公开(公告)号：US06476503B1

公开(公告)日：2002-11-05

申请号：US09606196

申请日：2000-06-29

申请人： Kazuyuki Imamura ,  Yasunori Fujimoto ,  Masaaki Seki ,  Tetsuya Fujisawa ,  Mitsutaka Sato ,  Ryuji Nomoto ,  Junichi Kasai ,  Yoshitaka Aiba ,  Noriaki Shiba

发明人： Kazuyuki Imamura ,  Yasunori Fujimoto ,  Masaaki Seki ,  Tetsuya Fujisawa ,  Mitsutaka Sato ,  Ryuji Nomoto ,  Junichi Kasai ,  Yoshitaka Aiba ,  Noriaki Shiba

IPC分类号： H01L2348

CPC分类号： H01L21/568 ,  H01L21/561 ,  H01L23/3114 ,  H01L23/3121 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/04105 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05568 ,  H01L2224/11003 ,  H01L2224/1134 ,  H01L2224/11822 ,  H01L2224/12105 ,  H01L2224/13011 ,  H01L2224/1308 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/16145 ,  H01L2224/274 ,  H01L2224/45144 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73267 ,  H01L2224/78301 ,  H01L2224/85205 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06572 ,  H01L2225/06582 ,  H01L2225/06586 ,  H01L2225/1023 ,  H01L2225/1029 ,  H01L2225/1058 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/3011 ,  H01L2924/3511 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/05644 ,  H01L2224/05124 ,  H01L2224/05144 ,  H01L2224/05147

摘要： A semiconductor device including a semiconductor chip sealed with an encapsulating resin. Columnar electrodes are connected to electrode pads of the semiconductor chip, and extend through the encapsulating resin. The columnar electrodes are made from bonding wires and include enlarged outer ends. Solder balls are arranged on the surface of the encapsulating resin and connected to the outer ends of the columnar electrodes. In another example, pin wires are formed by half-cutting bonding wires, bonding one end of each of the bonding wires, and cutting the bonding wires at the half-cut portions.

摘要翻译： 一种半导体器件，包括用封装树脂密封的半导体芯片。 柱状电极连接到半导体芯片的电极焊盘，并且延伸穿过封装树脂。 柱状电极由接合线制成，并且包括扩大的外端。 焊球布置在封装树脂的表面上并连接到柱状电极的外端。 在另一个例子中，通过半切割接合线，接合每个接合线的一端，以及在半切部分切割接合线来形成引线。

公开(公告)号：US06333564B1

公开(公告)日：2001-12-25

申请号：US09336747

申请日：1999-06-21

申请人： Yoshitsugu Katoh ,  Mitsutaka Sato ,  Hiroshi Inoue ,  Seiichi Orimo ,  Akira Okada ,  Yoshihiro Kubota ,  Mitsuo Abe ,  Toshio Hamano ,  Yoshitaka Aiba ,  Tetsuya Fujisawa ,  Masaaki Seki ,  Noriaki Shiba

发明人： Yoshitsugu Katoh ,  Mitsutaka Sato ,  Hiroshi Inoue ,  Seiichi Orimo ,  Akira Okada ,  Yoshihiro Kubota ,  Mitsuo Abe ,  Toshio Hamano ,  Yoshitaka Aiba ,  Tetsuya Fujisawa ,  Masaaki Seki ,  Noriaki Shiba

IPC分类号： H01L2348

CPC分类号： H01L23/3107 ,  H01L23/4334 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/96 ,  H01L24/97 ,  H01L25/0657 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2924/18165 ,  H01L2924/3511 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00015 ,  H01L2224/05599

摘要： A semiconductor device and a method of producing the same, the device including a semiconductor chip; balls which function as external connecting terminals; a substrate which electrically connects the semiconductor chip and the balls; a mold resin which seals at least a part of the semiconductor chip; and a connecting portion sealing resin which seals the connecting portion between the substrate and the semiconductor chip. The semiconductor device is mounted onto a printed circuit board via the balls. The thermal expansion coefficient of the mold resin is matched with the thermal expansion coefficient of the printed circuit board. A side surface holding portion for the holding the side surfaces of the semiconductor chip is formed in the mold resin to restrict thermal deformation of the semiconductor chip.

摘要翻译： 一种半导体器件及其制造方法，该器件包括半导体芯片; 作为外部连接端子的球; 电连接半导体芯片和滚珠的基板; 模制树脂，其密封半导体芯片的至少一部分; 以及密封基板和半导体芯片之间的连接部分的连接部密封树脂。 半导体器件通过球安装到印刷电路板上。 模制树脂的热膨胀系数与印刷电路板的热膨胀系数相匹配。 在模制树脂中形成用于保持半导体芯片的侧表面的侧表面保持部分，以限制半导体芯片的热变形。

公开(公告)号：US6125041A

公开(公告)日：2000-09-26

申请号：US931490

申请日：1997-09-16

申请人： Takamasa Yoshikawa ,  Noriaki Shiba ,  Atsuko Yamaguchi

发明人： Takamasa Yoshikawa ,  Noriaki Shiba ,  Atsuko Yamaguchi

IPC分类号： B42D15/10 ,  G06K19/077 ,  H05K1/18 ,  H05K5/02 ,  H05K1/14

CPC分类号： H05K5/0269 ,  H05K1/189

摘要： A card-type electronic device including at least a circuit board, wherein the circuit board includes a part mounting portion partially surrounded by a cutout portion and mechanically and electrically connected to other portion of the circuit board via a flexible supporting portion. The flexible supporting portion is bent so that a height position of the part mounting portion is different from a height position of a remaining portion of the circuit board.

摘要翻译： 一种卡式电子设备，至少包括电路板，其中所述电路板包括部分地被切口部分包围并通过柔性支撑部分机电连接到所述电路板的其它部分的部件安装部分。 柔性支撑部分被弯曲，使得部件安装部分的高度位置与电路板的剩余部分的高度位置不同。