Method for the deposition of a ruthenium-containing film
    1.
    发明授权
    Method for the deposition of a ruthenium-containing film 有权
    沉积含钌膜的方法

    公开(公告)号:US08753718B2

    公开(公告)日:2014-06-17

    申请号:US13773354

    申请日:2013-02-21

    IPC分类号: C23C16/00 H01L21/02

    摘要: The invention concerns the use of the ruthenium-containing precursor having the formula (Rn-chd)Ru(CO)3, wherein: (Rn-chd) represents a cyclohexadiene (chd) ligand substituted with n substituents R, any R being in any position on the chd ligand; n is an integer comprised between 1 and 8 (1≦n≦8) and represents the number of substituents on the chd ligand; R is selected from the group consisting of C1-C4 linear or branched alkyls, alkylamides, alkoxides, alkylsilylamides, amidinates, carbonyl and/or fluoroalkyl for R being located in any of the eight available position on the chd ligand, while R can also be oxygen O for substitution on the C positions in the chd cycle which are not involved in a double bond for the deposition of a Ru containing film on a substrate.

    摘要翻译: 本发明涉及具有式(Rn-chd)Ru(CO)3的含钌前体的用途,其中:(Rn-chd)表示被n个取代基R取代的环己二烯(chd)配体,任何R均为任何 在配体上的位置; n是1至8(1≦̸ n≦̸ 8)之间的整数,并且表示chd配体上的取代基数; R选自C1-C4直链或支链烷基,烷基酰胺,烷氧基化物,烷基甲硅烷基酰胺,脒基,羰基和/或氟烷基,其中R位于chd配体上的八个可用位置中的任一个中,而R也可以是 用于在chd循环中的C位置上用于在基底上沉积含Ru膜的双键中的氧气。

    Titanium-aluminum alloy deposition with titanium-tetrahydroaluminate bimetallic molecules
    3.
    发明授权
    Titanium-aluminum alloy deposition with titanium-tetrahydroaluminate bimetallic molecules 有权
    钛 - 铝合金沉积与四氢铝酸双金属分子

    公开(公告)号:US09187511B2

    公开(公告)日:2015-11-17

    申请号:US13780212

    申请日:2013-02-28

    IPC分类号: C07F19/00 C07F5/06

    CPC分类号: C07F19/005 C07F5/06

    摘要: Disclosed are titanium-tetrahydroaluminates precursors, their method of manufacture, and their use in the deposition of titanium-aluminum-containing films. The disclosed precursors have the formulae Ti(AlH4)3—X, Ti(AlH4)2L and Ti(AlH4)L2. The disclosed precursors may be used to deposit pure titanium-aluminum (TiAl), titanium-aluminum nitride (TiAlN), titanium-aluminum carbide (TiAlC), titanium-aluminum carbonitride (TiAlCN), titanium-aluminum silicide ((TiAl)Si), titanium-aluminum siliconitride ((TiAl)SiN), titanium-aluminum boron ((TiAl)B), titanium-aluminum boron nitride ((TiAl)BN), or titanium-aluminum oxide (TiAlO). or any other titanium-aluminum-containing films. The titanium-aluminum-containing films may be deposited using the disclosed precursors in thermal and/or plasma-enhanced CVD, ALD, pulse CVD or any other type of depositions methods.

    摘要翻译: 公开了钛 - 四氢铝酸盐前体,其制造方法及其在沉积含钛铝膜中的用途。 所公开的前体具有式Ti(AlH 4)3-X,Ti(AlH 4)2 L和Ti(AlH 4)2 L)。 所公开的前体可用于沉积纯钛 - 铝(TiAl),钛 - 氮化铝(TiAlN),钛 - 碳化铝(TiAlC),钛 - 铝碳氮化物(TiAlCN),钛 - 硅化铝((TiAl)Si) ,钛 - 铝硅氮化物((TiAl)SiN),钛 - 铝硼((TiAl)B),钛 - 氮化硼((TiAl)BN))或钛 - 氧化铝(TiAlO)。 或任何其它含钛铝膜。 可以使用所公开的前体在热和/或等离子体增强CVD,ALD,脉冲CVD或任何其它类型的沉积方法中沉积含钛铝膜。