公开(公告)号：US20050003870A1

公开(公告)日：2005-01-06

申请号：US10609717

申请日：2003-06-27

申请人： Masao Nakano ,  Masao Nakazawa ,  Yoshio Sasaki ,  Eiji Takeuchi ,  Yosuke Miho ,  Hajime Ishikawa ,  Takeo Kobayashi ,  Tomoki Myoi ,  Hiroshi Kasakawa ,  Akiko Watanabe ,  Shinsuke Sata

发明人： Masao Nakano ,  Masao Nakazawa ,  Yoshio Sasaki ,  Eiji Takeuchi ,  Yosuke Miho ,  Hajime Ishikawa ,  Takeo Kobayashi ,  Tomoki Myoi ,  Hiroshi Kasakawa ,  Akiko Watanabe ,  Shinsuke Sata

IPC分类号： G06F1/16 ,  G06F3/033 ,  G06F3/048 ,  G06F15/02 ,  H04B1/38 ,  H04M1/00

CPC分类号： G06F1/1626 ,  G06F1/169 ,  G06F3/0362 ,  G06F3/0482 ,  G06F3/0483 ,  G06F3/0485

摘要： A plurality of tabs are arrayed in a predetermined direction on a screen page. Every time a control switch supported so as to be capable of oscillating within a predetermined range and capable of pushing is pushed, a tab sequentially selected is shifted and activated. A setting screen page is displayed. When a part of a plurality of tabs are displayed on a screen page, a tab appears on the screen may be sequentially changed by pushing operation of the control switch part. In this manner, a tab is pointed, selected and determined only by operation of the control switch part.

摘要翻译： 多个标签在屏幕页面上沿预定方向排列。 每当支持能够在预定范围内振动并且能够推动的控制开关被按下时，依次选择的标签被移动并被激活。 显示设置画面。 当多个标签的一部分显示在屏幕页面上时，可以通过按下控制开关部件的操作来顺序地改变屏幕上的标签。 以这种方式，仅通过控制开关部件的操作来选择和确定制表符。

公开(公告)号：US08375334B2

公开(公告)日：2013-02-12

申请号：US10435709

申请日：2003-05-09

申请人： Masao Nakano ,  Masao Nakazawa ,  Yoshio Sasaki ,  Eiji Takeuchi ,  Yosuke Miho ,  Hajime Ishikawa ,  Takeo Kobayashi ,  Tomoki Myoi ,  Hiroshi Kasakawa ,  Akiko Watanabe ,  Shinsuke Sato

发明人： Masao Nakano ,  Masao Nakazawa ,  Yoshio Sasaki ,  Eiji Takeuchi ,  Yosuke Miho ,  Hajime Ishikawa ,  Takeo Kobayashi ,  Tomoki Myoi ,  Hiroshi Kasakawa ,  Akiko Watanabe ,  Shinsuke Sato

IPC分类号： G06F3/048

CPC分类号： G06F3/0481 ,  G06F1/1626 ,  G06F3/0362 ,  G06F3/0482 ,  G06F3/0485 ,  G06F3/0488 ,  G06F2200/1632

摘要： Predetermined travel locuss are set in a three-dimensional virtual space. Menu panels displaying menu items are arranged along the travel locuss assuming a display position set as a local origin so that the normal to each LCD panel will face a virtual camera. The transparency of a menu panel is raised in accordance with its distance to the virtual camera. A scroll operation moves menu panels along the travel locuss connecting display positions P until a selected specific menu panel reaches the display position P0. A display screen is drawn with the virtual camera and menu panels are three-dimensionally displayed in rolls.By sliding a stylus pen on the LCD panel, the menu screen displayed on the LCD panel scrolls at a velocity corresponding to the drag velocity. When the stylus pen is released from the LCD panel, an application program corresponding to the menu display entity (crosshatched) is activated.

摘要翻译： 预定行驶轨迹设置在三维虚拟空间中。 显示菜单项的菜单面板沿着行进位置布置，假设显示位置被设置为本地原点，使得每个LCD面板的法线将面向虚拟相机。 根据与虚拟摄像机的距离，提高菜单面板的透明度。 滚动操作沿着连接显示位置P的行进位置移动菜单面板，直到所选择的特定菜单面板到达显示位置P0。 绘制虚拟相机的显示屏幕，菜单面板以三维显示。 通过在LCD面板上滑动触控笔，液晶显示屏上显示的菜单屏幕以对应于拖动速度的速度滚动。 当触控笔从LCD面板释放时，对应于菜单显示实体（交叉阴影线）的应用程序被激活。

公开(公告)号：US07695638B2

公开(公告)日：2010-04-13

申请号：US11739332

申请日：2007-04-24

申请人： Norikazu Nakamura ,  Masao Nakazawa ,  Hidekazu Miyamoto ,  Kenji Miyazawa ,  Manabu Saito

发明人： Norikazu Nakamura ,  Masao Nakazawa ,  Hidekazu Miyamoto ,  Kenji Miyazawa ,  Manabu Saito

IPC分类号： C23F1/02

CPC分类号： H05K3/0055 ,  B01J19/006 ,  B01J19/18 ,  B01J19/1825 ,  B01J2219/00038 ,  B01J2219/00162 ,  B01J2219/00768 ,  C01G45/1207 ,  C01P2006/80 ,  H05K2203/0796

摘要： In a reaction chamber (20), a used alkaline permanganate etching solution (12) is accommodated and an alkaline earth hydroxide (14) such as calcium hydroxide is added in the reaction chamber, a liquid inside of the reaction chamber is agitated, the liquid is exhausted from a side portion or a top portion of the reaction chamber through a filter (28), a precipitate (26) adhered to the filter is scraped off, and a precipitate containing a hardly soluble or insoluble matter incapable of passing through the filter and accumulated on a bottom portion of the reaction chamber is exhausted from the reaction chamber.

摘要翻译： 在反应室（20）中，容纳碱式高锰酸盐蚀刻溶液（12），在反应室中加入氢氧化钙等碱土金属氢氧化物（14），搅拌反应室内部的液体 通过过滤器（28）从反应室的侧部或顶部排出，刮去附着在过滤器上的沉淀物（26），并且含有难以溶解或不溶解的物质的沉淀物不能通过过滤器 并且积聚在反应室的底部的部分从反应室排出。

公开(公告)号：US07445965B2

公开(公告)日：2008-11-04

申请号：US11096058

申请日：2005-03-31

申请人： Masatoshi Akagawa ,  Masao Nakazawa ,  Hideto Nakazawa

发明人： Masatoshi Akagawa ,  Masao Nakazawa ,  Hideto Nakazawa

IPC分类号： H01L21/00

CPC分类号： H01L23/3736 ,  H01L21/4882 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/16152

摘要： A method of manufacturing a radiating plate using In as a thermal conducting bonding material 20 provided between a semiconductor device and a radiating plate 14 and serving to bond a back surface of the semiconductor device to the radiating plate, includes the steps of carrying out a cleaning treatment for cleaning a surface of the radiating plate 14, supplying the In to the radiating plate 14, heating and melting the In and hermetically adhering the In 18 to the radiating plate, thereby obtaining an In integral type radiating plate.

摘要翻译： 使用In制作作为设置在半导体器件与散热板14之间并用于将半导体器件的后表面粘合到散热板上的导热接合材料20的散热板的制造方法包括以下步骤： 用于清洁散热板14的表面的处理，将In供应到散热板14中，对In进行加热和熔化，并将In 18气密地粘附到散热板上，从而获得In积分型散热板。

公开(公告)号：US06755957B2

公开(公告)日：2004-06-29

申请号：US09772457

申请日：2001-01-30

申请人： Kenji Nakamura ,  Masao Nakazawa

发明人： Kenji Nakamura ,  Masao Nakazawa

IPC分类号： C25D502

CPC分类号： C25D7/123 ,  C25D5/18 ,  C25D5/34 ,  H05K3/423 ,  H05K3/4644 ,  H05K2201/09563 ,  Y10S205/917

摘要： A method of plating for filling via holes, in which each via hole is formed in an insulation layer covering a substrate so as to expose, at its bottom, part of a conductor layer located on the substrate. A copper film is formed on the top surface of the insulation layer covering the substrate, and the side walls and bottoms of the respective via holes. A strike plating of copper is provided on the copper film, and the substrate is immersed in an aqueous solution containing a plating promoter to thereby deposit the plating promoter on the surface of the copper strike. The plating promoter is removed from the copper strike plating located on the top surface insulation layer while leaving the plating promoter on the side walls and bottoms of the respective via holes. The substrate is subsequently electroplated with copper to fill the via holes.

摘要翻译： 一种用于填充通孔的电镀方法，其中每个通孔形成在覆盖基板的绝缘层中，以便在其底部暴露位于基板上的导体层的一部分。 在覆盖基板的绝缘层的顶表面和相应通孔的侧壁和底部上形成铜膜。 在铜膜上设置铜的触击电镀，将基板浸渍在含有电镀促进剂的水溶液中，从而在铜冲击的表面上沉积电镀促进剂。 电镀促进剂从位于顶表面绝缘层上的铜冲击镀层中除去，同时将电镀促进剂留在相应通孔的侧壁和底部。 随后用铜电镀衬底以填充通孔。

公开(公告)号：US5961565A

公开(公告)日：1999-10-05

申请号：US716710

申请日：1996-09-12

申请人： Taketoshi Kawabe ,  Osamu Isobe ,  Masao Nakazawa ,  Ikurou Notsu ,  Sadahiro Takahashi

发明人： Taketoshi Kawabe ,  Osamu Isobe ,  Masao Nakazawa ,  Ikurou Notsu ,  Sadahiro Takahashi

IPC分类号： B60K31/00 ,  B60K28/16 ,  F02D29/02 ,  F02D45/00

CPC分类号： B60K28/16 ,  B60K28/165

摘要： A drive torque of a vehicle drive wheel is controlled so that a slip ratio between the drive wheel and a road surface is equal to a target value. A determining function of which the sign varies when the slip ratio is equal to the target value, and a switching function comprising a time integral of the determining function, are set, and the drive torque target value is set such that it is directly proportional to the switching function. Alternatively, the drive torque target value is set based on the switching function which is set equal to the determining function and corrected based on an angular acceleration of the drive wheel.

摘要翻译： 控制车辆驱动轮的驱动扭矩，使得驱动轮和路面之间的滑移比等于目标值。 当滑移率等于目标值时，符号变化的确定功能，并且设置包括确定功能的时间积分的切换功能，并且将驱动转矩目标值设定为与 切换功能。 或者，基于设定为等于确定功能并根据驱动轮的角加速度进行校正的切换功能来设定驱动转矩目标值。

公开(公告)号：US5772289A

公开(公告)日：1998-06-30

申请号：US521536

申请日：1995-08-30

申请人： Masao Nakazawa ,  Osamu Isobe ,  Sadahiro Takahashi ,  Ikurou Notsu

发明人： Masao Nakazawa ,  Osamu Isobe ,  Sadahiro Takahashi ,  Ikurou Notsu

IPC分类号： B60T8/00 ,  B60T8/1766 ,  B60T8/18 ,  B60T8/26

CPC分类号： B60T8/18 ,  B60T8/00 ,  B60T8/1766 ,  B60T8/266

摘要： In an apparatus for controlling the braking force applied to the wheels of a vehicle, the braking force required for the vehicle is calculated according to a brake pedal depression amount and the weight of the vehicle. This braking force is allocated to the wheels, according to static loads acting on the wheels which vary according to the vehicle loading conditions. Alternatively, the forward/backward acceleration of the vehicle and sideway acceleration of the front and rear axles are detected, dynamic loads acting on the wheels are calculated from the static loads and these accelerations, and the braking force is allocated according to these dynamic loads. Preferably, the roll angles of the front and rear axles are respectively detected, and the detected sideways accelerations are corrected based on these angles. By way this braking force control, braking force can be optimized according to the loading conditions in commercial vehicles, such as trucks, where wheel load conditions largely vary.

摘要翻译： 在用于控制施加到车辆的车轮的制动力的装置中，根据制动踏板下压量和车辆的重量来计算车辆所需的制动力。 根据根据车辆载荷条件而变化的作用在车轮上的静载荷，该制动力被分配给车轮。 或者，检测车辆的前进/后退加速度和前桥和后桥的侧向加速度，根据静载荷和这些加速度计算作用在车轮上的动态载荷，并且根据这些动态载荷分配制动力。 优选地，分别检测前轴和后轴的滚动角度，并且基于这些角度来校正检测到的侧向加速度。 通过这种制动力控制，可以根据商用车辆（例如车辆负载条件很大变化的卡车）的负载条件来优化制动力。

公开(公告)号：US5656855A

公开(公告)日：1997-08-12

申请号：US463961

申请日：1995-06-05

申请人： Katsuya Fukase ,  Takahiro Iijima ,  Masao Nakazawa ,  Shinichi Wakabayashi

发明人： Katsuya Fukase ,  Takahiro Iijima ,  Masao Nakazawa ,  Shinichi Wakabayashi

IPC分类号： H01L23/50 ,  H01L21/48 ,  H01L23/495 ,  H05K3/20 ,  H05K3/34 ,  H01L23/48

CPC分类号： H01L21/4821 ,  H01L23/49534 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49582 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/181 ,  H05K3/20 ,  H05K3/202 ,  H05K3/205 ,  H05K3/3421

摘要： In a method for manufacturing a lead frame, a predetermined pattern is formed on a matrix 10 by a resist, an electro-deposition portion is provided in a cavity formed in the resist patterns 12, and the electro-deposition pattern 13 is separated from the matrix 10. The resist pattern is formed on the matrix 10 so that a cavity portion 17 connecting a plurality of cavity 16 ends for inner lead formation can be included in the resist pattern, and an electro-deposition portion is provided into the cavity portion 17 so that the electro-deposition pattern 13 can be formed into a configuration in which the tip ends of the inner leads 22 are connected by a connecting piece 21, and the electro-deposition pattern 13 is separated from the matrix 10 while the tip ends of the inner leads 22 are connected by the connecting piece 21.

摘要翻译： 在引线框架的制造方法中，通过抗蚀剂在矩阵10上形成预定图案，在形成于抗蚀剂图案12的空腔中设置电沉积部，并将电沉积图案13从 抗蚀剂图案形成在矩阵10上，使得连接多个腔16的端部用于内引线形成的空腔部分17可以包括在抗蚀剂图案中，并且电沉积部分被设置到空腔部分17中 使得电沉积图案13可以形成为通过连接片21连接内引线22的末端的结构，并且电沉积图案13与基体10分离，同时末端 内引线22由连接片21连接。

公开(公告)号：US20120064361A1

公开(公告)日：2012-03-15

申请号：US13228992

申请日：2011-09-09

申请人： Yoriyuki SUWA ,  Kenji Kawamura ,  Syuzo Aoki ,  Masao Nakazawa

发明人： Yoriyuki SUWA ,  Kenji Kawamura ,  Syuzo Aoki ,  Masao Nakazawa

IPC分类号： B32B3/26 ,  B05D1/36 ,  B32B15/00 ,  B05D5/00 ,  B82Y40/00 ,  B82Y30/00

CPC分类号： H01L23/373 ,  B32B15/01 ,  B82Y30/00 ,  C23C28/023 ,  H01L23/3733 ,  H01L23/3736 ,  H01L2924/0002 ,  Y10T428/12389 ,  H01L2924/00

摘要： A heat radiating component includes a base including a first metal, a first plating layer formed on the base and including a second metal and carbon material structures dispersed in the second metal, and a second plating layer formed on the first plating layer. The first plating layer includes protruding parts that are parts of the carbon material structures protruding from a surface of the second metal. The second plating layer is formed on the first plating layer to cover surfaces of the protruding parts and the surface of the second metal without filling spaces between the protruding parts.

摘要翻译： 散热部件包括：基体，包括第一金属，形成在基底上的第一镀层，并且包括分散在第二金属中的第二金属和碳材料结构;以及形成在第一镀层上的第二镀层。 第一镀层包括作为从第二金属的表面突出的碳材料结构的部分的突出部。 第二镀层形成在第一镀层上，以覆盖突出部分的表面和第二金属的表面，而不会在突出部分之间填充空间。

公开(公告)号：US07807560B2

公开(公告)日：2010-10-05

申请号：US12173985

申请日：2008-07-16

申请人： Kei Imafuji ,  Masao Nakazawa ,  Masaki Sanada ,  Sachiko Oda ,  Tadashi Kodaira ,  Kinji Nagata ,  Masaru Yamazaki ,  Kenjiro Enoki

发明人： Kei Imafuji ,  Masao Nakazawa ,  Masaki Sanada ,  Sachiko Oda ,  Tadashi Kodaira ,  Kinji Nagata ,  Masaru Yamazaki ,  Kenjiro Enoki

IPC分类号： H01L21/44

CPC分类号： H05K3/3478 ,  B23K1/0016 ,  B23K3/0623 ,  B23K2101/42 ,  H01L21/4853 ,  H01L23/481 ,  H01L2224/16 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H05K3/244 ,  H05K2203/041 ,  H05K2203/043 ,  H05K2203/124

摘要： A solder bump forming method of carrying out a reflow treatment over a conductive ball mounted on a plurality of pads, thereby forming a solder bump, includes a metal film forming step of forming a metal film capable of chemically reacting to a tackifying compound on the pads, an organic sticking layer forming step of causing a solution containing the tackifying compound to chemically react to the metal film, thereby forming an organic sticking layer on the metal film, and a conductive ball mounting step of supplying the conductive ball on the pads having the organic sticking layer formed thereon, thereby mounting the conductive ball on the pads through the metal film.

摘要翻译： 一种在安装在多个焊盘上的导电球上进行回流处理从而形成焊料凸块的焊料凸点形成方法包括形成能够与焊盘上的增粘化合物发生化学反应的金属膜的金属膜形成步骤 有机粘贴层形成步骤，使含有所述增粘化合物的溶液与所述金属膜发生化学反应，从而在所述金属膜上形成有机粘附层;以及导电性球安装步骤， 在其上形成有机粘附层，由此通过金属膜将导电球安装在焊盘上。