摘要:
A tantalum film capacitor has an .alpha.-tantalum as a lower electrode, a chemical conversion layer of .alpha.-tantalum as a dielectric and an upper electrode, an improvement involving forming a highly nitrogen-doped tantalum film between the .alpha.-tantalum and a substrate, and also, another improvement involving forming a transitional thin tantalum layer between said highly nitrogen-doped tantalum film and said .alpha.-tantalum. The nitrogen concentration of the highly nitrogen-doped tantalum film is from 14 to 30 atomic %. The electrical properties, especially leakage current, are improved over those of the prior art. A disadvantage of the conventional .alpha.-tantalum thin film capacitor, that is the necessity of using an expensive partial glazed Al.sub.2 O.sub.3 substrate, is eliminated, and a non-glazed Al.sub.2 O.sub.3 substrate can be used in the present invention.
摘要翻译:钽膜电容器具有作为下电极的α钽,作为电介质的α钽的化学转化层和上电极,涉及在α-钽和衬底之间形成高度氮掺杂钽膜的改进, 并且还涉及在所述高度氮掺杂钽膜和所述α-钽之间形成过渡薄钽层的另一改进。 高氮掺杂钽膜的氮浓度为14〜30原子%。 电性能,特别是漏电流,比现有技术的要好。 消除了常规α-钽薄膜电容器的缺点,即需要使用昂贵的部分釉面Al 2 O 3衬底,并且在本发明中可以使用非釉面Al 2 O 3衬底。
摘要:
A CVD apparatus comprising an optical unit detecting the mass of contaminants adhering to an inner surface of a CVD reactor by irradiating an inner surface of the reactor with light having monochromaticity through an optical window provided on an inner wall of the reactor and receiving its reflected light is provided.
摘要:
A method of forming an interconnect for a semiconductor device using triple hard layers, comprises: forming a first hard layer serving as an etch stop layer on a metal interconnect-formed dielectric layer; forming a second hard layer on the first hard layer; forming a dielectric layer on the second hard layer; forming a third hard layer on the dielectric layer; forming a hole through the third and second hard layers, the dielectric layer, and the first hard layer; and filling the hole with metal to establish an interconnect. The second and third hard layers are each made of carbon-doped silicon oxide formed from a source gas and a redox gas, while controlling the carbon content in the second hard layer as a function of a flow rate of the redox gas.
摘要:
A base plate of a stainless-steel body material formed by pressing is polished and cleared of burrs by means of an abrasive material that consists mainly of Fe2O3 in a polishing process. The polished base plate is heated to a heat treatment temperature for solid solution in a reducing atmosphere in a heat treatment process. In this heat treatment process, an oxide in the constituents of minute fragments of the abrasive material in the surface of the body material of the base plate is reduced to leave iron, which is dispersed into the body material.
摘要翻译:通过压制形成的不锈钢主体材料的基板通过在抛光工艺中主要由Fe 2 O 3组成的研磨材料抛光和清除毛刺。 在热处理工序中将抛光后的基板加热至还原气氛中的固溶体的热处理温度。 在该热处理工序中,基板的主体材料表面的研磨材料的微小碎片成分中的氧化物被还原,留下分散在主体材料中的铁。
摘要:
Provided herein is a method for cleaning CVD reaction chambers with active oxygen species. The active oxygen species may also be mixed with active fluorine species. The active oxygen species are products of a plasma, which may be either generated within the CVD reaction chamber or generated remotely and introduced into the CVD reaction chamber.
摘要:
A substrate-supporting apparatus, wherein a substrate is not warped or distorted and a film with uniform thickness is formed, is a semiconductor substrate-supporting apparatus which supports and heats semiconductor substrates inside a vacuum-pumped reaction chamber. On the substrate-supporting surface of the semiconductor substrate-supporting apparatus, a concave portion which includes a depression slanting from the peripheral portion to the center is provided, the semiconductor substrate is supported in a position where the peripheral portion of the back surface of the substrate contacts the slanting surface of the concave portion, and the concave portion is formed so that an interval between the center of the concave portion and the semiconductor substrate becomes the designated distance. The slanting surface of the concave portion may include a portion of a spherical surface or a conical surface.
摘要:
A system for mounting a hard disk enclosure (HDE), includes a casing pivotably mounted to minimize at least one of settle-out dynamics, external rotational vibration, and emitted vibration, the casing allowing the HDE to rotate substantially freely, wherein the center of gravity of the HDE is substantially the same as a pivot point of the casing. Further, a computer chassis includes a housing, at least one disk drive assembly for being housed by the housing, and a plurality of theta-mounts integrally built within the housing.
摘要:
An arrangement structure of the printed circuit board and the interface cable connector of a magnetic disk drive for increasing the degree of freedom of the arrangement of a spindle motor, and for minimizing the size of a printed circuit board. An interface cable connector is disposed on the side opposite to the spindle motor, and the printed circuit board is sized so as not to contact with the spindle motor in the height direction. This allows the degree of freedom of the arrangement of the spindle motor to increase. Further, the distance between the interface cable connector and the preamplifier connector on the printed circuit board is short. Thus, the size of the printed circuit board can be made as small as possible.
摘要:
A disk drive and a control method for the disk drive to reduce the number of unnecessary write inhibition operations. A microprocessor unit (MPU) 6 sets an allowable value Cv for the velocity of a magnetic head 1 to V0 until the head passes over N1 sectors after completion of a seek operation, Cv to V1 until the head passes over N2 sectors after passage of N1 sectors, and Cv to V2 after passage of N2 sectors. (N1
摘要:
A suspension for a read/write head of a disk drive is fixed to a side wall of an arm. If two heads are to be suspended, a first suspension for one head and a second suspension for the other head are fixed to opposite side walls of the arm. Since the suspension is fixed to the side wall of the arm, there are no screw heads protruding or projections formed by hot staking on the top and the bottom surfaces of the arm and it is not necessary to make screw holes which extend from the top surface or the bottom surface into the arm perpendicularly to these surfaces. Thus, the vertical thickness of the head carriage assembly can be decreased.