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    Mask forming and implanting methods using implant stopping layer
    9.
    发明授权
    Mask forming and implanting methods using implant stopping layer 有权
    使用植入物停止层的掩模形成和植入方法

    公开(公告)号：US07998871B2

    公开(公告)日：2011-08-16

    申请号：US12145915

    申请日：2008-06-25

    申请人： Katherina Babich ,  Todd C. Bailey ,  Richard A. Conti ,  Ryan P. Deschner

    发明人： Katherina Babich ,  Todd C. Bailey ,  Richard A. Conti ,  Ryan P. Deschner

    IPC分类号： H01L21/302

    CPC分类号： H01L21/266 ,  H01L21/26513 ,  Y10T428/24992

    摘要： Methods of forming a mask for implanting a substrate and implanting using an implant stopping layer with a photoresist provide lower aspect ratio masks that cause minimal damage to trench isolations in the substrate during removal of the mask. In one embodiment, a method of forming a mask includes: depositing an implant stopping layer over the substrate; depositing a photoresist over the implant stopping layer, the implant stopping layer having a density greater than the photoresist; forming a pattern in the photoresist by removing a portion of the photoresist to expose the implant stopping layer; and transferring the pattern into the implant stopping layer by etching to form the mask. The implant stopping layer may include: hydrogenated germanium carbide, nitrogenated germanium carbide, fluorinated germanium carbide, and/or amorphous germanium carbon hydride (GeHX), where X includes carbon. The methods/mask reduce scattering during implanting because the mask has higher density than conventional masks.

    摘要翻译： 形成用于植入衬底的掩模和使用具有光刻胶的注入阻挡层进行植入的方法提供了较低的纵横比掩模，其在去除掩模期间对衬底中的沟槽隔离造成最小的损害。 在一个实施例中，形成掩模的方法包括：在衬底上沉积注入阻挡层; 在所述注入阻挡层上沉积光致抗蚀剂，所述注入阻挡层的密度大于所述光致抗蚀剂; 通过去除光致抗蚀剂的一部分以暴露植入物停止层，在光致抗蚀剂中形成图案; 并通过蚀刻将图案转移到植入物停止层中以形成掩模。 注入停止层可以包括：氢化碳化锗，氮化碳化锗，氟化锗碳化物和/或无定形锗碳氢化物（GeHX），其中X包括碳。 方法/掩模减少了植入过程中的散射，因为掩模具有比常规掩模更高的密度。

    MASK FORMING AND IMPLANTING METHODS USING IMPLANT STOPPING LAYER AND MASK SO FORMED
    10.
    发明申请
    MASK FORMING AND IMPLANTING METHODS USING IMPLANT STOPPING LAYER AND MASK SO FORMED 失效
    使用植入物层和掩模形成的掩模形成和植入方法

    公开(公告)号：US20070275563A1

    公开(公告)日：2007-11-29

    申请号：US11420321

    申请日：2006-05-25

    申请人： Katherina Babich ,  Todd C. Bailey ,  Richard A. Conti ,  Ryan P. Deschner

    发明人： Katherina Babich ,  Todd C. Bailey ,  Richard A. Conti ,  Ryan P. Deschner

    IPC分类号： H01L21/302 ,  H01L21/461

    CPC分类号： H01L21/266 ,  H01L21/26513 ,  Y10T428/24992

    摘要： Methods of forming a mask for implanting a substrate and implanting using an implant stopping layer with a photoresist provide lower aspect ratio masks that cause minimal damage to trench isolations in the substrate during removal of the mask. In one embodiment, a method of forming a mask includes: depositing an implant stopping layer over the substrate; depositing a photoresist over the implant stopping layer, the implant stopping layer having a density greater than the photoresist; forming a pattern in the photoresist by removing a portion of the photoresist to expose the implant stopping layer; and transferring the pattern into the implant stopping layer by etching to form the mask. The implant stopping layer may include: hydrogenated germanium carbide, nitrogenated germanium carbide, fluorinated germanium carbide, and/or amorphous germanium carbon hydride (GeHX), where X includes carbon. The methods/mask reduce scattering during implanting because the mask has higher density than conventional masks.

    摘要翻译： 形成用于植入衬底的掩模和使用具有光刻胶的注入阻挡层进行植入的方法提供了较低的纵横比掩模，其在去除掩模期间对衬底中的沟槽隔离造成最小的损害。 在一个实施例中，形成掩模的方法包括：在衬底上沉积注入阻挡层; 在所述注入阻挡层上沉积光致抗蚀剂，所述注入阻挡层的密度大于所述光致抗蚀剂; 通过去除光致抗蚀剂的一部分以暴露植入物停止层，在光致抗蚀剂中形成图案; 并通过蚀刻将图案转移到植入物停止层中以形成掩模。 注入停止层可以包括：氢化碳化锗，氮化碳化锗，氟化锗碳化物和/或无定形锗碳氢化物（GeHX），其中X包括碳。 方法/掩模减少了植入过程中的散射，因为掩模具有比常规掩模更高的密度。