公开(公告)号：US08283661B2

公开(公告)日：2012-10-09

申请号：US13130408

申请日：2010-04-20

申请人： Kazutoshi Miyazawa ,  Akihisa Nakahashi

发明人： Kazutoshi Miyazawa ,  Akihisa Nakahashi

IPC分类号： H01L29/08 ,  H01L35/24 ,  H01L51/00 ,  H01L29/18 ,  H01L33/00 ,  H01L29/20 ,  H01L29/22 ,  H01L29/227 ,  H01L31/00 ,  H01L21/00 ,  H01L51/40

CPC分类号： H01L51/56 ,  H01L27/322 ,  H01L27/3244 ,  H01L51/5203 ,  H01L2251/5315 ,  H01L2251/568

摘要： Provided is an organic EL display manufacturing method which has: a step wherein an organic EL panel having a substrate and organic EL elements arranged in matrix on the substrate is prepared, and each organic EL element is permitted to have a pixel electrode disposed on the substrate, an organic layer disposed on the pixel electrode, a transparent counter electrode disposed on the organic layer, a sealing layer disposed on the transparent counter electrode, and a color filter disposed on the sealing layer; a step of detecting a defective portion on the organic layer in the organic EL element; and a step of breaking the transparent counter electrode in a region on the defective portion of the transparent counter electrode by irradiating the region on the defective portion with a laser beam. The laser beam is radiated by being tilted with respect to the normal line on the display surface of the organic EL panel.

摘要翻译： 提供了一种有机EL显示器制造方法，其具有以下步骤：制备具有衬底的有机EL面板和在衬底上以矩阵形式布置的有机EL元件的步骤，并且允许每个有机EL元件具有设置在衬底上的像素电极 设置在像素电极上的有机层，设置在有机层上的透明对电极，设置在透明对电极上的密封层和设置在密封层上的滤色器; 检测有机EL元件中有机层上的缺陷部分的步骤; 以及通过用激光束照射缺陷部分上的区域来在透明对电极的缺陷部分的区域中破坏透明对电极的步骤。 通过相对于有机EL面板的显示面上的法线倾斜来激发激光束。

公开(公告)号：US20110278603A1

公开(公告)日：2011-11-17

申请号：US13133352

申请日：2010-01-21

申请人： Kazutoshi Miyazawa ,  Akihisa Nakahashi

发明人： Kazutoshi Miyazawa ,  Akihisa Nakahashi

IPC分类号： H01L21/268 ,  H01L27/15

CPC分类号： H01L27/3281 ,  H01L27/322 ,  H01L51/5218 ,  H01L51/5221 ,  H01L51/5234 ,  H01L51/56 ,  H01L2251/5315 ,  H01L2251/568 ,  H05B33/10 ,  H05B33/26 ,  H05B33/28 ,  Y10S438/94

摘要： Disclosed is a method for manufacturing an organic EL display, which comprises: a step of preparing an organic EL panel that comprises a substrate and organic EL elements arranged as a matrix on the substrate, wherein each organic EL element has a pixel electrode arranged on the substrate, an organic layer arranged on the pixel electrode, a transparent counter electrode arranged on the organic layer, a protective layer arranged on the transparent counter electrode, and a color filter arranged on the protective layer, and a defect portion present in the organic layer in each organic EL element is detected; a step of destroying a region of the transparent counter electrode positioned above the defect portion by irradiating the region with laser light through the color filter; and a step wherein a region of the color filter positioned above the defect portion is removed.

摘要翻译： 本发明公开了一种有机EL显示器的制造方法，其特征在于，包括：将具有基板的基板和作为基体配置的有机EL元件的有机EL面板进行准备的工序，其中，各有机EL元件具有配置在所述基板上的像素电极 衬底，布置在像素电极上的有机层，布置在有机层上的透明对电极，布置在透明对电极上的保护层和布置在保护层上的滤色器，以及存在于有机层中的缺陷部分 检测每个有机EL元件; 通过将所述区域用激光照射穿过所述滤色器来破坏位于所述缺陷部分上方的所述透明对电极的区域的步骤; 以及去除位于缺陷部分上方的滤色器的区域的步骤。

公开(公告)号：US20110227104A1

公开(公告)日：2011-09-22

申请号：US13130408

申请日：2010-04-20

申请人： Kazutoshi Miyazawa ,  Akihisa Nakahashi

发明人： Kazutoshi Miyazawa ,  Akihisa Nakahashi

IPC分类号： H01L51/52 ,  H01L51/56

CPC分类号： H01L51/56 ,  H01L27/322 ,  H01L27/3244 ,  H01L51/5203 ,  H01L2251/5315 ,  H01L2251/568

摘要： Provided is an organic EL display manufacturing method which has: a step wherein an organic EL panel having a substrate and organic EL elements arranged in matrix on the substrate is prepared, and each organic EL element is permitted to have a pixel electrode disposed on the substrate, an organic layer disposed on the pixel electrode, a transparent counter electrode disposed on the organic layer, a sealing layer disposed on the transparent counter electrode, and a color filter disposed on the sealing layer; a step of detecting a defective portion on the organic layer in the organic EL element; and a step of breaking the transparent counter electrode in a region on the defective portion of the transparent counter electrode by irradiating the region on the defective portion with a laser beam. The laser beam is radiated by being tilted with respect to the normal line on the display surface of the organic EL panel.

摘要翻译： 提供了一种有机EL显示器制造方法，其具有以下步骤：制备具有衬底的有机EL面板和在衬底上以矩阵形式布置的有机EL元件的步骤，并且允许每个有机EL元件具有设置在衬底上的像素电极 设置在像素电极上的有机层，设置在有机层上的透明对电极，设置在透明对电极上的密封层和设置在密封层上的滤色器; 检测有机EL元件中有机层上的缺陷部分的步骤; 以及通过用激光束照射缺陷部分上的区域来在透明对电极的缺陷部分的区域中破坏透明对电极的步骤。 通过相对于有机EL面板的显示面上的法线倾斜来激发激光束。

公开(公告)号：US08772052B2

公开(公告)日：2014-07-08

申请号：US13133352

申请日：2010-01-21

申请人： Kazutoshi Miyazawa ,  Akihisa Nakahashi

发明人： Kazutoshi Miyazawa ,  Akihisa Nakahashi

IPC分类号： H01L21/00 ,  H01L27/32 ,  H01L51/52

CPC分类号： H01L27/3281 ,  H01L27/322 ,  H01L51/5218 ,  H01L51/5221 ,  H01L51/5234 ,  H01L51/56 ,  H01L2251/5315 ,  H01L2251/568 ,  H05B33/10 ,  H05B33/26 ,  H05B33/28 ,  Y10S438/94

摘要： Disclosed is a method for manufacturing an organic EL display, which comprises: a step of preparing an organic EL panel that comprises a substrate and organic EL elements arranged as a matrix on the substrate, wherein each organic EL element has a pixel electrode arranged on the substrate, an organic layer arranged on the pixel electrode, a transparent counter electrode arranged on the organic layer, a protective layer arranged on the transparent counter electrode, and a color filter arranged on the protective layer, and a defect portion present in the organic layer in each organic EL element is detected; a step of destroying a region of the transparent counter electrode positioned above the defect portion by irradiating the region with laser light through the color filter; and a step wherein a region of the color filter positioned above the defect portion is removed.

摘要翻译： 本发明公开了一种有机EL显示器的制造方法，其特征在于，包括：将具有基板的基板和作为基体配置的有机EL元件的有机EL面板进行准备的工序，其中，各有机EL元件具有配置在所述基板上的像素电极 衬底，布置在像素电极上的有机层，布置在有机层上的透明对电极，布置在透明对电极上的保护层和布置在保护层上的滤色器，以及存在于有机层中的缺陷部分 检测每个有机EL元件; 通过将所述区域用激光照射穿过所述滤色器来破坏位于所述缺陷部分上方的所述透明对电极的区域的步骤; 以及其中去除位于缺陷部分上方的滤色器的区域的步骤。

公开(公告)号：US20090166839A1

公开(公告)日：2009-07-02

申请号：US12342603

申请日：2008-12-23

申请人： Naoki Suzuki ,  Akihisa Nakahashi ,  Haneo Iwamoto ,  Manabu Gokan ,  Satoru Yuhaku

发明人： Naoki Suzuki ,  Akihisa Nakahashi ,  Haneo Iwamoto ,  Manabu Gokan ,  Satoru Yuhaku

IPC分类号： H01L23/48 ,  H01L21/02

CPC分类号： H01L25/0657 ,  H01L24/48 ,  H01L24/49 ,  H01L24/50 ,  H01L24/73 ,  H01L24/86 ,  H01L24/91 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/49 ,  H01L2224/73219 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/06572 ,  H01L2225/06579 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07811 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A semiconductor stack device having semiconductor chips stacked therein, wherein pads 4d of an uppermost semiconductor chip 2d are disposed on the side of a base substrate 1, and the pads 4d of the semiconductor chip 2d and electrodes 8d of the base substrate 1 are connected to each other via a flexible substrate 5 having circuit components 7 mounted thereon.

摘要翻译： 具有堆叠在其中的半导体芯片的半导体堆叠器件，其中最上半导体芯片2d的焊盘4d设置在基底衬底1的一侧，半导体芯片2d的焊盘4d和基底衬底1的电极8d连接到 彼此通过安装在其上的电路元件7的柔性基板5。

公开(公告)号：US20080185731A1

公开(公告)日：2008-08-07

申请号：US12022234

申请日：2008-01-30

申请人： Manabu Gokan ,  Akihisa Nakahashi ,  Koichi Nagai ,  Naoki Suzuki

发明人： Manabu Gokan ,  Akihisa Nakahashi ,  Koichi Nagai ,  Naoki Suzuki

IPC分类号： H01L23/498 ,  H01L21/58

CPC分类号： H01L25/0657 ,  G11C5/02 ,  H01L23/3157 ,  H01L24/13 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L25/0652 ,  H01L25/105 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2225/06575 ,  H01L2225/06586 ,  H01L2225/1005 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1076 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/0106 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/30105 ,  H01L2224/0401 ,  H01L2924/00

摘要： A stacked structure of semiconductor chips includes plural stacked semiconductor chips and plural tabular holding members which hold the respective semiconductor chips. At least two holding members among the holding members are arranged in places at ends of the semiconductor chips where inner side facets of the holding members are opposed to each other, at least one semiconductor chip of the two semiconductor chips held by the two holding members, respectively, is held by only one holding member of the holding members at one end of the semiconductor chip, and all or a part of the one semiconductor chip is arranged in the largest space positioned in an inner side of the inner side facet of the other holding member of the holding members, the largest space being formed by a surface including the one surface of the other holding member, a surface including the other surface of the other holding member, and a surface including a surface of the other semiconductor chip held by the other holding member, the other semiconductor chip being closer to the other holding member.

摘要翻译： 半导体芯片的堆叠结构包括多个堆叠半导体芯片和保持各个半导体芯片的多个平板状保持构件。 保持构件中的至少两个保持构件布置在保持构件的内侧面彼此相对的半导体芯片的端部的位置处，由两个保持构件保持的两个半导体芯片中的至少一个半导体芯片， 分别由半导体芯片的一端的保持构件的一个保持构件保持，并且一个半导体芯片的全部或一部分配置在位于另一个的内侧面的内侧的最大空间 保持构件的保持构件，由包括另一个保持构件的一个表面的表面形成的最大空间，包括另一个保持构件的另一个表面的表面以及包括由另一个保持构件的另一个表面保持的另一个半导体芯片的表面的表面 另一个保持构件，另一个半导体芯片更靠近另一个保持构件。

公开(公告)号：US08337267B2

公开(公告)日：2012-12-25

申请号：US12988659

申请日：2009-11-25

申请人： Noriyuki Suzuki ,  Shinsuke Komatsu ,  Akihisa Nakahashi

发明人： Noriyuki Suzuki ,  Shinsuke Komatsu ,  Akihisa Nakahashi

IPC分类号： H01J9/50

CPC分类号： H01L27/322 ,  H01L2251/568

摘要： There are provided an organic electro-luminescence device with filters and a method for repairing the same which are capable of reducing variations in conditions for leak-light transmission during leak-light detection and conditions for transmission of laser light used for repairing, depending on respective types of filters. An organic electro-luminescence device with a filter includes a first electrode in a side for extraction of light to outside; a second electrode placed oppositely to the first electrode; an electro-luminescence layer placed between the first electrode and the second electrode; a filter provided on a surface of the first electrode, the surface of the first electrode being opposite to another surface of the first electrode facing to the electro-luminescence layer, wherein the filter is adapted to transmit, therethrough, light in a certain-wavelength range out of the range of 400 nm to 700 nm; and a certain-wavelength absorption film placed between the filter and the electro-luminescence layer, wherein the certain-wavelength absorption film has a transmittance for light in the certain-wavelength range out of the range of 400 nm to 700 nm lower than its transmittance for light with wavelengths of 400 nm to 700 nm, wherein the certain-wavelength absorption film is adapted to absorb light in the certain-wavelength range.

摘要翻译： 提供一种具有滤光器的有机电致发光器件及其修复方法，其能够减少在泄漏光检测期间的泄漏光透射的条件的变化以及用于修复的激光的透射条件，这取决于相应的 过滤器类型 具有滤光器的有机电致发光器件包括在用于将光提取到外部的一侧的第一电极; 与所述第一电极相对放置的第二电极; 放置在第一电极和第二电极之间的电致发光层; 设置在所述第一电极的表面上的过滤器，所述第一电极的表面与所述第一电极的面对所述电致发光层的另一表面相对，其中所述过滤器适于透射通过所述第一电极的特定波长 范围在400nm至700nm的范围内; 以及放置在滤光器和电致发光层之间的一定波长吸收膜，其中特定波长吸收膜对于在比其透射率低400nm至700nm的范围内的一定波长范围内的光具有透射率 对于波长为400nm至700nm的光，其中所述特定波长吸收膜适于吸收一定波长范围内的光。

公开(公告)号：US07808094B2

公开(公告)日：2010-10-05

申请号：US12022234

申请日：2008-01-30

申请人： Manabu Gokan ,  Akihisa Nakahashi ,  Koichi Nagai ,  Naoki Suzuki

发明人： Manabu Gokan ,  Akihisa Nakahashi ,  Koichi Nagai ,  Naoki Suzuki

IPC分类号： H01L23/02

CPC分类号： H01L25/0657 ,  G11C5/02 ,  H01L23/3157 ,  H01L24/13 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L25/0652 ,  H01L25/105 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2225/06575 ,  H01L2225/06586 ,  H01L2225/1005 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1076 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/0106 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/30105 ,  H01L2224/0401 ,  H01L2924/00

摘要： A stacked structure of semiconductor chips includes plural stacked semiconductor chips and plural tabular holding members which hold the respective semiconductor chips. At least two holding members among the holding members are arranged in places at ends of the semiconductor chips where inner side facets of the holding members are opposed to each other, at least one semiconductor chip of the two semiconductor chips held by the two holding members, respectively, is held by only one holding member of the holding members at one end of the semiconductor chip, and all or a part of the one semiconductor chip is arranged in the largest space positioned in an inner side of the inner side facet of the other holding member of the holding members, the largest space being formed by a surface including the one surface of the other holding member, a surface including the other surface of the other holding member, and a surface including a surface of the other semiconductor chip held by the other holding member, the other semiconductor chip being closer to the other holding member.

摘要翻译： 半导体芯片的堆叠结构包括多个堆叠半导体芯片和保持各个半导体芯片的多个平板状保持构件。 保持构件中的至少两个保持构件布置在保持构件的内侧面彼此相对的半导体芯片的端部的位置处，由两个保持构件保持的两个半导体芯片中的至少一个半导体芯片， 分别由半导体芯片的一端的保持构件的一个保持构件保持，并且一个半导体芯片的全部或一部分配置在位于另一个的内侧面的内侧的最大空间 保持构件的保持构件，由包括另一个保持构件的一个表面的表面形成的最大空间，包括另一个保持构件的另一个表面的表面以及包括由另一个保持构件的另一个表面保持的另一个半导体芯片的表面的表面 另一个保持构件，另一个半导体芯片更靠近另一个保持构件。

公开(公告)号：US20090166838A1

公开(公告)日：2009-07-02

申请号：US12337267

申请日：2008-12-17

申请人： Manabu Gokan ,  Akihisa Nakahashi ,  Naoki Suzuki ,  Haneo Iwamoto ,  Satoru Yuhaku

发明人： Manabu Gokan ,  Akihisa Nakahashi ,  Naoki Suzuki ,  Haneo Iwamoto ,  Satoru Yuhaku

IPC分类号： H01L23/13

CPC分类号： G11C5/02 ,  G11C5/04 ,  G11C5/063 ,  H01L23/5387 ,  H01L25/0657 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73253 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06572 ,  H01L2225/06579 ,  H01L2924/15311 ,  H01L2924/15331

摘要： To provide a stacked mounting structure in which the number of semiconductor chips that can be stacked is greater than conventionally, as well as a method for fabricating the same, each semiconductor chip has electrodes provided at least at one end in the stacked mounting structure, and a board holding the semiconductor chips at the one end is folded with at least two of the semiconductor chips being stacked so as to at least partially overlap with each other.

摘要翻译： 为了提供其中可堆叠的半导体芯片的数量大于常规的堆叠安装结构以及其制造方法，每个半导体芯片具有设置在堆叠的安装结构中的至少一端，并且 将一端保持半导体芯片的板折叠成至少两个半导体芯片被堆叠成至少部分地彼此重叠。

公开(公告)号：US5897296A

公开(公告)日：1999-04-27

申请号：US710204

申请日：1996-09-13

申请人： Hideo Yamamoto ,  Koyo Shibuya ,  Takashi Satomura ,  Ichiro Morita ,  Noriyuki Fujiwara ,  Akihisa Nakahashi

发明人： Hideo Yamamoto ,  Koyo Shibuya ,  Takashi Satomura ,  Ichiro Morita ,  Noriyuki Fujiwara ,  Akihisa Nakahashi

IPC分类号： F04B49/06 ,  F04B17/04 ,  F04B35/04

CPC分类号： F04B35/04 ,  F04B2201/0201 ,  F04B2201/0207

摘要： A vibrating compressor of the present invention, which comprises a piston driving section for driving a piston by supplying a piston driving force, a displacement detecting section connected in an axial direction of the piston, an upper dead point position detecting section for detecting an upper dead point position based on a piston position signal from the displacement detecting section, and a driving force control section for changing the driving force supplied to the piston by the piston driving section according to a difference between the upper dead point position and a preset upper dead point position reference value immediately after the upper dead point position detecting section detects the upper dead point position, prevents its compression efficiency from decreasing due to stabilization and prevents a device from being damaged. In the vibrating compressor, it is also possible to calculate a stroke based on a detected piston position or to control the driving force based on a detected frequency.

摘要翻译： 本发明的振动压缩机包括通过提供活塞驱动力来驱动活塞的活塞驱动部，沿活塞的轴向连接的位移检测部，上死点位置检测部，用于检测上死点 基于来自位移检测部的活塞位置信号的点位置，以及驱动力控制部，其根据上死点位置和预设上死点之间的差来改变由活塞驱动部提供给活塞的驱动力 在上死点位置检测部分检测到上死点位置之后的位置参考值，防止其压缩效率由于稳定而降低，并且防止装置损坏。 在振动压缩机中，还可以基于检测到的活塞位置计算行程或者基于检测到的频率来控制驱动力。