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公开(公告)号:US07250352B2
公开(公告)日:2007-07-31
申请号:US10421921
申请日:2003-04-24
IPC分类号: H01L21/46
CPC分类号: H05K3/0052 , H01L2924/01023 , H01L2924/14 , H01L2924/19105 , H05K1/056 , H05K3/284 , H05K2201/09036 , H05K2201/0909 , H05K2201/09745 , H05K2203/0228 , H05K2203/1572 , H05K2203/302
摘要: In preferred embodiments, a method of manufacturing a hybrid integrated circuit device is provided, in which a plurality of circuit substrates 10 are manufactured from a single metal substrate 10A′ by dicing. In some embodiments, the method includes: preparing a metal substrate 10A′ having an insulating layer 11 formed on the top surface thereof; forming a plurality of conductive patterns 12 on the top surface of insulating layer 11; forming grooves 20 in lattice form on the rear surface of metal substrate 10B′; mounting hybrid integrated circuits onto conductive patterns 12; and separating individual circuit substrates 10 with, for example, a rotatable cutter.
摘要翻译: 在优选实施例中,提供了一种制造混合集成电路器件的方法,其中通过切割由单个金属衬底10A'制造多个电路衬底10。 在一些实施例中,该方法包括:制备具有形成在其顶表面上的绝缘层11的金属基底10A' 在绝缘层11的顶表面上形成多个导电图案12; 在金属基板10B'的后表面上形成格子状的槽20; 将混合集成电路安装到导电图案12上; 并且用例如可旋转切割器分离各个电路基板10。
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公开(公告)号:US06956252B2
公开(公告)日:2005-10-18
申请号:US10421920
申请日:2003-04-24
CPC分类号: H05K3/0052 , H01L24/97 , H01L2224/48091 , H01L2224/73265 , H01L2924/14 , H01L2924/19105 , H05K1/056 , H05K3/284 , H05K2201/09036 , H05K2201/0909 , H05K2201/09745 , H05K2203/0228 , H05K2203/1572 , H05K2203/302 , H01L2924/00014 , H01L2924/00
摘要: In preferred embodiments, a compact a hybrid integrated circuit device 1 can be provided. A conductive pattern 12 is formed on the top surface of a circuit substrate 10, on the top surface of which an insulating layer 11 has been provided. Conductive pattern 12 is formed over the entirety of the top surface of the circuit substrate. Specifically, conductive pattern 12 is also formed at parts within 2 mm from the peripheral ends of circuit substrate 10. Also, a heat sink 13A or other circuit element 13 with some height can be positioned near a peripheral end part of circuit substrate 10. By arranging hybrid integrated circuit device 1, the degree of integration of hybrid integrated circuit is improved. Thus, in a case where the same circuit as a prior-art example is formed, the size of the entire hybrid integrated circuit device can be made small.
摘要翻译: 在优选实施例中,可以提供一种紧凑的混合集成电路装置1。 导电图案12形成在电路基板10的顶表面上,其顶表面上设置有绝缘层11。 导电图案12形成在电路基板的整个顶表面上。 具体地,导电图案12也形成在距电路基板10的外周端2mm以内的部分。 此外,具有一定高度的散热器13A或其他电路元件13可以位于电路基板10的外围端部附近。 通过设置混合集成电路装置1,提高了混合集成电路的集成度。 因此,在形成与现有技术例子相同的电路的情况下,可以使整个混合集成电路器件的尺寸变小。
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公开(公告)号:US07936569B2
公开(公告)日:2011-05-03
申请号:US11307283
申请日:2006-01-30
IPC分类号: H05K7/00
CPC分类号: H05K3/341 , H01L24/83 , H01L2224/45124 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/73265 , H01L2224/83 , H01L2924/01322 , H01L2924/01327 , H01L2924/14 , H01L2924/15787 , H01L2924/19105 , H01L2924/30107 , H05K3/243 , H05K3/244 , H05K3/284 , H05K3/3463 , H05K2201/0391 , H05K2201/10969 , Y02P70/613 , Y10T29/4913 , Y10T29/49155 , H01L2924/00014 , H01L2924/00
摘要: In a hybrid integrated circuit device that is a circuit device of the present invention, a conductive pattern including pads is formed on a surface of a substrate. A first pad is formed to be relatively large since a heat sink is mounted thereon. A second pad is a small pad to which a chip component or a small signal transistor is fixed. In the present invention, a plated film made of nickel is formed on a surface of the first pad. Therefore, the first pad and a solder never come into contact with each other. Thus, a Cu/Sn alloy layer having poor soldering properties is not generated but a Ni/Sn alloy layer having excellent soldering properties is generated. Consequently, occurrence of sink in the melted solder is suppressed.
摘要翻译: 在作为本发明的电路装置的混合集成电路装置中,在基板的表面上形成包括焊盘的导电图案。 由于在其上安装散热器,所以形成第一焊盘相对较大。 第二焊盘是固定芯片部件或小信号晶体管的小焊盘。 在本发明中,在第一焊盘的表面上形成由镍制成的镀膜。 因此,第一焊盘和焊料不会彼此接触。 因此,不会产生焊接性差的Cu / Sn合金层,而是产生焊接性优异的Ni / Sn合金层。 因此,抑制熔融焊料中的沉陷的发生。
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公开(公告)号:US20070205017A1
公开(公告)日:2007-09-06
申请号:US11307283
申请日:2006-01-30
CPC分类号: H05K3/341 , H01L24/83 , H01L2224/45124 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/73265 , H01L2224/83 , H01L2924/01322 , H01L2924/01327 , H01L2924/14 , H01L2924/15787 , H01L2924/19105 , H01L2924/30107 , H05K3/243 , H05K3/244 , H05K3/284 , H05K3/3463 , H05K2201/0391 , H05K2201/10969 , Y02P70/613 , Y10T29/4913 , Y10T29/49155 , H01L2924/00014 , H01L2924/00
摘要: In a hybrid integrated circuit device that is a circuit device of the present invention, a conductive pattern including pads is formed on a surface of a substrate. A first pad is formed to be relatively large since a heat sink is mounted thereon. A second pad is a small pad to which a chip component or a small signal transistor is fixed. In the present invention, a plated film made of nickel is formed on a surface of the first pad. Therefore, the first pad and a solder never come into contact with each other. Thus, a Cu/Sn alloy layer having poor soldering properties is not generated but a Ni/Sn alloy layer having excellent soldering properties is generated. Consequently, occurrence of sink in the melted solder is suppressed.
摘要翻译: 在作为本发明的电路装置的混合集成电路装置中,在基板的表面上形成包括焊盘的导电图案。 由于在其上安装散热器,所以形成第一焊盘相对较大。 第二焊盘是固定芯片部件或小信号晶体管的小焊盘。 在本发明中,在第一焊盘的表面上形成由镍制成的镀膜。 因此,第一焊盘和焊料不会彼此接触。 因此,不会产生焊接性差的Cu / Sn合金层,而是产生焊接性优异的Ni / Sn合金层。 因此,抑制熔融焊料中的沉陷的发生。
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公开(公告)号:US20060024862A1
公开(公告)日:2006-02-02
申请号:US11179431
申请日:2005-07-11
IPC分类号: H01L21/50
CPC分类号: H05K3/4647 , H01L21/4857 , H01L21/568 , H01L23/3128 , H01L23/49816 , H01L24/48 , H01L2221/68345 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2224/85001 , H01L2924/00014 , H01L2924/01013 , H01L2924/01029 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/1301 , H01L2924/13034 , H01L2924/1305 , H01L2924/13055 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H05K1/0265 , H05K1/185 , H05K1/187 , H05K3/06 , H05K3/20 , H05K3/423 , H05K3/4652 , H05K3/4658 , H05K3/4682 , H05K2201/0209 , H05K2201/09509 , H05K2201/09563 , H05K2201/09736 , H05K2203/0152 , H05K2203/0369 , H05K2203/1476 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要: To provide a method of manufacturing a highly reliable circuit device realizing a smaller, thinner and lighter configuration. In the method of manufacturing a circuit device according to the invention, a resin sealed body is separated from a supporting substrate, after the resin sealed body containing a circuit device is formed on a top surface of the supporting substrate. Therefore, manufacture of a circuit device having no substrate becomes possible and it realizes a thinner and lighter circuit device with improved heat dissipation. Moreover, since sealing with a sealing resin can be performed on the supporting substrate, warps, caused by the differences in thermal expansion coefficients between the sealing resin and conductive patterns and between the sealing resin and circuit components, can be prevented. Hence, it becomes possible to prevent flaking of conductive patterns from the substrate and a poor contact between the conductive patterns and a metal thin wire, and consequently to manufacture a highly reliable circuit device.
摘要翻译: 提供一种制造高可靠性电路装置的方法,其实现更小,更薄和更轻的构造。 在根据本发明的电路装置的制造方法中,在支撑基板的顶表面上形成包含电路装置的树脂密封体之后,树脂密封体与支撑基板分离。 因此,可以制造没有基板的电路装置,并且实现了具有改善的散热的更薄更轻的电路装置。 此外,由于可以在支撑基板上进行密封树脂的密封,所以可以防止由密封树脂和导电图案之间以及密封树脂和电路部件之间的热膨胀系数的差异引起的翘曲。 因此,可以防止导电图案从基板剥落,并且导电图案与金属细线之间的接触不良,从而制造高可靠性的电路装置。
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公开(公告)号:US20050263482A1
公开(公告)日:2005-12-01
申请号:US11139142
申请日:2005-05-27
IPC分类号: H05K3/34 , B44C1/22 , H01B13/00 , H01L21/28 , H01L21/48 , H01L21/98 , H01L23/12 , H05K1/02 , H05K1/05 , H05K3/00 , H05K3/28 , H05K3/40
CPC分类号: H01L25/50 , H01L21/4821 , H01L21/4871 , H01L24/97 , H01L2221/68377 , H01L2224/48091 , H01L2224/73265 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/07802 , H01L2924/10253 , H01L2924/12041 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/351 , H05K1/056 , H05K3/28 , H05K3/284 , H05K3/4007 , H05K2203/0369 , H05K2203/1476 , H01L2924/00014 , H01L2224/92247 , H01L2224/85 , H01L2224/83 , H01L2924/00 , H01L2924/00012
摘要: In a method of manufacturing a circuit device of the present invention, protruding portions protruding upward are formed in part of a conductive pattern formed on the front surface of a circuit substrate. Next, the front surface of the circuit substrate including the protruding portions is coated with coating resin. Subsequently, the coating resin is etched so that the top surfaces of the protruding portions are exposed. Then, the fixation and electrical connection of circuit elements are performed. Finally, an electric circuit formed on the front surface is sealed, whereby a hybrid integrated circuit device is completed.
摘要翻译: 在制造本发明的电路装置的方法中,向上突出的突出部分形成在形成在电路基板的前表面上的导电图案的一部分中。 接下来,包括突出部分的电路基板的前表面涂覆有涂覆树脂。 接着,对涂布树脂进行蚀刻,使突出部的顶面露出。 然后,执行电路元件的固定和电连接。 最后,密封形成在前表面上的电路,从而完成混合集成电路装置。
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公开(公告)号:US20080123299A1
公开(公告)日:2008-05-29
申请号:US10599302
申请日:2005-03-24
CPC分类号: H01L23/3677 , H01L23/13 , H01L24/45 , H01L24/48 , H01L25/16 , H01L25/165 , H01L2224/451 , H01L2224/48472 , H01L2224/73265 , H01L2924/07802 , H01L2924/10253 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H05K1/0204 , H05K1/056 , H05K3/284 , H05K2201/09054 , H05K2203/0369 , H05K2203/1189 , Y10T29/4913 , H01L2924/00 , H01L2924/00014 , H01L2924/00012
摘要: A circuit device exhibiting excellent heat radiation properties and a manufacturing method thereof are hereby provided. A circuit device comprises a circuit board, an insulating layer formed on the circuit board, a conductive pattern formed on the insulating layer, a circuit element electrically connected to the conductive pattern, wherein a protrusion partially extending and being buried in the insulating layer is provided on the circuit board. Accordingly, heat generated inside the device can be efficiently discharged to the exterior via the protrusion.
摘要翻译: 因此提供了具有优异的散热性能的电路装置及其制造方法。 电路装置包括电路板,形成在电路板上的绝缘层,形成在绝缘层上的导电图案,电连接到导电图案的电路元件,其中部分地延伸并被埋在绝缘层中的突起被提供 在电路板上。 因此,装置内部产生的热能够经由突起被有效地排出到外部。
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公开(公告)号:US20070221704A1
公开(公告)日:2007-09-27
申请号:US11307278
申请日:2006-01-30
IPC分类号: A47J36/02
CPC分类号: H05K3/3484 , B23K35/025 , B23K35/262 , B23K35/362 , H01L2224/45124 , H01L2224/48091 , H01L2224/48472 , H01L2224/73265 , H01L2224/92247 , H01L2924/01322 , H01L2924/19105 , H01L2924/30107 , H05K3/341 , H05K2201/10969 , H01L2924/00014 , H01L2924/00
摘要: A method of manufacturing a circuit device of the present invention comprises the steps of: forming a conductive pattern including a first pad and a second pad on the surface of a substrate; applying a solder paste to the surface of the first pad and then thermally melting the solder paste, thus forming solder; fixing a circuit element to the second pad; and fixing a circuit element to the first pad with the solder therebetween. Furthermore, a flux constituting the solder paste contains sulfur. Since the sulfur is mixed into the solder paste, surface tension of the solder paste is lowered; accordingly occurrence of sink is suppressed.
摘要翻译: 制造本发明的电路器件的方法包括以下步骤:在衬底的表面上形成包括第一焊盘和第二焊盘的导电图案; 将焊膏施加到第一焊盘的表面,然后热熔化焊膏,从而形成焊料; 将电路元件固定到所述第二焊盘; 以及将电路元件固定到第一焊盘上,其间具有焊料。 此外,构成锡膏的焊剂含有硫。 由于硫被混合到焊膏中,焊膏的表面张力降低; 因此抑制了汇的发生。
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公开(公告)号:US07163841B2
公开(公告)日:2007-01-16
申请号:US11179431
申请日:2005-07-11
IPC分类号: H01L21/49
CPC分类号: H05K3/4647 , H01L21/4857 , H01L21/568 , H01L23/3128 , H01L23/49816 , H01L24/48 , H01L2221/68345 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2224/85001 , H01L2924/00014 , H01L2924/01013 , H01L2924/01029 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/1301 , H01L2924/13034 , H01L2924/1305 , H01L2924/13055 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H05K1/0265 , H05K1/185 , H05K1/187 , H05K3/06 , H05K3/20 , H05K3/423 , H05K3/4652 , H05K3/4658 , H05K3/4682 , H05K2201/0209 , H05K2201/09509 , H05K2201/09563 , H05K2201/09736 , H05K2203/0152 , H05K2203/0369 , H05K2203/1476 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要: To provide a method of manufacturing a highly reliable circuit device realizing a smaller, thinner and lighter configuration. In the method of manufacturing a circuit device according to the invention, a resin sealed body is separated from a supporting substrate, after the resin sealed body containing a circuit device is formed on a top surface of the supporting substrate. Therefore, manufacture of a circuit device having no substrate becomes possible and it realizes a thinner and lighter circuit device with improved heat dissipation. Moreover, since sealing with a sealing resin can be performed on the supporting substrate, warps, caused by the differences in thermal expansion coefficients between the sealing resin and conductive patterns and between the sealing resin and circuit components, can be prevented. Hence, it becomes possible to prevent flaking of conductive patterns from the substrate and a poor contact between the conductive patterns and a metal thin wire, and consequently to manufacture a highly reliable circuit device.
摘要翻译: 提供一种制造高可靠性电路装置的方法,其实现更小,更薄和更轻的构造。 在根据本发明的电路装置的制造方法中,在支撑基板的顶表面上形成包含电路装置的树脂密封体之后,树脂密封体与支撑基板分离。 因此,可以制造没有基板的电路装置,并且实现了具有改善的散热的更薄更轻的电路装置。 此外,由于可以在支撑基板上进行密封树脂的密封,所以可以防止由密封树脂和导电图案之间以及密封树脂和电路部件之间的热膨胀系数的差异引起的翘曲。 因此,可以防止导电图案从基板剥落,并且导电图案与金属细线之间的接触不良,从而制造高可靠性的电路装置。
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公开(公告)号:US20080106875A1
公开(公告)日:2008-05-08
申请号:US10588467
申请日:2005-02-18
CPC分类号: H01L23/49531 , H01L21/4846 , H01L21/565 , H01L23/4334 , H01L23/49811 , H01L24/48 , H01L24/97 , H01L25/16 , H01L2224/16 , H01L2224/32225 , H01L2224/451 , H01L2224/48091 , H01L2224/48472 , H01L2224/73265 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01073 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/12041 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/14 , H01L2924/15787 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/30105 , H05K1/0203 , H05K1/0265 , H05K1/056 , H05K3/06 , H05K3/284 , H05K2201/0355 , H05K2201/09736 , H05K2203/0369 , H05K2203/1476 , Y10T29/49139 , H01L2224/85 , H01L2224/83 , H01L2924/00 , H01L2224/45099 , H01L2224/05599 , H01L2924/00012
摘要: Provided are a hybrid integrated circuit device in which fine patterns can be formed while current-carrying capacitances are ensured, and a method of manufacturing the same. The hybrid integrated circuit device of the present invention includes conductive patterns formed on a front surface of a circuit substrate and circuit elements electrically connected respectively to the conductive patterns. The conductive patterns include a first conductive pattern and a second conductive pattern formed more thickly than the first conductive pattern. The second conductive pattern includes a protruding portion protruding in a thickness direction thereof.
摘要翻译: 提供一种混合集成电路器件及其制造方法,其中可以形成精细图案,同时确保载流电容。 本发明的混合集成电路装置包括形成在电路基板的前表面上的导电图案和分别电连接到导电图案的电路元件。 导电图案包括比第一导电图案更厚的第一导电图案和第二导电图案。 第二导电图案包括在其厚度方向上突出的突出部分。
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