公开(公告)号：US08410376B2

公开(公告)日：2013-04-02

申请号：US12840696

申请日：2010-07-21

申请人： Masahiro Kaneko ,  Satoru Kose ,  Hirokazu Higashi

发明人： Masahiro Kaneko ,  Satoru Kose ,  Hirokazu Higashi

IPC分类号： H05K1/11

CPC分类号： H05K3/42 ,  H01L21/6835 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49866 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L2221/68345 ,  H01L2224/32057 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/48644 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/85001 ,  H01L2224/85385 ,  H01L2224/85444 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H05K1/0313 ,  H05K1/113 ,  H05K1/115 ,  H05K3/007 ,  H05K3/108 ,  H05K3/22 ,  H05K3/388 ,  H05K2201/0344 ,  H05K2201/09509 ,  H05K2201/09527 ,  H05K2201/09563 ,  H05K2203/072 ,  H05K2203/1377 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  H01L2924/00012 ,  H01L2924/00011 ,  H01L2924/00 ,  H01L2224/05599

摘要： A printed wiring board includes an interlayer resin insulation layer having a penetrating hole for a via conductor, a conductive circuit formed on one surface of the interlayer resin insulation layer, a via conductor formed in the penetrating hole and having a protruding portion protruding from the other surface of the interlayer resin insulation layer, and a surface-treatment coating formed on the surface of the protruding portion of the via conductor. The via conductor is connected to the conductive circuit and has a first conductive layer formed on the side wall of the penetrating hole and a plated layer filling the penetrating hole.

摘要翻译： 印刷电路板包括：具有用于通路导体的贯通孔的层间树脂绝缘层，形成在层间树脂绝缘层的一个表面上的导电电路;形成在该贯通孔中的通孔导体，并且具有从另一个突出的突出部 层间树脂绝缘层的表面和形成在通孔导体的突出部分的表面上的表面处理涂层。 通孔导体连接到导电电路，并且具有形成在穿透孔的侧壁上的第一导电层和填充穿透孔的镀层。

公开(公告)号：US08378230B2

公开(公告)日：2013-02-19

申请号：US12770820

申请日：2010-04-30

申请人： Masahiro Kaneko ,  Daiki Komatsu ,  Satoru Kose ,  Hirokazu Higashi

发明人： Masahiro Kaneko ,  Daiki Komatsu ,  Satoru Kose ,  Hirokazu Higashi

IPC分类号： H05K1/11

CPC分类号： H05K3/421 ,  H01L21/486 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0657 ,  H01L2221/68345 ,  H01L2224/32057 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48165 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/4911 ,  H01L2224/73203 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/85385 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06568 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/078 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H05K1/113 ,  H05K3/007 ,  H05K3/284 ,  H05K3/328 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2201/09563 ,  H05K2203/016 ,  H05K2203/0361 ,  H05K2203/049 ,  H05K2203/1316 ,  Y10T29/49165 ,  H01L2924/00012 ,  H01L2924/00011 ,  H01L2924/00 ,  H01L2224/85399 ,  H01L2224/05599

摘要： A printed wiring board includes an interlayer resin insulation layer having the first surface, the second surface on the opposite side of the first surface, and a penetrating hole for a via conductor, a conductive circuit formed on the first surface of the interlayer resin insulation layer, a via conductor formed in the penetrating hole and connected to the conductive circuit on the first surface of the interlayer resin insulation layer, and a surface-treatment coating formed on the surface of the via conductor exposed from the second surface of the interlayer resin insulation layer through the penetrating hole. The via conductor is made of a first conductive layer formed on the side wall of the penetrating hole and a plated-metal filling the penetrating hole. The surface of the via conductor is recessed from the second surface of the interlayer resin insulation layer.

摘要翻译： 印刷电路板包括具有第一表面，第一表面相对侧的第二表面和通孔导体的穿透孔的层间树脂绝缘层，形成在层间树脂绝缘层的第一表面上的导电电路 ，形成在所述贯通孔中并连接到所述层间树脂绝缘层的第一表面上的导电电路的通孔导体，以及形成在所述通孔导体的从所述层间树脂绝缘体的第二表面露出的表面上的表面处理涂层 穿透穿孔。 通孔导体由形成在穿透孔的侧壁上的第一导电层和填充穿透孔的电镀金属制成。 通孔导体的表面从层间树脂绝缘层的第二表面凹陷。

公开(公告)号：US20110048773A1

公开(公告)日：2011-03-03

申请号：US12840696

申请日：2010-07-21

申请人： Masahiro Kaneko ,  Satoru Kose ,  Hirokazu Higashi

发明人： Masahiro Kaneko ,  Satoru Kose ,  Hirokazu Higashi

IPC分类号： H05K1/09 ,  H05K1/11 ,  H05K3/10

CPC分类号： H05K3/42 ,  H01L21/6835 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49866 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L2221/68345 ,  H01L2224/32057 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/48644 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/85001 ,  H01L2224/85385 ,  H01L2224/85444 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H05K1/0313 ,  H05K1/113 ,  H05K1/115 ,  H05K3/007 ,  H05K3/108 ,  H05K3/22 ,  H05K3/388 ,  H05K2201/0344 ,  H05K2201/09509 ,  H05K2201/09527 ,  H05K2201/09563 ,  H05K2203/072 ,  H05K2203/1377 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  H01L2924/00012 ,  H01L2924/00011 ,  H01L2924/00 ,  H01L2224/05599

摘要： A printed wiring board includes an interlayer resin insulation layer having a penetrating hole for a via conductor, a conductive circuit formed on one surface of the interlayer resin insulation layer, a via conductor formed in the penetrating hole and having a protruding portion protruding from the other surface of the interlayer resin insulation layer, and a surface-treatment coating formed on the surface of the protruding portion of the via conductor. The via conductor is connected to the conductive circuit and has a first conductive layer formed on the side wall of the penetrating hole and a plated layer filling the penetrating hole.

摘要翻译： 印刷电路板包括：具有用于通路导体的贯通孔的层间树脂绝缘层，形成在层间树脂绝缘层的一个表面上的导电电路;形成在该贯通孔中的通孔导体，并且具有从另一个突出的突出部 层间树脂绝缘层的表面和形成在通孔导体的突出部分的表面上的表面处理涂层。 通孔导体连接到导电电路，并且具有形成在穿透孔的侧壁上的第一导电层和填充穿透孔的镀层。

公开(公告)号：US08164400B2

公开(公告)日：2012-04-24

申请号：US11589167

申请日：2006-10-30

申请人： Hideki Iwata ,  Masahiro Yanagi ,  Shigemi Kurashima ,  Takashi Yuba ,  Masahiro Kaneko ,  Yuriko Segawa ,  Takashi Arita

发明人： Hideki Iwata ,  Masahiro Yanagi ,  Shigemi Kurashima ,  Takashi Yuba ,  Masahiro Kaneko ,  Yuriko Segawa ,  Takashi Arita

IPC分类号： H01P1/203 ,  H01P7/08

CPC分类号： H01P1/2039

摘要： A distributed constant type filter includes a substrate including a part made of a first dielectric material having a first relative dielectric constant and a different-material part made of a second dielectric material having a second relative dielectric constant different from the first relative dielectric constant. A filter pattern is formed on a top surface and a ground pattern is formed on a bottom surface of the substrate. Part of the filter pattern is formed on the different-material part.

摘要翻译： 分布常数型滤波器包括基板，该基板包括由具有第一相对介电常数的第一介电材料制成的部分和由具有不同于第一相对介电常数的第二相对介电常数的第二介电材料制成的不同材料部分。 在顶表面上形成滤光图案，并且在基板的底表面上形成接地图案。 过滤器图案的一部分形成在不同材料部分上。

公开(公告)号：US07886643B2

公开(公告)日：2011-02-15

申请号：US11159730

申请日：2005-06-23

申请人： Masahiro Kaneko ,  Toshio Shida ,  Hiroyuki Wakabayashi

发明人： Masahiro Kaneko ,  Toshio Shida ,  Hiroyuki Wakabayashi

IPC分类号： B26D5/20 ,  B26D5/00 ,  B26D7/02 ,  B26D5/08

CPC分类号： G03G15/6582 ,  B26D7/025 ,  G03G2215/00814 ,  Y10T83/50 ,  Y10T83/566 ,  Y10T83/7487 ,  Y10T83/887 ,  Y10T83/8874

摘要： A sheet cutting apparatus includes: a cutting blade for cutting an edge of a sheet bundle conveyed to a cutting position of the sheet bundle; a cutting blade moving section for moving obliquely the cutting blade with respect to a sheet surface of the sheet bundle; a fixed supporting table for supporting the sheet bundle in a vicinity of the cutting position; a blade receiving member for pressing the sheet bundle and receiving the cutting blade in the vicinity of the cutting position; and a blade receiving member moving section for ascending or descending the blade receiving member. A center position of a load application action of the blade receiving member by the blade receiving member moving section, is set to a position upstream of the sheet cutting position in a conveying direction of the sheet bundle, and in the vicinity of the sheet cutting position.

摘要翻译： 片材切割装置包括：切割刀片，用于切割输送到片材束的切割位置的片材束的边缘; 切割刀片移动部分，用于相对于所述片材摞的片材表面倾斜地移动所述切割刀片; 用于在切割位置附近支撑片材束的固定支撑台; 叶片接收构件，用于按压片材束并在切割位置附近接收切割刀片; 以及用于使叶片接收构件上升或下降的叶片接收构件移动部分。 通过刀片接收构件移动部分的刀片接收构件的负载施加动作的中心位置被设定在片材摞的传送方向上的片材切割位置的上游位置，并且在片材切割位置附近 。

公开(公告)号：US07737908B2

公开(公告)日：2010-06-15

申请号：US11581376

申请日：2006-10-17

申请人： Masahiro Yanagi ,  Shigemi Kurashima ,  Hideki Iwata ,  Takashi Yuba ,  Masahiro Kaneko ,  Yuriko Segawa ,  Takashi Arita ,  Toshihiro Kusagaya ,  Kazuhiko Ikeda ,  Hiroshi Matsumiya ,  Kazuo Nomura

发明人： Masahiro Yanagi ,  Shigemi Kurashima ,  Hideki Iwata ,  Takashi Yuba ,  Masahiro Kaneko ,  Yuriko Segawa ,  Takashi Arita ,  Toshihiro Kusagaya ,  Kazuhiko Ikeda ,  Hiroshi Matsumiya ,  Kazuo Nomura

IPC分类号： H01Q1/40

CPC分类号： H01Q9/40 ,  H01Q1/38 ,  Y10T29/49016

摘要： A disclosed antenna apparatus includes: a punched out antenna element made of a sheet metal; a punched out ground element made of a sheet metal, the ground element facing the antenna element; and a surface mount type coaxial connector mounted across the antenna element and the ground element.

摘要翻译： 所公开的天线装置包括：由金属板制成的冲压天线元件; 由金属片制成的冲压接地元件，所述接地元件面向所述天线元件; 以及安装在天线元件和接地元件两侧的表面安装型同轴连接器。

公开(公告)号：US07382331B2

公开(公告)日：2008-06-03

申请号：US11585902

申请日：2006-10-25

申请人： Shigemi Kurashima ,  Masahiro Yanagi ,  Hideki Iwata ,  Takashi Yuba ,  Masahiro Kaneko ,  Yuriko Segawa ,  Takashi Arita

发明人： Shigemi Kurashima ,  Masahiro Yanagi ,  Hideki Iwata ,  Takashi Yuba ,  Masahiro Kaneko ,  Yuriko Segawa ,  Takashi Arita

IPC分类号： H01Q15/08 ,  H01Q1/38 ,  H01Q1/48

CPC分类号： H01Q19/09 ,  H01Q9/40

摘要： An antenna device includes an antenna part and a dielectric formed on the antenna part. The dielectric is formed to be thicker in a direction of directivity that the antenna part is to be made to have, than in another direction.

摘要翻译： 天线装置包括在天线部分上形成的天线部分和电介质。 电介质形成为使得天线部分要沿与另一方向相同的方向性方向更厚。

公开(公告)号：US20080106023A1

公开(公告)日：2008-05-08

申请号：US11906902

申请日：2007-10-04

申请人： Masahiro Kaneko ,  Tsuyoshi Tsuchiya

发明人： Masahiro Kaneko ,  Tsuyoshi Tsuchiya

IPC分类号： B41F13/54 ,  B65H39/00

CPC分类号： B42C9/0018 ,  B42C11/02 ,  B65H2801/27 ,  B65H2801/48

摘要： A bookbinding apparatus including an adhesive coating section which coats an adhesive onto a spine of a sheet bundle that a plurality of sheets are bundeled, by relatively moving the adhesive coating section and the sheet bundle, adheres a cover sheet onto the spine of the sheet bundle onto which the adhesive has been coated by the adhesive coating section. The adhesive coating section includes: a coating member which coats the adhesive storing in ah adhesive tank onto the spine of the sheet bundle; a scraping member which scrapes the adhesive coated onto the spine of the sheet bundle; and a reservoir which stores the adhesive scraped by the scraping member.

摘要翻译： 一种装订装置，其包括通过使粘合剂涂布部和片材束相对移动而将粘合剂涂布在多个片材被捆扎的片材束的脊上的粘合剂涂布部，将覆盖片粘贴到片材束的脊上 粘合剂被粘合剂涂布部分涂覆在其上。 粘合剂涂布部分包括：涂覆部件，其将存储在粘合剂罐中的粘合剂涂覆到片材束的脊上; 刮擦构件，其刮擦涂覆在片材束的脊上的粘合剂; 以及存储由刮擦构件刮下的粘合剂的储存器。

公开(公告)号：US20070229362A1

公开(公告)日：2007-10-04

申请号：US11584574

申请日：2006-10-23

申请人： Shigemi Kurashima ,  Masahiro Yanagi ,  Hideki Iwata ,  Takashi Yuba ,  Masahiro Kaneko ,  Yuriko Segawa ,  Takashi Arita

发明人： Shigemi Kurashima ,  Masahiro Yanagi ,  Hideki Iwata ,  Takashi Yuba ,  Masahiro Kaneko ,  Yuriko Segawa ,  Takashi Arita

IPC分类号： H01Q1/38 ,  H01Q1/48

CPC分类号： H01Q9/40

摘要： An antenna which can be used in different communication standards with a simple structure is disclosed. The antenna includes an antenna section which receives/transmits radio waves, input/output ports to which a signal to be input to the antenna section is input and from which a signal output from the antenna section is output, and transmission lines each of which connects the antenna section to a corresponding input/output port.

摘要翻译： 公开了一种可以用于具有简单结构的不同通信标准的天线。 天线包括接收/发送无线电波的天线部分，输入到天线部分的信号的输入/输出端口，并且从天线部分输出的信号从该天线部分输出， 天线部分到相应的输入/输出端口。

公开(公告)号：US20070045920A1

公开(公告)日：2007-03-01

申请号：US11498067

申请日：2006-08-03

申请人： Kohji Yoshie ,  Saburo Shimizu ,  Riichi Hama ,  Masahiro Kaneko ,  Kiyoshi Hata

发明人： Kohji Yoshie ,  Saburo Shimizu ,  Riichi Hama ,  Masahiro Kaneko ,  Kiyoshi Hata

IPC分类号： B41L43/12

CPC分类号： B42C11/02 ,  B42C19/02 ,  G03G15/6544 ,  G03G2215/00936

摘要： A bookbinding system wherein additional printing is conducted on a cover sheet which has been printed thereon outside an image forming apparatus, the image forming apparatus is provided with an ejection-outlet through which the image forming apparatus accepts the cover sheet coming from a bookbinding apparatus and the cover sheet printed by a printing device of the image forming apparatus is fed out to the bookbinding apparatus for bookbinding.

摘要翻译： 一种装订系统，其中在已经印刷在图像形成装置外部的覆盖片上进行附加打印，图像形成装置设置有喷射出口，图像形成装置通过该喷出口接收来自装订装置的盖板， 由图像形成装置的打印装置打印的封面被送出到装订装订装置中。