摘要:
An effluent monitoring apparatus 10 comprising an energizing cell 22 adapted to receive an effluent, a gas energizer 17 that is capable of energizing the effluent in the cell 22 thereby emitting a radiation, a radiation permeable window 27 that is spaced apart from the wall 36 of the 22 cell by a distance d that is sufficiently high to reduce a deposition of effluent residue from the energized gas on the window 27, and a detector 26 to detect the radiation.
摘要:
An apparatus and methods for an upgraded CVD system providing a remote plasma for efficiently cleaning a chamber, according to a specific embodiment. Etching or depositing a layer onto a substrate also may be achieved using the upgraded CVD system of the present invention. In a specific embodiment, the present invention provides apparatus for an easily removable, conveniently handled, and relatively inexpensive, robust microwave plasma source as a retrofit for or a removable addition to existing CVD apparatus. The present invention provides an improved CVD apparatus or retrofit of existing CVD apparatus capable of producing a remote plasma for efficiently cleaning the chamber.
摘要:
An apparatus and methods for an upgraded CVD system providing a remote plasma for efficiently cleaning a chamber, according to a specific embodiment. Etching or depositing a layer onto a substrate also may be achieved using the upgraded CVD system of the present invention. In a specific embodiment, the present invention provides apparatus for an easily removable, conveniently handled, and relatively inexpensive, robust microwave plasma source as a retrofit for or a removable addition to existing CVD apparatus. The present invention provides an improved CVD apparatus or retrofit of existing CVD apparatus capable of producing a remote plasma for efficiently cleaning the chamber.
摘要:
A target sputtering apparatus capable of monitoring target erosion has a sputtering chamber having a sputtering target with a sputtering surface. The apparatus can have a wireless receiver to receive a wireless signal and a controller to control the receiver and components of the sputtering chamber to sputter-deposit material on a substrate, and monitor erosion of the sputtering surface of the sputtering target. The controller also has a target erosion monitoring code that includes detection wafer transport program code to transport a detection wafer onto the support in the chamber, wherein the detection wafer generates a wireless signal in relation to an extent of erosion of the sputtered surface, and erosion determination code to analyze the wireless signal received by the wireless receiver and originating from the detection wafer to determine an extent of erosion of the sputtering surface of the sputtering target.
摘要:
An alignment mechanism for aligning a substrate on a support member in a process chamber includes a set of guide pins extending from the upper surface of the support member equally spaced about the periphery thereof and spaced to receive a substrate therebetween and align a shadow ring thereover. The inner surfaces of the guide pins are slanted outwardly to form an inverted funnel for receiving and aligning the substrate on the support member. An annular gas groove in the upper surface of the support member provides communication for a supply of purge gas and directs the gas about the peripheral edge of the substrate. The guide pins which extend partially over the gas groove include slots therein that provide fluid communication through the guide pins from the gas groove to the peripheral edge of the substrate. The guide pins also mate with alignment bores formed in the shadow ring so that, as the support member moves into the processing position, the inner surfaces of the guide pins abut abutment surfaces in the alignment bores and align the shadow ring on the support member and over the substrate. A hanger member supports and aligns the shadow ring between processing of each substrate.
摘要:
A light set with surface mounted light emitting components includes a first conducting wire and a second conducting wire disposed adjacent to the first conducting wire. The first and second conducting wires are correspondingly formed at a predetermined interval with a plurality of first and second contact-pad areas, respectively, at where a first and a second conductor of the first and the second conducting wire, respectively, are exposed. At least one surface mounted light emitting component is straddled on and between the corresponding first and the second contact-pad areas with two leads of the light emitting component electrically connected to the first and the second conductor via a conductive material, so that the surface mounted light emitting component and the first and second conducting wires are in an electrical contact state.
摘要:
A method of manufacturing an LED light string using a jig having a main body and a plurality of spiral grooves formed thereon adjacent to each other is provided. The method includes winding an electrical wire in each of the grooves, removing portions of the electrical wires to provide a plurality of spaced exposed segments at successive locations on each of the electrical wires, placing LED chips on at least some of the plurality of exposed segments formed in one of the electrical wires, connecting each LED chip to a corresponding exposed segment on a different electrical wire by a connector, and sealing each LED chip and connector. A jig for attaching one or more LED chips to a plurality of electrical wires is also provided.
摘要:
A method of manufacturing an LED light string using a jig having a main body and a plurality of spiral grooves formed thereon adjacent to each other is provided. The method includes winding an electrical wire in each of the grooves, removing portions of the electrical wires to provide a plurality of spaced exposed segments at successive locations on each of the electrical wires, placing LED chips on at least some of the plurality of exposed segments formed in one of the electrical wires, connecting each LED chip to a corresponding exposed segment on a different electrical wire by a connector, and sealing each LED chip and connector. A jig for attaching one or more LED chips to a plurality of electrical wires is also provided.
摘要:
A method of cleaning metal-containing deposits from a metal surface of a process chamber component includes immersing the metal surface in an electrochemical cleaning bath solution. A negative electrical bias is applied to the metal surface to electrochemically clean the metal-containing deposits from the metal surface. The cleaning method is capable of removing metal-containing deposits such as tantalum-containing deposits from the metal surface substantially without eroding the surface, and may be especially advantageous in the cleaning of components having textured surfaces.
摘要:
The LED bulb assembly includes a connector, an LED including two conductive wires, and means for attaching the LED to the connector and preventing the two conductive wires from contacting each other. The means for attaching the LED to the connector and preventing the two conductive wires from contacting each other may include a plate in the connector, and each of the two conductive wires extends along different sides of the plate. Alternatively, the means for attaching the LED to the connector and preventing the two conductive wires from contacting each other may include each of the conductive wires having a thickness such that the two conductive wires supports the LED while maintaining a gap between the two conductive wires.