公开(公告)号：US07250352B2

公开(公告)日：2007-07-31

申请号：US10421921

申请日：2003-04-24

申请人： Masahiko Mizutani ,  Sadamichi Takakusaki ,  Motoichi Nezu ,  Kazutoshi Motegi ,  Mitsuru Noguchi

发明人： Masahiko Mizutani ,  Sadamichi Takakusaki ,  Motoichi Nezu ,  Kazutoshi Motegi ,  Mitsuru Noguchi

IPC分类号： H01L21/46

CPC分类号： H05K3/0052 ,  H01L2924/01023 ,  H01L2924/14 ,  H01L2924/19105 ,  H05K1/056 ,  H05K3/284 ,  H05K2201/09036 ,  H05K2201/0909 ,  H05K2201/09745 ,  H05K2203/0228 ,  H05K2203/1572 ,  H05K2203/302

摘要： In preferred embodiments, a method of manufacturing a hybrid integrated circuit device is provided, in which a plurality of circuit substrates 10 are manufactured from a single metal substrate 10A′ by dicing. In some embodiments, the method includes: preparing a metal substrate 10A′ having an insulating layer 11 formed on the top surface thereof; forming a plurality of conductive patterns 12 on the top surface of insulating layer 11; forming grooves 20 in lattice form on the rear surface of metal substrate 10B′; mounting hybrid integrated circuits onto conductive patterns 12; and separating individual circuit substrates 10 with, for example, a rotatable cutter.

摘要翻译： 在优选实施例中，提供了一种制造混合集成电路器件的方法，其中通过切割由单个金属衬底10A'制造多个电路衬底10。 在一些实施例中，该方法包括：制备具有形成在其顶表面上的绝缘层11的金属基底10A' 在绝缘层11的顶表面上形成多个导电图案12; 在金属基板10B'的后表面上形成格子状的槽20; 将混合集成电路安装到导电图案12上; 并且用例如可旋转切割器分离各个电路基板10。

公开(公告)号：US07964957B2

公开(公告)日：2011-06-21

申请号：US12342363

申请日：2008-12-23

申请人： Mitsuru Noguchi ,  Sadamichi Takakusaki

发明人： Mitsuru Noguchi ,  Sadamichi Takakusaki

IPC分类号： H01L23/24

CPC分类号： H05K1/05 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/14 ,  H01L2924/19105 ,  H05K1/056 ,  H05K3/0052 ,  H05K3/284 ,  H05K3/44 ,  H05K2201/09036 ,  H05K2201/0909 ,  H05K2201/09154 ,  H05K2201/09745 ,  H05K2203/1572 ,  Y10T29/49155 ,  H01L2924/00012 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00

摘要： A semiconductor device that includes a metal substrate including a top surface, a bottom surface and four side surfaces, a conductive pattern insulated from the metal substrate, and a semiconductor element mounted on and electrically connected to the conductive pattern. The top surface is insulated. Each of the side surfaces of the metal substrate includes a first inclining side surface and a second inclining side surface so as to form a convex shape protruding outwardly between the top surface and the bottom surface of the metal substrate, and the first inclining side surfaces of a pair of two opposing side surfaces are smaller than corresponding first inclining side surfaces of another pair of two opposing side surfaces.

摘要翻译： 一种包括金属基板的半导体器件，包括顶表面，底表面和四个侧表面，与金属基板绝缘的导电图案，以及安装在导电图案上并电连接到导电图案的半导体元件。 顶面绝缘。 金属基板的每个侧表面包括第一倾斜侧表面和第二倾斜侧表面，以便形成在金属基板的顶表面和底表面之间向外突出的凸形，并且第一倾斜侧表面 一对两个相对的侧表面小于另一对相对侧表面的相应的第一倾斜侧表面。

公开(公告)号：US20050067186A1

公开(公告)日：2005-03-31

申请号：US10941076

申请日：2004-09-15

申请人： Masahiko Mizutani ,  Mitsuru Noguchi ,  Nobuhisa Takakusaki

发明人： Masahiko Mizutani ,  Mitsuru Noguchi ,  Nobuhisa Takakusaki

IPC分类号： H05K1/02 ,  H01L21/84 ,  H01L23/13 ,  H01L25/16 ,  H01L27/12 ,  H05K1/00 ,  H05K1/05 ,  H05K3/00 ,  H05K3/28 ,  H05K3/46 ,  H05K7/02

CPC分类号： H01L21/565 ,  H01L21/84 ,  H01L23/13 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L25/16 ,  H01L27/12 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/30107 ,  H05K1/056 ,  H05K3/0052 ,  H05K3/284 ,  H05K2201/09036 ,  H05K2201/0909 ,  H05K2201/09827 ,  H05K2203/1572 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2924/00 ,  H01L2924/00012

摘要： An object of the present invention is to provide a method of manufacturing a hybrid integrated circuit device, in which multiple circuit boards are manufactured from one large metal board by dicing. The hybrid integrated circuit device of the present invention includes a circuit board with a surface provided with an insulating layer, and conductive patterns provided on the insulating layer. Circuit elements are electrically connected to the conductive patterns. Further, each side surface of the circuit board includes a first inclined portion extending obliquely downward from a peripheral portion of the surface of the circuit board, and a second inclined portion extending obliquely upward from a back surface of the circuit board and formed to be larger than the first inclined portion.

摘要翻译： 本发明的目的是提供一种制造混合集成电路器件的方法，其中通过切割从一个大型金属板制造多个电路板。 本发明的混合集成电路器件包括具有设置有绝缘层的表面的电路板和设置在绝缘层上的导电图案。 电路元件电连接到导电图案。 此外，电路基板的各侧面包括从电路基板的表面的周边部向斜下方延伸的第一倾斜部，以及从电路基板的背面向斜上方延伸并形成为较大的第二倾斜部 比第一倾斜部分。

公开(公告)号：US07232957B2

公开(公告)日：2007-06-19

申请号：US10941076

申请日：2004-09-15

申请人： Masahiko Mizutani ,  Mitsuru Noguchi ,  Nobuhisa Takakusaki

发明人： Masahiko Mizutani ,  Mitsuru Noguchi ,  Nobuhisa Takakusaki

IPC分类号： H05K1/16

CPC分类号： H01L21/565 ,  H01L21/84 ,  H01L23/13 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L25/16 ,  H01L27/12 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/30107 ,  H05K1/056 ,  H05K3/0052 ,  H05K3/284 ,  H05K2201/09036 ,  H05K2201/0909 ,  H05K2201/09827 ,  H05K2203/1572 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2924/00 ,  H01L2924/00012

摘要： An object of the present invention is to provide a method of manufacturing a hybrid integrated circuit device, in which multiple circuit boards are manufactured from one large metal board by dicing. The hybrid integrated circuit device of the present invention includes a circuit board with a surface provided with an insulating layer, and conductive patterns provided on the insulating layer. Circuit elements are electrically connected to the conductive patterns. Further, each side surface of the circuit board includes a first inclined portion extending obliquely downward from a peripheral portion of the surface of the circuit board, and a second inclined portion extending obliquely upward from a back surface of the circuit board and formed to be larger than the first inclined portion.

摘要翻译： 本发明的目的是提供一种制造混合集成电路器件的方法，其中通过切割从一个大型金属板制造多个电路板。 本发明的混合集成电路器件包括具有设置有绝缘层的表面的电路板和设置在绝缘层上的导电图案。 电路元件电连接到导电图案。 此外，电路基板的各侧面包括从电路基板的表面的周边部向斜下方延伸的第一倾斜部，以及从电路基板的背面向斜上方延伸并形成为较大的第二倾斜部 比第一倾斜部分。

公开(公告)号：US4555380A

公开(公告)日：1985-11-26

申请号：US620599

申请日：1984-06-14

申请人： Shunsaku Munakata ,  Hitoshi Ukai ,  Mitsuru Noguchi ,  Shinichi Sawai

发明人： Shunsaku Munakata ,  Hitoshi Ukai ,  Mitsuru Noguchi ,  Shinichi Sawai

IPC分类号： B29C51/00 ,  B29B13/00 ,  B29C33/00 ,  B29C33/10 ,  B29C33/38 ,  B29C33/42 ,  B29C44/56 ,  B29C45/00 ,  B29C51/10 ,  B29C51/14 ,  B29C51/36 ,  B29C53/02 ,  B29C53/24 ,  B29C53/80 ,  B29C63/00 ,  B32B37/00 ,  B29C17/00

CPC分类号： B29C44/569 ,  B29C51/10 ,  B29C51/14 ,  B29C51/365 ,  B29K2105/04 ,  B29L2009/00

摘要： In the air-pressure molding method according to the present invention, a laminated material is arranged, when in a heated and softened state, on the shaping face of a mold having an air reservoir, and the portion to be molded is hermetically sealed within a box-shaped top cover. Air under pressure higher than atmospheric pressure is then applied to the inside of the top cover so that the laminated material is developed and shaped to have a uniform thickness on the air-cushion layer which is established by the air pressure between the laminated material and the shaping face of the mold. Immediately after, the air in the cushion layer is forced to the air reservoir thereby bringing the laminated material into contact with the mold so that the surface of the skin may be reversely embossed or stitched.

摘要翻译： 在根据本发明的空气压力成型方法中，当处于加热和软化状态时，在具有储气器的模具的成形面上布置层压材料，并将待模制部分气密地密封在 箱形顶盖。 然后将压力高于大气压的空气施加到顶盖的内部，使得层压材料被展开并成形为在气垫层上具有均匀的厚度，其通过层压材料和 成型面的模具。 紧随其后，将缓冲层中的空气强制到储气器，从而使层压材料与模具接触，使得表皮可以被反向压花或缝合。

公开(公告)号：US5753885A

公开(公告)日：1998-05-19

申请号：US494358

申请日：1995-06-23

申请人： Takashi Iwasa ,  Shinji Okabe ,  Mitsuru Noguchi ,  Takanori Yahaba

发明人： Takashi Iwasa ,  Shinji Okabe ,  Mitsuru Noguchi ,  Takanori Yahaba

IPC分类号： B23K11/18 ,  B23K35/22 ,  B23K11/34

CPC分类号： B23K11/185 ,  B23K35/226

摘要： A powder material for use in resistance welding articles of aluminum comprises a mixture of 10-50% by weight of a liquid resin and the remaining proportion of a magnesium powder or a blend of magnesium and aluminum powders. Also a method of resistance welding articles of aluminum comprises the steps of preparing a pasty mixture by mixing in a predetermined amount of a liquid resin having a predetermined initial viscosity, a predetermined amount of a metal powder or a blend of metal and metal oxide powders, and inserting the pasty mixture between the mating weld surfaces of the aluminum articles. Only a small welding force and a low current will be required in producing a resistance weld connection between the aluminum articles with desired strength.

摘要翻译： 用于电阻焊接铝制品的粉末材料包括10-50重量％的液体树脂和剩余的镁粉或镁和铝粉末的混合物的混合物。 铝的电阻焊接方法也包括以下步骤：通过在预定量的具有预定初始粘度的液体树脂，预定量的金属粉末或金属和金属氧化物粉末的混合物中混合来制备糊状混合物， 并将糊状混合物插入铝制品的配合焊接表面之间。 在产生具有所需强度的铝制品之间的电阻焊接连接中，只需要小的焊接力和低电流。

公开(公告)号：US4069804A

公开(公告)日：1978-01-24

申请号：US699965

申请日：1976-06-25

申请人： Takeo Ogano ,  Mitsuru Noguchi

发明人： Takeo Ogano ,  Mitsuru Noguchi

IPC分类号： F02B67/00 ,  B60B15/02 ,  F02M59/00 ,  F28F13/00

CPC分类号： B60B15/02

摘要： Apparatus for attaching a fuel tank in an internal combustion engine, the apparatus comprising a wave-like seat plate including an assembly with alternately curved concavities and convexities therein, applied with said concavities to a lower surface of a bottom plate of the fuel tank so as to form adiabatic spaces above the concavities, and between the seat plate and the bottom plate, the assembly being secured with the seat plate to an upper surface of the engine body. Optionally, this body may have plural projecting fins, forming air passages into which cooling air may be led, for example from a fan.

摘要翻译： 用于将燃料箱安装在内燃机中的装置，该装置包括波形座板，其包括在其中具有交替弯曲的凹凸的组件，将所述凹部施加到燃料箱的底板的下表面，以便 为了在凹部之上形成绝热空间，并且在座板和底板之间，组件通过座板固定到发动机主体的上表面。 可选地，该主体可以具有多个突出的翅片，形成例如从风扇引导冷却空气的空气通道。