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    POSITION SENSITIVE DETECTION OPTIMIZATION
    3.
    发明申请
    POSITION SENSITIVE DETECTION OPTIMIZATION 有权
    位置敏感检测优化

    公开(公告)号：US20140103188A1

    公开(公告)日：2014-04-17

    申请号：US13982109

    申请日：2012-01-27

    申请人： Manjusha Mehendale ,  Michael Kotelyanskii ,  Priya Mukundhan ,  Michael Colgan ,  Wei Zhou

    发明人： Manjusha Mehendale ,  Michael Kotelyanskii ,  Priya Mukundhan ,  Michael Colgan ,  Wei Zhou

    IPC分类号： G01J1/04 ,  G01N21/47

    CPC分类号： G01J1/0448 ,  G01N21/1702 ,  G01N21/1717 ,  G01N21/47 ,  G01N21/55 ,  G01N21/636 ,  G01N21/9501

    摘要： An automatically adjustable method for use in opto-acoustic metrology or other types of metrology operations is described. The method includes modifying the operation of a metrology system that uses a PSD style sensor arrangement. The method may be used to quickly adjust the operation of a metrology system to ensure that the data obtained therefrom are of the desired quality. Further, the method is useful in searching for and optimizing data that is or can be correlated to substrate or sample features or characteristics that of interest. Apparatus and computer readable media are also described.

    摘要翻译： 描述了一种用于光声测量或其他类型计量操作的自动调节方法。 该方法包括修改使用PSD风格传感器装置的计量系统的操作。 该方法可以用于快速调整计量系统的操作，以确保从其获得的数据具有期望的质量。 此外，该方法可用于搜索和优化与底物或样品特征或感兴趣的特征相关或可以相关的数据。 还描述了装置和计算机可读介质。

    Structure Model description and use for scatterometry-based semiconductor manufacturing process metrology
    4.
    发明申请
    Structure Model description and use for scatterometry-based semiconductor manufacturing process metrology 审中-公开
    结构模型描述和用于基于散射的半导体制造过程计量学

    公开(公告)号：US20090306941A1

    公开(公告)日：2009-12-10

    申请号：US12227387

    申请日：2007-05-14

    申请人： Michael Kotelyanskii ,  Xueping Ru ,  Robert G. Wolf ,  Yue Yang

    发明人： Michael Kotelyanskii ,  Xueping Ru ,  Robert G. Wolf ,  Yue Yang

    IPC分类号： G06F17/50

    CPC分类号： G01N23/20

    摘要： A method includes accessing a structure model defining a cross-sectional profile of a structure on a sample. The cross-sectional profile is at least partially defined using a set of blocks. Each of the blocks includes a number of vertices. One or more of the vertices are expressed using one or more algebraic relationships between a number of parameters corresponding to the structure. Information is evaluated from the structure model to produce expected metrology data for a scatterometry-based optical metrology. The expected metrology data is suitable for use for determining one or more of the number of parameters corresponding to the structure. Apparatus are also disclosed.

    摘要翻译： 一种方法包括访问定义样本上的结构的横截面轮廓的结构模型。 使用一组块至少部分地限定横截面轮廓。 每个块包括多个顶点。 一个或多个顶点使用与该结构相对应的多个参数之间的一个或多个代数关系来表示。 从结构模型评估信息，以产生用于基于散射法的光学计量学的预期计量数据。 期望的测量数据适用于确定与该结构相对应的参数数量中的一个或多个。 还公开了装置。

    MEASURING ELASTIC MODULI OF DIELECTRIC THIN FILMS USING AN OPTICAL METROLOGY SYSTEM
    5.
    发明申请
    MEASURING ELASTIC MODULI OF DIELECTRIC THIN FILMS USING AN OPTICAL METROLOGY SYSTEM 有权
    使用光学计量系统测量介质薄膜的弹性模量

    公开(公告)号：US20060072120A1

    公开(公告)日：2006-04-06

    申请号：US10960351

    申请日：2004-10-06

    申请人： Sean Leary ,  Guray Tas ,  Christopher Morath ,  Michael Kotelyanskii ,  Tong Zheng ,  Guenadiy Lazarov ,  Andre Miller ,  George Antonelli ,  Jamie Ludke

    发明人： Sean Leary ,  Guray Tas ,  Christopher Morath ,  Michael Kotelyanskii ,  Tong Zheng ,  Guenadiy Lazarov ,  Andre Miller ,  George Antonelli ,  Jamie Ludke

    IPC分类号： G01B11/02

    CPC分类号： G01N21/211 ,  G01N21/8422

    摘要： An optical metrology system is provided with a data analysis method to determine the elastic moduli of optically transparent dielectric films such as silicon dioxide, other carbon doped oxides over metal or semiconductor substrates. An index of refraction is measured by an ellipsometer and a wavelength of a laser beam is measured using a laser spectrometer. The angle of refraction is determined by directing a light pulse focused onto a wafer surface, measuring a first set of x1, y1, and z1 coordinates, moving the wafer in the z direction, directing the light pulse onto the wafer surface and measuring a second set of x2, y2 and z2 coordinates, using the coordinates to calculate an angle of incidence, calculating an angle of refraction from the calculated angle of incidence, obtaining a sound velocity v, from the calculated angle of refraction and using the determined sound velocity v, to calculate a bulk modulus. Hardware calibration and adjustments for the optical metrology system are also provided in order to minimize the variation of the results from tool to tool down to about 0.5% or below.

    摘要翻译： 光学测量系统具有数据分析方法，以确定光学透明介电膜的弹性模量，例如二氧化硅，金属或半导体衬底上的其他碳掺杂氧化物。 使用椭偏仪测量折射率，使用激光光谱仪测量激光束的波长。 通过将聚焦在晶片表面上的光脉冲引导，测量第一组x 1，y 1和z 1，确定折射角， SUB>坐标，沿z方向移动晶片，将光脉冲引导到晶片表面上并测量第二组x 2，y 2和z 2， 2坐标，使用坐标来计算入射角，从计算的入射角计算折射角，从计算的折射角获得声速v，并使用确定的声速v，到 计算体积模量。 还提供了光学测量系统的硬件校准和调整，以便将结果从工具到工具的降低最小化到约0.5％或更低。

    Combined ultra-fast x-ray and optical system for thin film measurements
    6.
    发明申请
    Combined ultra-fast x-ray and optical system for thin film measurements 审中-公开
    组合的超快速x射线和光学系统用于薄膜测量

    公开(公告)号：US20060256916A1

    公开(公告)日：2006-11-16

    申请号：US11129282

    申请日：2005-05-13

    申请人： Michael Kotelyanskii ,  Andrey Vertikov ,  Christopher Morath

    发明人： Michael Kotelyanskii ,  Andrey Vertikov ,  Christopher Morath

    IPC分类号： G01N23/20

    CPC分类号： G01N23/20

    摘要： A system comprising a means for generating an optical pump beam pulse and for directing the optical pump beam pulse to a first area of a surface of a sample having a plurality of film layers to generate an acoustic signal, a means for generating an x-ray probe pulse and for directing the x-ray probe pulse to a second area of the surface, a means for detecting an intensity of a diffracted x-ray probe pulse the intensity varying in response to the acoustic signal to form a probe pulse response signal, and a means for calculating an expected transient response to a theoretical acoustic signal propagated through a model of the sample and fitting the probe pulse response to the transient response to derive at least one characteristic of the sample.

    摘要翻译： 一种系统，包括用于产生光泵浦波束脉冲并用于将光泵浦波束脉冲引导到具有多个膜层的样品的表面的第一区域以产生声信号的装置，用于产生X射线 探针脉冲并用于将X射线探针脉冲引导到表面的第二区域;用于检测衍射X射线探针脉冲的强度的装置，该强度响应于声信号而变化，以形成探针脉冲响应信号， 以及用于计算通过样本模型传播的理论声学信号的预期瞬态响应的装置，并将探针脉冲响应拟合到瞬态响应以导出样本的至少一个特性。

    Measuring elastic moduli of dielectric thin films using an optical metrology system
    7.
    发明授权
    Measuring elastic moduli of dielectric thin films using an optical metrology system 有权
    使用光学测量系统测量介电薄膜的弹性模量

    公开(公告)号：US07019845B1

    公开(公告)日：2006-03-28

    申请号：US10960351

    申请日：2004-10-06

    申请人： Sean P. Leary ,  Guray Tas ,  Christopher J. Morath ,  Michael Kotelyanskii ,  Tong Zheng ,  Guenadiy Lazarov ,  Andre D. Miller ,  George A. Antonelli ,  Jamie I. Ludke

    发明人： Sean P. Leary ,  Guray Tas ,  Christopher J. Morath ,  Michael Kotelyanskii ,  Tong Zheng ,  Guenadiy Lazarov ,  Andre D. Miller ,  George A. Antonelli ,  Jamie I. Ludke

    IPC分类号： G01B9/02 ,  G01B11/28

    CPC分类号： G01N21/211 ,  G01N21/8422

    摘要： An optical metrology system is provided with a data analysis method to determine the elastic moduli of optically transparent dielectric films such as silicon dioxide, other carbon doped oxides over metal or semiconductor substrates. An index of refraction is measured by an ellipsometer and a wavelength of a laser beam is measured using a laser spectrometer. The angle of refraction is determined by directing a light pulse focused onto a wafer surface, measuring a first set of x1, y1, and z1 coordinates, moving the wafer in the z direction, directing the light pulse onto the wafer surface and measuring a second set of x2, y2 and z2 coordinates, using the coordinates to calculate an angle of incidence, calculating an angle of refraction from the calculated angle of incidence, obtaining a sound velocity v, from the calculated angle of refraction and using the determined sound velocity v, to calculate a bulk modulus. Hardware calibration and adjustments for the optical metrology system are also provided in order to minimize the variation of the results from tool to tool down to about 0.5% or below.

    摘要翻译： 光学测量系统具有数据分析方法，以确定光学透明介电膜的弹性模量，例如二氧化硅，金属或半导体衬底上的其他碳掺杂氧化物。 使用椭偏仪测量折射率，使用激光光谱仪测量激光束的波长。 通过将聚焦在晶片表面上的光脉冲引导，测量第一组x 1，y 1和z 1，确定折射角， SUB>坐标，沿z方向移动晶片，将光脉冲引导到晶片表面上并测量第二组x 2，y 2和z 2， 2坐标，使用坐标来计算入射角，从计算的入射角计算折射角，从计算的折射角获得声速v，并使用确定的声速v，到 计算体积模量。 还提供了光学测量系统的硬件校准和调整，以便将结果从工具到工具的降低最小化到约0.5％或更低。