摘要:
The present invention relates to a light-emitting diode chip. According to the present invention, the light-emitting diode chip comprises: a substrate, the thickness of which is greater than 120 μm; and a light-emitting diode provided on the surface of the substrate, at one side thereof.
摘要:
Disclosed herein are a light emitting diode package and a method of manufacturing the same. The light emitting diode package includes: a substrate, a light-emitting layer disposed on a surface of the substrate and including a first type semiconductor layer, an active layer, and a second type semiconductor layer, a first bump disposed on the first type semiconductor layer and a second bump disposed the second type semiconductor layer, a protective layer covering at least the light-emitting layer, and a first bump pad and a second bump pad disposed on the protective layer and connected to the first bump and the second bump, respectively.
摘要:
The present invention relates to a light emitting diode and a method of manufacturing same. The light emitting diode includes: a first conductive semiconductor layer; a plurality of mesas that are disposed spaced apart from one another on the first conductive semiconductor layer, each mesa including an active layer and a second conductive semiconductor layer; reflective electrodes that are respectively disposed on the plurality of mesas and come into ohmic contact with the second conductive semiconductor layer; openings that cover the plurality of mesas and the first conductive semiconductor layer, are electrically insulated from the mesas, and expose the reflective electrodes to the upper region of each mesa; and a current spreading layer that comes into ohmic contact with the first conductive semiconductor layer. Thus, a light emitting diode that improves current spreading performance may be provided.
摘要:
An exemplary embodiment of the present invention discloses a light emitting diode including a substrate having a first edge and a second edge opposite to each other, a light emitting structure disposed on the substrate, the light emitting structure including a first semiconductor layer and a second semiconductor layer, a plurality of first electrode pads arranged on an upper surface of the first semiconductor layer, the first electrode pads arranged in a vicinity of the first edge, a plurality of second electrode pads arranged on the second semiconductor layer, the second electrode pads arranged in a vicinity of the second edge, a plurality of first extensions, each first extension extending from a first electrode pad, and a plurality of second extensions, each second extension extending from a second electrode pad. The first extensions include intrusion parts extending in a direction from the first edge to the second edge, wherein the intrusion parts are spaced apart from each other and not connecting with the second electrode pads. Further, the second extensions include intrusion parts extending in a direction from the second edge to the first edge, wherein the first extension intrusion parts each extend into a region between two of the second extension intrusion parts.
摘要:
The present invention is directed to a light emitting diode (LED) assembly and a method for fabricating the same. According to the present invention, there is provided an LED assembly comprising an LED comprising at least an N-type semiconductor layer and a P-type semiconductor layer; and bumps provided on the LED and electrically connected to the semiconductor layers, wherein the bump comprises a first region made of a gold (Au) compound including tin (Sn) and a second region made of gold.
摘要:
The present invention is directed to a light emitting diode (LED) assembly and a method for fabricating the same. According to the present invention, there is provided an LED assembly comprising an LED comprising at least an N-type semiconductor layer and a P-type semiconductor layer; and bumps provided on the LED and electrically connected to the semiconductor layers, wherein the bump comprises a first region made of a gold (Au) compound including tin (Sn) and a second region made of gold.
摘要:
Disclosed herein is a method for displaying information about the use of a hack tool in the online game. When a game IDentification (ID) is input, a client system accesses a security server, and requests and receives the number of times that one or more hack tools have been used for the game ID. The client system provides the game ID and the number of times that hack tools have been used to a game server so that the number of times that hack tools have been used is shared by one or more gamers who participate in the game provided by the game server. When the client system detects the use of a hack tool, the client system increases the number of times that hack tools have been used for the game ID by 1, and provides the number of times that hack tools have been used to the security server.
摘要:
The present invention is related to an apparatus and a method for controlling operations of low sound output in an audio system. Embodiments of an apparatus and a method for controlling an operation of an audio woofer in a machine provided with an audio system such as a portable computer can operate using at least one or more information of an audio data type, an audio signal, an audio channel number and a power source. Therefore, it is possible to accurately select and listen to an audio of a high-pass component only by stopping operations of a low-pass component for an audio as reproduced. In addition, embodiments of the present invention can extend a time for using a battery by controlling operations of a woofer, when using the battery power.
摘要:
An apparatus for embolic treatment including a high frequency power source and at least one induction coil connected to the high frequency power source which is positioned around the vicinity of diseased vasculature of the body of a patient for generating an eddy current in the metallic coil inserted into the vascular malformation of the diseased vasculature. The eddy current in the metallic coil generates heat which coagulates and contracts the vascular malformation.
摘要:
Disclosed herein is a method for displaying information about the use of a hack tool in the online game. When a game IDentification (ID) is input, a client system accesses a security server, and requests and receives the number of times that one or more hack tools have been used for the game ID. The client system provides the game ID and the number of times that hack tools have been used to a game server so that the number of times that hack tools have been used is shared by one or more gamers who participate in the game provided by the game server. When the client system detects the use of a hack tool, the client system increases the number of times that hack tools have been used for the game ID by 1, and provides the number of times that hack tools have been used to the security server.