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    LIGHTING DEVICE
    4.
    发明申请
    LIGHTING DEVICE 审中-公开
    照明设备

    公开(公告)号：US20100277083A1

    公开(公告)日：2010-11-04

    申请号：US12835149

    申请日：2010-07-13

    申请人： Kiyoshi Nishimura ,  Hirokazu Otake ,  Tomohiro Sanpei ,  Shuhei Matsuda

    发明人： Kiyoshi Nishimura ,  Hirokazu Otake ,  Tomohiro Sanpei ,  Shuhei Matsuda

    IPC分类号： H05B37/02

    CPC分类号： H05B33/089 ,  F21K9/232 ,  F21V3/00 ,  F21Y2115/10 ,  H01L2224/48091 ,  H01L2924/181 ,  H01L2924/19107 ,  H05B33/0812 ,  H05B33/0827 ,  H05K1/0262 ,  H05K2201/10106 ,  Y02B20/343 ,  Y10T156/1961 ,  H01L2924/00012 ,  H01L2924/00014

    摘要： According to one embodiment, a lighting device includes a device board, a rectification device connected to a commercial power supply, a series LED circuit, and a transistor (current limiter) which limits a maximum current flowing through the series LED circuit. The series circuit mounted on the device board is configured by connecting in series a plurality of LED elements. Each of the LED elements lights when an output voltage of the rectification device is applied to the series circuit. A number of LED elements included in the series circuit is set in a manner that a voltage applied to the series LED circuit is 70 to 90% of the output voltage of the rectification device.

    摘要翻译： 根据一个实施例，照明装置包括装置板，连接到商用电源的整流装置，串联LED电路和限制流过串联LED电路的最大电流的晶体管（限流器）。 安装在设备板上的串联电路通过串联连接多个LED元件而构成。 当整流装置的输出电压施加到串联电路时，每个LED元件点亮。 包括在串联电路中的多个LED元件被设置为施加到串联LED电路的电压是整流装置的输出电压的70至90％的方式。

    LIGHT-EMITTING MODULE AND ILLUMINATION DEVICE
    6.
    发明申请
    LIGHT-EMITTING MODULE AND ILLUMINATION DEVICE 审中-公开
    发光模块和照明装置

    公开(公告)号：US20110305017A1

    公开(公告)日：2011-12-15

    申请号：US13159736

    申请日：2011-06-14

    申请人： Tomohiro Sanpei

    发明人： Tomohiro Sanpei

    IPC分类号： F21V7/10 ,  F21V7/22

    CPC分类号： H05K1/056 ,  F21K9/68 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/73265 ,  H05K3/284 ,  H05K2201/0209 ,  H05K2201/10106 ,  H05K2201/2054 ,  H01L2924/00014 ,  H01L2924/00

    摘要： According to one embodiment, a light-emitting module comprises a module substrate, a light-reflecting layer, a plurality of light-emitting elements, and a sealing material. The module substrate includes an insulating layer formed of at least one of a glycidyl ester-type, linear aliphatic epoxide-type, and alicyclic epoxide-type resin. The light-reflecting layer is superposed on the insulating layer, and includes a silver light-reflecting surface. The light-emitting elements are mounted on the module substrate. The sealing material has light transmittance, and superposed on the insulating layer to cover the light-reflecting layer and the light-emitting elements.

    摘要翻译： 根据一个实施例，发光模块包括模块基板，光反射层，多个发光元件和密封材料。 模块基板包括由缩水甘油酯型，直链脂族环氧化物型和脂环族环氧树脂型树脂中的至少一种形成的绝缘层。 光反射层重叠在绝缘层上，并且包括银光反射表面。 发光元件安装在模块基板上。 密封材料具有透光性，并且叠加在绝缘层上以覆盖光反射层和发光元件。

    Light-emitting device.having a frame member surrounding light-emitting elements and illumination device utilizing light-emitting device
    7.
    发明授权
    Light-emitting device.having a frame member surrounding light-emitting elements and illumination device utilizing light-emitting device 有权
    发光装置具有围绕发光元件的框架构件和利用发光装置的照明装置

    公开(公告)号：US08354783B2

    公开(公告)日：2013-01-15

    申请号：US12885005

    申请日：2010-09-17

    申请人： Erika Takenaka ,  Tomohiro Sanpei ,  Takeo Idezuki

    发明人： Erika Takenaka ,  Tomohiro Sanpei ,  Takeo Idezuki

    IPC分类号： H01J5/50

    CPC分类号： F21K9/23 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/181 ,  H01L2933/005 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

    摘要： According to one embodiment, a light-emitting device includes a substrate including power-supply conductors, a frame member, and a sealing member. The power-supply conductors are formed on the substrate. A plurality of light-emitting elements including electrodes are mounted on the substrate. The electrodes of the light-emitting elements adjacent to the power-supply conductors are electrically connected to the power-supply conductors by a plurality of bonding wires. The frame member is made of resin which is coated on the substrate so as to surround the light-emitting elements and the bonding wires. The sealing member is filled in an area surrounded by the frame member and seals the light-emitting elements and the bonding wires.

    摘要翻译： 根据一个实施例，发光装置包括包括电源导体，框架构件和密封构件的基板。 电源导体形成在基板上。 包括电极的多个发光元件安装在基板上。 与电源导体相邻的发光元件的电极通过多根接合线电连接到电源导体。 框架构件由涂覆在基板上以围绕发光元件和接合线的树脂制成。 密封构件填充在由框架构件包围的区域中，并且密封发光元件和接合线。

    Self-ballasted lamp and lighting equipment
    8.
    发明授权
    Self-ballasted lamp and lighting equipment 失效
    自镇流灯和照明设备

    公开(公告)号：US08324789B2

    公开(公告)日：2012-12-04

    申请号：US12886025

    申请日：2010-09-20

    申请人： Takeshi Hisayasu ,  Kazuto Morikawa ,  Yusuke Shibahara ,  Makoto Sakai ,  Tomohiro Sanpei

    发明人： Takeshi Hisayasu ,  Kazuto Morikawa ,  Yusuke Shibahara ,  Makoto Sakai ,  Tomohiro Sanpei

    IPC分类号： H01J1/02

    CPC分类号： F21V3/00 ,  F21K9/23 ,  F21V23/002 ,  F21V29/773 ,  F21Y2115/10

    摘要： A base body having a base body portion and a plurality of heat radiating fins disposed on the circumference of the base body portion is provided. On one end side of the base body, a light-emitting module having semiconductor light-emitting elements, and a globe that covers the light-emitting module are provided. A cap is provided on the other end side of the base boy. A lighting circuit is housed between the base body and the cap. The lamp total length from the globe to the cap is 70 to 120 mm, and the area of a surface of the base body which is exposed to the outside per 1 W of power charged to the light-emitting module is 20.5 to 24.4 cm2/W.

    摘要翻译： 提供具有基体部的基体和设置在基体部的圆周上的多个散热片。 在基体的一端侧设置有具有半导体发光元件的发光模块和覆盖发光模块的球面。 在基础男孩的另一端设置帽。 照明电路容纳在基体和盖之间。 从球体到盖的灯总长度为70至120mm，并且每1W向发光组件充电的功率暴露于外部的基体的表面面积为20.5至24.4cm2 / W.

    SELF-BALLASTED LAMP AND LIGHTING EQUIPMENT
    10.
    发明申请
    SELF-BALLASTED LAMP AND LIGHTING EQUIPMENT 审中-公开
    自封灯和照明设备

    公开(公告)号：US20100327751A1

    公开(公告)日：2010-12-30

    申请号：US12825956

    申请日：2010-06-29

    申请人： Erika Takenaka ,  Shigeru Osawa ,  Yusuke Shibahara ,  Takeshi Hisayasu ,  Kazuto Morikawa ,  Tomohiro Sanpei ,  Mokoto Sakai

    发明人： Erika Takenaka ,  Shigeru Osawa ,  Yusuke Shibahara ,  Takeshi Hisayasu ,  Kazuto Morikawa ,  Tomohiro Sanpei ,  Mokoto Sakai

    IPC分类号： H01J13/32 ,  H05B37/02

    CPC分类号： F21V23/002 ,  F21K9/232 ,  F21K9/233 ,  F21V3/061 ,  F21V3/062 ,  F21V29/773 ,  F21Y2115/10

    摘要： The present invention provides a self-ballasted lamp which efficiently conducts heat of a plurality of LED chips of a light emitting module to its holder, and can prevent the temperature rise of the LED chips. The holder has a base portion, an edge portion provided at one end side of the base portion, which is thick at the base portion side thereof and thin at the distal end side thereof, and heat radiation fins provided at the other end side from the edge part and at the circumference of the base portion. The heat from the semiconductor light emitting elements is conducted from the base portion to the edge part and radiated therefrom. At this time, the edge part is thickened at the base portion side, wherein the thermal capacity is increased, and the heat conduction is improved.

    摘要翻译： 本发明提供了一种自发镇流灯，其有效地将发光模块的多个LED芯片的热量传导到其保持器，并且可以防止LED芯片的温度升高。 保持器具有基部，设置在基部的一端侧的边缘部，其基部侧较厚，其前端侧较薄，并且设置在另一端侧的散热片 边缘部分和基部的圆周处。 来自半导体发光元件的热量从基部传导到边缘部分并从其辐射。 此时，边缘部分在基部侧增厚，其中热容量增加，并且热传导得到改善。