摘要:
A film cartridge case which holds and carries therein a group of film cartridges for feeding sheets of undeveloped film loaded in their respective film cartridges to the development unit of an automatic photographic film development processor apparatus includes a plurality of cartridge pockets. Each pocket has a mispositioning preventing projection provided on one side of an inner wall thereof for engaging with a barcode readout window in the film cartridge upon the film cartridge being placed in the cartridge pocket in a correct orientation. The case includes holding members for detachably holding the film cartridges in their respective cartridge pockets. A conveyor element is arranged to be engaged by a conveying device. Film sheets can be loaded to and unloaded from respective film cartridges installed in the cartridge pockets.
摘要:
An automatic film development apparatus includes a cartridge case for carrying a group of film cartridges loaded with undeveloped films. A feeder unit stores a plurality of the cartridge cases and delivering them one by one to an unloading station for unloading sheets of undeveloped film from respective film cartridges in the cartridge case. The undeveloped film sheet is rewound at a rewinding station into a takeup cartridge. A splicer unit joins one end of the undeveloped film sheet from the takeup cartridge to a short film leader supplied from a film leader supply unit for feeding short film leaders one at the time. A development unit developes the undeveloped film sheet joined to the short film leader. A separator unit separates a developed film sheet from the short film leader. The developed film sheet separated from the short film leader is loaded at a loading station back into its film cartridge. A conveying means conveys the cartridge case filled with film cartridges unloaded of film from the unloading station to the loading station. A leader receiver unit collects short film leaders separated from respective developed film sheets.
摘要:
The films are developed and printed continuously and automatically even if the film feed direction in the film processor and the one in the printer are not in the same vertical plane. A film stocking unit is provided downstream of the film driving unit. The film stocking unit is movable to a position aligned with the film feed path extending to the printing unit. This increases the freedom or flexibility in arranging the film processor and the printer.
摘要:
Extra printing is made possible during a set of ordinary processing operations such as film development and printing. A film is developed and dried while being fed by a leader attached thereto. After cutting the leader from the film, it is fed to the printing unit to print the images on the film onto photographic paper. A plurality of film stocking units are provided in a path from the film drying unit to the printing unit. Each stocking unit can selectively stock a single film or allow it to pass without stocking. A second film stocking unit can move laterally to change the film track. If a film requiring a long exposure time is present in the printing unit, the subsequent films that have been developed and dried can be stocked in the other film stocking units. Thus, continuous film developing operations are not interrupted.
摘要:
A technology for a semiconductor integrated circuitry allows each of the DRAM memory cells to be divided finely so as to be more highly integrated and operate faster. In a method of manufacturing such a semiconductor integrated circuit, at first, gate electrodes 7 are formed via a gate insulating film 6 on the main surface of a semiconductor substrate 1, and on side surfaces of each of the gate electrodes there is formed a first side wall spacer 14 composed of silicon nitride and a second side wall spacer 15 composed of silicon oxide. Then, in the selecting MISFET Qs in the DRAM memory cell area there are opened connecting holes 19 and 21 in a self-matching manner with respect to the first side wall spacers 14 and connecting portion is formed connecting a conductor 20 to a bit line BL. In addition, in the N channel MISFETs Qn1 and Qn2, and in the P channel MISFET Qp1 in areas other than the DRAM memory cell area, high density N-type semiconductor areas 16 and 16b are formed, as well as a high density P-type semiconductor area 17 is formed in a self-matching manner with respect to the second side wall spacers 15.
摘要:
A fabrication method of a semiconductor integrated circuit device comprises, in an SAC process or HARC process, subjecting a semiconductor substrate to plasma etching to make contact holes in an oxide film made of a silicon oxide film formed on the semiconductor substrate. For improving the ease-in-etching property of the silicon oxide film and selectivity to a nitride film, a residence time of an etching gas within a chamber is so set as to be in a range where selectivity to an insulating film made of silicon nitride is improved by using etching conditions of a low pressure and a large flow rate of the etching gas of C5H8/O2/Ar.
摘要:
A technology for a semiconductor integrated circuitry allows each of the DRAM memory cells to be divided finely so as to be more highly integrated and operate faster. In a method of manufacturing such a semiconductor integrated circuit, at first, gate electrodes 7 are formed via a gate insulating film 6 on the main surface of a semiconductor substrate 1, and on side surfaces of each of the gate electrodes there is formed a first side wall spacer 14 composed of silicon nitride and a second side wall spacer 15 composed of silicon oxide. Then, in the selecting MISFET Qs in the DRAM memory cell area there are opened connecting holes 19 and 21 in a self-matching manner with respect to the first side wall spacers 14 and connecting portion is formed connecting a conductor 20 to a bit line BL. In addition, in the N channel MISFETs Qn1 and Qn2, and in the P channel MISFET Qp1 in areas other than the DRAM memory cell area, high density N-type semiconductor areas 16 and 16b are formed, as well as a high density P-type semiconductor area 17 is formed in a self-matching manner with respect to the second side wall spacers 15.
摘要:
Disclosed is apparatus for treating samples, and a method of using the apparatus. The apparatus includes processing apparatus (a) for treating the samples (e.g., plasma etching apparatus), (b) for removing residual corrosive compounds formed by the sample treatment, (c) for wet-processing of the samples and (d) for dry-processing the samples. A plurality of wet-processing treatments of a sample can be performed. The wet-processing apparatus can include a plurality of wet-processing stations. The samples can either be passed in series through the plurality of wet-processing stations, or can be passed in parallel through the wet-processing stations.
摘要:
Disclosed is apparatus for treating samples, and a method of using the apparatus. The apparatus includes processing apparatus (a) for treating the samples (e.g., plasma etching apparatus), (b) for removing residual corrosive compounds formed by the sample treatment, (c) for wet-processing of the samples and (d) for dry-processing the samples. A plurality of wet-processing treatments of a sample can be performed. The wet-processing apparatus can include a plurality of wet-processing stations. The samples can either be passed in series through the plurality of wet-processing stations, or can be passed in parallel through the wet-processing stations.