公开(公告)号：US4899327A

公开(公告)日：1990-02-06

申请号：US52115

申请日：1987-05-04

申请人： Keith A. Bates ,  Russell A. Budd ,  Millard A. Habegger ,  Mark L. Rhoades

发明人： Keith A. Bates ,  Russell A. Budd ,  Millard A. Habegger ,  Mark L. Rhoades

IPC分类号： G11B7/09 ,  G11B7/125

CPC分类号： G11B7/125 ,  G11B7/094 ,  G11B7/0945 ,  G11B7/0909

摘要： Error correction in a feedback servo system. The feedback servo loop in, for example, a head positioning circuit in an optical disk data recording and retrieval system is provided with means for forcing the feedback signal to zero when the head is positioned at best focus as determined by a peak in the laser monitoring diode. The head in such a system must be dynamically maintained at a best focus position but, through use and transporting, the alignment of the head position error detecting system can be disturbed. In some cases, the loop circuit parameters may drift from their original values. To correct for errors introduced from such causes, the head is positioned at best focus and the focus error (head position error) signal is sensed. A correction system forces the sensed value to zero, e.g, by adjusting the gain of amplifiers used in the feedback loop.

摘要翻译： 反馈伺服系统中的误差校正。 例如，在光盘数据记录和检索系统中的例如头部定位电路中的反馈伺服环路设置有当头部位于最佳焦点时强制反馈信号为零的装置，由激光监测中的峰值确定 二极管。 这种系统中的头部必须被动态地保持在最佳对焦位置，但是通过使用和传送，头部位置误差检测系统的对准可能受到干扰。 在某些情况下，环路电路参数可能偏离其原始值。 为了纠正从这些原因引起的错误，头部被定位在最佳焦点处，并且感测到聚焦误差（头位置误差）信号。 校正系统将感测值强制为零，例如通过调整在反馈回路中使用的放大器的增益。

公开(公告)号：US08411719B2

公开(公告)日：2013-04-02

申请号：US13358963

申请日：2012-01-26

申请人： Russell A. Budd ,  Paul Fortier ,  Frank R. Libsch

发明人： Russell A. Budd ,  Paul Fortier ,  Frank R. Libsch

IPC分类号： H01S5/00

CPC分类号： H01L27/1446 ,  G02B6/4201 ,  G02B6/4206 ,  G02B6/4245 ,  G02B6/4249 ,  G02B6/4257 ,  G02B6/4266 ,  G02B6/4269 ,  G02B6/428 ,  G02B6/4292 ,  H01L23/367 ,  H01L25/16 ,  H01L27/14625 ,  H01L2224/131 ,  H01L2924/01046 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15153 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/3011 ,  H01L2924/014 ,  H01L2924/00

摘要： An optoelectronic (OE) package or system and method for fabrication is disclosed which includes a silicon layer with a wiring layer. The silicon layer has an optical via for allowing light to pass therethrough. An optical coupling layer is bonded to the silicon layer, and the optical coupling layer includes a plurality of microlenses for focusing and or collimating the light through the optical via. One or more first OE elements are coupled to the silicon layer and electrically communicating with the wiring. At least one of the first OE elements positioned in optical alignment with the optical via for receiving the light. A second OE element embedded within the wiring layer. A carrier may be interposed between electrical interconnect elements and positioned between the wiring layer and a circuit board.

摘要翻译： 公开了一种用于制造的光电（OE）封装或系统和方法，其包括具有布线层的硅层。 硅层具有允许光通过的光通孔。 光耦合层结合到硅层，并且光耦合层包括多个微透镜，用于聚焦和/或准直光穿过光通孔。 一个或多个第一OE元件耦合到硅层并与布线电连通。 位于与用于接收光的光通孔光学对准的第一OE元件中的至少一个。 嵌入在布线层内的第二个OE元件。 载体可以介于电互连元件之间并且位于布线层和电路板之间。

公开(公告)号：US20130044979A1

公开(公告)日：2013-02-21

申请号：US13277767

申请日：2011-10-20

申请人： Russell A. Budd ,  Frank R. Libsch

发明人： Russell A. Budd ,  Frank R. Libsch

IPC分类号： G02B6/38 ,  G02B6/26

CPC分类号： G02B6/38 ,  G02B6/3817 ,  G02B6/4293 ,  G02B6/43

摘要： An optical cable including connectors includes a plurality of waveguide layers each including a plurality of optical channels each having a first end and a second end. First and second connectors each include a plurality of electrically conductive pins, and each of the plurality of optical channels of each of the waveguides, at their first and second ends, are connected to a specified pin on each of the first and second connectors, respectively. A first optical channel connection pattern on the first connector, and a second optical channel connection pattern on the second connector. The first optical channel connection pattern on the first connector is a different pattern than the second optical channel connection pattern on the second connector in relation to a connection hole pattern which is the same for both the first and second connectors.

摘要翻译： 包括连接器的光缆包括多个波导层，每个波导层包括多个光通道，每个光通道具有第一端和第二端。 第一和第二连接器各自包括多个导电引脚，并且每个波导的多个光通道中的每一个在其第一和第二端分别连接到第一和第二连接器中的每一个上的指定引脚 。 第一连接器上的第一光通道连接图案和第二连接器上的第二光通道连接图案。 第一连接器上的第一光通道连接图案是与第二连接器上的第二光通道连接图案相对于第一和第二连接器两者相同的连接孔图案不同的图案。

公开(公告)号：US20120326290A1

公开(公告)日：2012-12-27

申请号：US13604341

申请日：2012-09-05

申请人： Paul S. Andry ,  Russell A. Budd ,  Bing Dang ,  David Danovitch ,  Benjamin V. Fasano ,  Paul Fortier ,  Luc Guerin ,  Frank R. Libsch ,  Sylvain Ouimet ,  Chrirag S. Patel

发明人： Paul S. Andry ,  Russell A. Budd ,  Bing Dang ,  David Danovitch ,  Benjamin V. Fasano ,  Paul Fortier ,  Luc Guerin ,  Frank R. Libsch ,  Sylvain Ouimet ,  Chrirag S. Patel

IPC分类号： H01L23/34 ,  H01L21/50

CPC分类号： H01L27/1446 ,  G02B6/4204 ,  G02B6/4249 ,  G02B6/4257 ,  G02B6/428 ,  G02B6/4292 ,  H01L23/367 ,  H01L25/16 ,  H01L27/14625 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/73253 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15153 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/3011 ,  H01S5/005 ,  H01S5/0224 ,  H01S5/02248 ,  H01S5/02276 ,  H01S5/02284 ,  H01S5/02407 ,  H01S5/02476 ,  H01S5/183 ,  H01S5/423 ,  H01L2924/014 ,  H01L2924/00

摘要： An optoelectronic (OE) package or system and method for fabrication is disclosed which includes a silicon layer with wiring. The silicon layer has an optical via for allowing light to pass therethrough. An optical coupling layer is bonded to the silicon layer, and the optical coupling layer includes a plurality of microlenses for focusing and or collimating the light through the optical via. A plurality of OE elements are coupled to the silicon layer and electrically communicating with the wiring. At least one of the OE elements positioned in optical alignment with the optical via for receiving the light. A carrier is interposed between electrical interconnect elements. The carrier is positioned between the wiring of the silicon layer and a circuit board and the carrier is electrically connecting first interconnect elements connected to the wiring of the silicon layer and second interconnect elements connected to the circuit board.

摘要翻译： 公开了一种用于制造的光电（OE）封装或系统和方法，其包括具有布线的硅层。 硅层具有允许光通过的光通孔。 光耦合层结合到硅层，并且光耦合层包括多个微透镜，用于聚焦和/或准直光穿过光通孔。 多个OE元件耦合到硅层并与布线电连通。 至少一个OE元件被定位成与用于接收光的光通孔光学对准。 载体介于电互连元件之间。 载体位于硅层的布线和电路板之间，并且载体电连接到连接到硅层的布线的第一互连元件和连接到电路板的第二互连元件。

公开(公告)号：US07980445B2

公开(公告)日：2011-07-19

申请号：US12018421

申请日：2008-01-23

申请人： Russell A. Budd ,  John P. Karidis ,  Mark D. Schultz

发明人： Russell A. Budd ,  John P. Karidis ,  Mark D. Schultz

IPC分类号： B23K1/00 ,  B23K37/06 ,  B23K37/00 ,  B23K35/12

CPC分类号： H05K3/3457 ,  B23K1/0016 ,  B23K3/0638 ,  H05K2203/0113 ,  H05K2203/0126 ,  H05K2203/0338

摘要： A system, apparatus, and method, are provided to deposit conductive bonding material into cavities in a mold. A fill head is placed in substantial contact with a mold that includes cavities. The fill head includes a sealing member that substantially encompasses an entire area to be filled with conductive bonding material. The conductive bonding material is forced out of the fill head toward the mold. The conductive bonding material is provided into at least one cavity of the cavities contemporaneous with the at least one cavity being in proximity to the fill head.

摘要翻译： 提供一种系统，装置和方法，以将导电接合材料沉积在模具中的空腔中。 填充头被放置成与包括空腔的模具基本接触。 填充头包括密封构件，其基本上包围要填充有导电接合材料的整个区域。 导电接合材料被迫从模具顶端朝向模具。 导电接合材料设置在与填充头附近的至少一个空腔同时的空腔的至少一个空腔中。

公开(公告)号：US07891538B2

公开(公告)日：2011-02-22

申请号：US12542800

申请日：2009-08-18

申请人： Russell A. Budd ,  Frank R. Libsch ,  Jae-Woong Nah

发明人： Russell A. Budd ,  Frank R. Libsch ,  Jae-Woong Nah

IPC分类号： B23K31/02

CPC分类号： B23K1/0016 ,  B23K3/0623 ,  B23K3/087 ,  B23K2101/40 ,  B23K2101/42 ,  H01L21/4853 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/11005 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2924/0001 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01076 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3025 ,  H05K3/3478 ,  H05K2203/0113 ,  H05K2203/0292 ,  H05K2203/0338 ,  H05K2203/041 ,  H05K2203/0557 ,  H05K2203/105 ,  H01L2924/00 ,  H01L2224/05599

摘要： A mask having a plurality of through holes and a mold having a plurality of cavities are provided, and the through holes and the cavities are aligned. Conductive balls are dispensed into the aligned through holes and cavities. Substantially one ball is dispensed into each aligned through hole and cavity, and the mask with the holes and the cavities in the mold are configured and dimensioned such that the balls are substantially flush with, or recessed below, an outer surface of the mask. The mask is removed, the conductive balls are aligned with pads of a semiconductor device, and the conductive balls are transferred to the pads by fluxless reflow in a formic acid environment. Vibrational, electrostatic, and direct transfer aspects are also disclosed.

摘要翻译： 提供具有多个通孔的掩模和具有多个空腔的模具，并且通孔和空腔对齐。 导电球被分配到对准的通孔和空腔中。 基本上一个球被分配到每个对齐的通孔和空腔中，并且具有孔和模具中的空腔的掩模被配置和定尺寸使得球与掩模的外表面基本上齐平或凹入下方。 去除掩模，导电球与半导体器件的焊盘对准，并且通过无甲醛回流在甲酸环境中将导电球转移到焊盘。 还公开了振动，静电和直接转印方面。

公开(公告)号：US20100084438A1

公开(公告)日：2010-04-08

申请号：US12244145

申请日：2008-10-02

申请人： Glen Nelson Biggs ,  Russell A. Budd ,  Benjamin Vito Fasano ,  John Joseph Garant ,  G. Gerard Gormley ,  John Peter Karidis ,  Christopher Lee Tessler ,  Thomas Weiss

发明人： Glen Nelson Biggs ,  Russell A. Budd ,  Benjamin Vito Fasano ,  John Joseph Garant ,  G. Gerard Gormley ,  John Peter Karidis ,  Christopher Lee Tessler ,  Thomas Weiss

IPC分类号： B22D37/00 ,  B22D41/58

CPC分类号： B23K3/0638

摘要： An apparatus for dispensing fusible material onto a surface, wherein the fusible material is in molten form, is provided. The apparatus comprises a dispensing assembly comprising a seal structure. The seal structure controls dispensing of the fusible material. One or more gas injectors are coupled to the dispensing assembly. Each of the one or more gas injectors is adapted to inject at least one gas to the dispensing assembly for controlling a gas environment surrounding at least a portion of the seal structure. An oxidation rate of the fusible material is controlled as a function of at least one characteristic of the at least one gas.

摘要翻译： 提供了一种用于将易熔材料分配到表面上的装置，其中可熔材料处于熔融形式。 该装置包括一个包括密封结构的分配组件。 密封结构控制可熔材料的分配。 一个或多个气体喷射器联接到分配组件。 一个或多个气体喷射器中的每一个适于将至少一种气体喷射到分配组件，用于控制围绕密封结构的至少一部分的气体环境。 作为至少一种气体的至少一种特性的函数控制可熔材料的氧化速率。

公开(公告)号：US20090302096A1

公开(公告)日：2009-12-10

申请号：US12542800

申请日：2009-08-18

申请人： Russell A. Budd ,  Frank R. Libsch ,  Jae-Woong Nah

发明人： Russell A. Budd ,  Frank R. Libsch ,  Jae-Woong Nah

IPC分类号： B23K1/20

CPC分类号： B23K1/0016 ,  B23K3/0623 ,  B23K3/087 ,  B23K2101/40 ,  B23K2101/42 ,  H01L21/4853 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/11005 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2924/0001 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01076 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3025 ,  H05K3/3478 ,  H05K2203/0113 ,  H05K2203/0292 ,  H05K2203/0338 ,  H05K2203/041 ,  H05K2203/0557 ,  H05K2203/105 ,  H01L2924/00 ,  H01L2224/05599

摘要： A mask having a plurality of through holes and a mold having a plurality of cavities are provided, and the through holes and the cavities are aligned. Conductive balls are dispensed into the aligned through holes and cavities. Substantially one ball is dispensed into each aligned through hole and cavity, and the mask with the holes and the cavities in the mold are configured and dimensioned such that the balls are substantially flush with, or recessed below, an outer surface of the mask. The mask is removed, the conductive balls are aligned with pads of a semiconductor device, and the conductive balls are transferred to the pads by fluxless reflow in a formic acid environment. Vibrational, electrostatic, and direct transfer aspects are also disclosed.

摘要翻译： 提供具有多个通孔的掩模和具有多个空腔的模具，并且通孔和空腔对齐。 导电球被分配到对准的通孔和空腔中。 基本上一个球被分配到每个对齐的通孔和空腔中，并且具有孔和模具中的空腔的掩模被配置和定尺寸使得球与掩模的外表面基本上齐平或凹入下方。 去除掩模，导电球与半导体器件的焊盘对准，并且通过无甲醛回流在甲酸环境中将导电球转移到焊盘。 还公开了振动，静电和直接转印方面。

公开(公告)号：US07613368B2

公开(公告)日：2009-11-03

申请号：US10988220

申请日：2004-11-12

申请人： Gareth G. Hougham ,  Russell A. Budd ,  Punit P. Chiniwalla ,  Paul W. Coteus ,  Alphonso P. Lanzetta ,  Frank R. Libsch

发明人： Gareth G. Hougham ,  Russell A. Budd ,  Punit P. Chiniwalla ,  Paul W. Coteus ,  Alphonso P. Lanzetta ,  Frank R. Libsch

IPC分类号： G02B6/12

CPC分类号： G02B6/43

摘要： Integrated optoelectronic chips or collections of chips on a module that have both electrical as well as optical interconnects offer many advantages in speed, power consumption and heat generation. Mixed signal types, however, pose significant packaging challenges. This invention describes a land grid array (LGA) interposer which can simultaneously connect electrical and optical signals from a module to a printed circuit board.

摘要翻译： 集成的光电芯片或芯片集合在具有电和光互连的模块上，在速度，功耗和发热方面提供许多优点。 然而，混合信号类型构成重大的封装挑战。 本发明描述了一种能够将来自模块的电和光信号同时连接到印刷电路板的平面栅格阵列（LGA）插入器。

公开(公告)号：US07456046B2

公开(公告)日：2008-11-25

申请号：US11063449

申请日：2005-02-23

申请人： Leena Paivikki Buchwalter ,  Russell A. Budd ,  Chirag S. Patel

发明人： Leena Paivikki Buchwalter ,  Russell A. Budd ,  Chirag S. Patel

IPC分类号： H01L21/44

CPC分类号： H01L21/4853 ,  G01R1/0408 ,  G01R1/06716 ,  G01R1/07307 ,  H01L23/49811 ,  H01L23/562 ,  H01L24/81 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/351 ,  H01L2924/00

摘要： A method of producing flexible interconnections for integrated circuits, and, in particular, the forming of flexible or compliant interconnections preferably by a laser-assisted chemical vapor deposition process in semiconductor or glass substrate-based carriers which are employed for mounting and packaging multiple integrated circuit chips and selectively, other devices in the technology.

摘要翻译： 一种制造用于集成电路的柔性互连的方法，特别地，优选地通过半导体或基于玻璃衬底的载体中的激光辅助化学气相沉积工艺形成柔性或柔性互连件，所述方法用于安装和封装多个集成电路 芯片和选择性，其他设备的技术。