02-10

申请人： Kazuyoshi Takeuchi ,  Atsushi Kidokoro ,  Ryouichi Tomida ,  Kazunori Kitamura

发明人： Kazuyoshi Takeuchi ,  Atsushi Kidokoro ,  Ryouichi Tomida ,  Kazunori Kitamura

IPC分类号： C23C16/34 ,  C23C16/42 ,  H01L21/318 ,  H01L51/10 ,  H01L51/50 ,  H01L51/52 ,  H05B33/04 ,  H05B33/10

CPC分类号： C23C16/345 ,  H01L21/02164 ,  H01L21/0217 ,  H01L21/02211 ,  H01L21/02222 ,  H01L21/02274 ,  H01L21/02282 ,  H01L21/3185 ,  H01L51/5253

摘要： An EL device including an anode, an organic light emitting layer, and a cathode is formed on a glass substrate, and a sealing film made of Si and SiNx in which a ratio of the number of silicon atoms bonded to silicon atoms to the number of silicon atoms bonded to nitrogen atoms is equal to or larger than 0.6 but is equal to or smaller than 2.0 is formed on a surface of the EL element so as to cover the EL element.

摘要翻译： 包括阳极，有机发光层和阴极的EL器件形成在玻璃衬底上，并且由Si和SiN 制成的密封膜，其中硅原子数 与硅原子键合至与氮原子键合的硅原子数为0.6以上，并且在EL元件的表面上形成为2.0以上，以覆盖EL元件。

公开(公告)号：US20110031300A1

公开(公告)日：2011-02-10

申请号：US12846496

申请日：2010-07-29

申请人： Kazunori Kitamura ,  Yasuhiro Takase

发明人： Kazunori Kitamura ,  Yasuhiro Takase

IPC分类号： B23K31/02 ,  C08G65/08

CPC分类号： C08G59/628 ,  C08G59/4021 ,  H01L2224/73204 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/15311 ,  H01L2924/00

摘要： Activated resinous composition contains, on the basis of epoxy resin being solid at a room temperature of 100 parts by weight, carboxylic acid compound of 1 to 10 parts by weight, hardening agent of 1 to 30 parts by weight, a hardening reaction initiation temperature of said hardening agent being 150° C. or higher, and solvent of 10 to 300 parts by weight.

摘要翻译： 活性树脂组合物在室温为100重量份的固体的环氧树脂的基础上，含有1〜10重量份的羧酸化合物，1〜30重量份的固化剂，硬化反应开始温度 所述硬化剂为150℃以上，溶剂为10〜300重量份。